公开(公告)号：US09860978B1

公开(公告)日：2018-01-02

申请号：US15458047

申请日：2017-03-14

Applicant: UNIFLEX Technology Inc.

Inventor： Yi-Chun Liu ,  Pei-Hao Hung ,  Ying-Hsing Chen ,  Chiu-Pei Huang ,  Min-Ming Tsai ,  Shan-Yi Tseng ,  Yuan-Chih Lee

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K1/05

CPC classification number: H05K1/0281 ,  H05K1/0277 ,  H05K1/0306 ,  H05K1/05 ,  H05K1/115 ,  H05K3/4691 ,  H05K2201/041

Abstract: A rigid-flex board structure includes a flexible printed circuit (FPC) board, a substrate, a reinforcing layer, a patterned circuit layer and a plurality of conductive vias. The FPC board includes at least one exposing area. The substrate is disposed on the FPC board and includes an opening exposing the exposing area. The reinforcing layer is embedded in the substrate and a rigidity of a material of the reinforcing layer is greater than a rigidity of a material of the substrate. The patterned circuit layer is disposed on the substrate. The conductive vias are configured to electrically connect the patterned circuit layer and the FPC board.

公开(公告)号：US10104778B2

公开(公告)日：2018-10-16

申请号：US15438634

申请日：2017-02-21

Applicant: UNIFLEX Technology Inc.

Inventor： Yi-Chun Liu ,  Pei-Hao Hung ,  Wen-Chien Hsu ,  Meng-Huan Chia ,  Min-Ming Tsai ,  Shan-Yi Tseng ,  Yuan-Chih Lee

IPC: H05K1/18 ,  H05K1/02

Abstract: A flexible printed circuit board structure includes a spiral flexible printed circuit board and a protection cover capable of providing functions of extensibility and retractility. The spiral flexible printed circuit board includes a flexible substrate curling up spirally, a patterned circuit layer and a plurality of electrical contacts. The patterned circuit layer is disposed on the flexible substrate. The electrical contacts are disposed on an end of the flexible substrate and electrically connected to the patterned circuit layer. The protection cover at least covers a part of the spiral flexible printed circuit board.

公开(公告)号：US20180146552A1

公开(公告)日：2018-05-24

申请号：US15438634

申请日：2017-02-21

Applicant: UNIFLEX Technology Inc.

Inventor： Yi-Chun Liu ,  Pei-Hao Hung ,  Wen-Chien Hsu ,  Meng-Huan Chia ,  Min-Ming Tsai ,  Shan-Yi Tseng ,  Yuan-Chih Lee

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/189 ,  H05K1/028 ,  H05K2201/10106 ,  H05K2201/10151

Abstract: A flexible printed circuit board structure includes a spiral flexible printed circuit board and a protection cover capable of providing functions of extensibility and retractility. The spiral flexible printed circuit board includes a flexible substrate curling up spirally, a patterned circuit layer and a plurality of electrical contacts. The patterned circuit layer is disposed on the flexible substrate. The electrical contacts are disposed on an end of the flexible substrate and electrically connected to the patterned circuit layer. The protection cover at least covers a part of the spiral flexible printed circuit board.