-
公开(公告)号：US10149391B2
公开(公告)日：2018-12-04
申请号：US15064440
申请日：2016-03-08
Applicant: uBeam Inc.
Inventor： Nicholas Lavada Nemeth , Adam Stephen Elhadad , Andrew Joyce , Sean Taffler
IPC: H05K3/00 , H05K3/40 , B23K26/06 , B23K26/38 , B23K26/402 , B23K26/364 , B23K103/16
Abstract: Systems and techniques are provided for trench cutting with laser machining. A laminate material including a conductive layer and a non-conductive layer may be cut with a first cut using a UV-laser. The cutting of a second cut, using the UV-laser, may be started at a top electrode of the non-conductive layer based on the location of the first cut, wherein the second cut is wider than the first cut. The cutting of the second cut may be stopped partially though the non-conductive layer. The stopping of the cutting of the second cut partially though the non-conductive layer may include stopping the cutting of the second cut before cutting a bottom electrode of the non-conductive layer.
-
公开(公告)号：US10058892B2
公开(公告)日：2018-08-28
申请号：US15077734
申请日：2016-03-22
Applicant: uBeam Inc.
Inventor： Andrew Joyce , Sean Taffler , Paul Reynolds , Nicholas Lavada Nemeth , Adam Stephen Elhadad
CPC classification number: B06B1/0666 , F16B11/006
Abstract: Systems and techniques are provided for membrane bonding. A bonding agent may be applied to one or both of an ultrasonic device and membrane. The membrane may be placed on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent. The membrane and the ultrasonic device may be placed in between a first flat plate and a second flat plate, such that the second flat plate rests on top of the membrane. Light pressure may be applied to the membrane. The light pressure may be applied by one or more of the weight of the second flat plate and a pressure providing device applying pressure to either or both of the first flat plate and the second flat plate.
-
公开(公告)号：US20170015091A1
公开(公告)日：2017-01-19
申请号：US15068455
申请日：2016-03-11
Applicant: uBeam Inc.
Inventor： Andrew Joyce , Paul Reynolds , Sean Taffler , Nicholas Lavada Nemeth , Adam Stephen Elhadad
CPC classification number: B32B37/12 , B32B37/10 , B32B2037/1253 , B32B2307/202 , B32B2309/02 , B32B2309/027 , B32B2457/00
Abstract: Systems and techniques are provided for laminate material bonding. A bonding agent may be applied to a first layer. A second layer may be placed onto the bonding agent on the first layer to form a laminate material. The laminate material may be placed between a first piece of non-compliant material with a first piece of compliant material and a second piece of non-compliant material with a second piece of compliant material. The laminate material may be in contact with the first piece non-compliant material and the second piece of non-compliant material. Pressure may be applied to the laminate material by applying pressure to the first piece of compliant material for a curing time of the bonding agent.
Abstract translation: 为层压材料粘合提供了系统和技术。 粘合剂可以施加到第一层。 可以将第二层置于第一层上的粘合剂上以形成层压材料。 层压材料可以放置在第一片不顺应性材料与第一片顺应性材料之间，第二片不顺应材料与第二片顺应性材料。 层压材料可以与第一块非柔性材料和第二块不顺应材料接触。 可以通过向第一块柔性材料施加压力以对粘合剂的固化时间施加压力。
-
公开(公告)号：US10065854B2
公开(公告)日：2018-09-04
申请号：US15154900
申请日：2016-05-13
Applicant: uBeam Inc.
Inventor： Andrew Joyce , Sean Taffler , Paul Reynolds , Nicholas Lavada Nemeth , Adam Stephen Elhadad , Boozarjomehr Faraji
Abstract: Systems and techniques are provided for membrane bonding. A photoresist may be applied to an ultrasonic device. A portion of the photoresist may be removed. A bonding agent may be applied a portion of the photoresist that is not removed. A membrane may be placed on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent and the photoresist. The membrane and the ultrasonic device may be placed in between a first flat plate and a second flat plate, such that the second flat plate rests on top of the membrane. Light pressure may be applied to the membrane. The light pressure may be applied by one or more of the weight of the second flat plate and a pressure providing device applying pressure to either or both of the first flat plate and the second flat plate.
-
公开(公告)号：US20180072035A1
公开(公告)日：2018-03-15
申请号：US15818257
申请日：2017-11-20
Applicant: uBeam Inc.
Inventor： Andrew Joyce , Paul Reynolds , Sean Taffler , Nicholas Lavada Nemeth , Adam Stephen Elhadad
IPC: B32B37/12
CPC classification number: B32B37/12 , B32B37/10 , B32B2037/1253 , B32B2307/202 , B32B2309/02 , B32B2309/027 , B32B2457/00
Abstract: Systems and techniques are provided for laminate material bonding. A bonding agent may be applied to a first layer. A second layer may be placed onto the bonding agent on the first layer to form a laminate material. The laminate material may be placed between a first piece of non-compliant material with a first piece of compliant material and a second piece of non-compliant material with a second piece of compliant material. The laminate material may be in contact with the first piece non-compliant material and the second piece of non-compliant material. Pressure may be applied to the laminate material by applying pressure to the first piece of compliant material for a curing time of the bonding agent.
-
Patent Agency Ranking
公开(公告)号：US09821541B2
公开(公告)日：2017-11-21
申请号：US15068455
申请日：2016-03-11
Applicant: uBeam Inc.
Inventor： Andrew Joyce , Paul Reynolds , Sean Taffler , Nicholas Lavada Nemeth , Adam Stephen Elhadad
CPC classification number: B32B37/12 , B32B37/10 , B32B2037/1253 , B32B2307/202 , B32B2309/02 , B32B2309/027 , B32B2457/00
Abstract: Systems and techniques are provided for laminate material bonding. A bonding agent may be applied to a first layer. A second layer may be placed onto the bonding agent on the first layer to form a laminate material. The laminate material may be placed between a first piece of non-compliant material with a first piece of compliant material and a second piece of non-compliant material with a second piece of compliant material. The laminate material may be in contact with the first piece non-compliant material and the second piece of non-compliant material. Pressure may be applied to the laminate material by applying pressure to the first piece of compliant material for a curing time of the bonding agent.
-
公开(公告)号：US10322570B2
公开(公告)日：2019-06-18
申请号：US15818257
申请日：2017-11-20
Applicant: uBeam Inc.
Inventor： Andrew Joyce , Paul Reynolds , Sean Taffler , Nicholas Lavada Nemeth , Adam Stephen Elhadad
Abstract: Systems and techniques are provided for laminate material bonding. A bonding agent may be applied to a first layer. A second layer may be placed onto the bonding agent on the first layer to form a laminate material. The laminate material may be placed between a first piece of non-compliant material with a first piece of compliant material and a second piece of non-compliant material with a second piece of compliant material. The laminate material may be in contact with the first piece non-compliant material and the second piece of non-compliant material. Pressure may be applied to the laminate material by applying pressure to the first piece of compliant material for a curing time of the bonding agent.
-
公开(公告)号：US20170265308A1
公开(公告)日：2017-09-14
申请号：US15064440
申请日：2016-03-08
Applicant: uBeam Inc.
Inventor： Nicholas Lavada Nemeth , Adam Stephen Elhadad , Andrew Joyce , Sean Taffler
IPC: H05K3/00 , H05K3/40 , B23K26/38 , B23K26/402 , B23K26/06 , B23K26/364
CPC classification number: H05K3/0026 , B23K26/364 , B23K26/38 , B23K26/402 , B23K2103/172 , H05K3/0052 , H05K2201/09845 , H05K2203/0346 , H05K2203/107
Abstract: Systems and techniques are provided for trench cutting with laser machining. A laminate material including a conductive layer and a non-conductive layer may be cut with a first cut using a UV-laser. The cutting of a second cut, using the UV-laser, may be started at a top electrode of the non-conductive layer based on the location of the first cut, wherein the second cut is wider than the first cut. The cutting of the second cut may be stopped partially though the non-conductive layer. The stopping of the cutting of the second cut partially though the non-conductive layer may include stopping the cutting of the second cut before cutting a bottom electrode of the non-conductive layer.
-
公开(公告)号：US10252908B2
公开(公告)日：2019-04-09
申请号：US15902570
申请日：2018-02-22
Applicant: UBEAM INC.
Inventor： Andrew Joyce , Sean Taffler , Paul Reynolds , Nicholas Lavada Nemeth , Adam Stephen Elhadad , Boozarjomehr Faraji
Abstract: Systems and techniques are provided for membrane bonding. A photoresist may be applied to an ultrasonic device. A portion of the photoresist may be removed. A bonding agent may be applied a portion of the photoresist that is not removed. A membrane may be placed on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent and the photoresist. The membrane and the ultrasonic device may be placed in between a first flat plate and a second flat plate, such that the second flat plate rests on top of the membrane. Light pressure may be applied to the membrane. The light pressure may be applied by one or more of the weight of the second flat plate and a pressure providing device applying pressure to either or both of the first flat plate and the second flat plate.
-
公开(公告)号：US20180179053A1
公开(公告)日：2018-06-28
申请号：US15902570
申请日：2018-02-22
Applicant: UBEAM INC.
Inventor： Andrew Joyce , Sean Taffler , Paul Reynolds , Nicholas Lavada Nemeth , Adam Stephen Elhadad , Boozarjomehr Faraji
CPC classification number: B81C1/00182 , B81B2201/0271 , B81B2201/032 , B81B2203/0127 , B81C2203/032 , F16B11/006 , G03F7/00 , H01L21/00
Abstract: Systems and techniques are provided for membrane bonding. A photoresist may be applied to an ultrasonic device. A portion of the photoresist may be removed. A bonding agent may be applied a portion of the photoresist that is not removed. A membrane may be placed on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent and the photoresist. The membrane and the ultrasonic device may be placed in between a first flat plate and a second flat plate, such that the second flat plate rests on top of the membrane. Light pressure may be applied to the membrane. The light pressure may be applied by one or more of the weight of the second flat plate and a pressure providing device applying pressure to either or both of the first flat plate and the second flat plate.
-
-
-
-
-
-
-
-
-
Search Results
12
records
(took 0.01 seconds)
