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Patent Agency Ranking
公开(公告)号：US20170156205A1
公开(公告)日：2017-06-01
申请号：US15284510
申请日：2016-10-03
Applicant: UNIFLEX Technology Inc.
Inventor： Yi-Chun Liu , Chiu-Pei Huang , Pei-Hao Hung , Yuan-Chih Lee
CPC classification number: H05K1/0278 , H05K1/115 , H05K3/064 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4652 , H05K3/4664 , H05K3/4691 , H05K2201/0195 , H05K2201/09127 , H05K2201/09509 , H05K2201/09545 , H05K2203/0502
Abstract: A rigid-flex circuit board includes a flexible circuit board, a plurality of patterned photo-imageable substrates and a plurality of patterned circuit layers. The flexible circuit board includes a plurality of exposed regions, a top surface and a bottom surface opposite to the top surface. The exposed regions are respectively located at the top surface and the bottom surface. The patterned photo-imageable substrates are disposed on the top surface and the bottom surface respectively. Each patterned photo-imageable substrate includes an opening exposing the corresponding exposed region. Each patterned photo-imageable substrate includes photo-sensitive material. The patterned circuit layers are disposed on the patterned photo-imageable substrates respectively and expose the exposed regions. A manufacturing method of the rigid-flex circuit board is also provided.
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公开(公告)号：US09860978B1
公开(公告)日：2018-01-02
申请号：US15458047
申请日：2017-03-14
Applicant: UNIFLEX Technology Inc.
Inventor： Yi-Chun Liu , Pei-Hao Hung , Ying-Hsing Chen , Chiu-Pei Huang , Min-Ming Tsai , Shan-Yi Tseng , Yuan-Chih Lee
CPC classification number: H05K1/0281 , H05K1/0277 , H05K1/0306 , H05K1/05 , H05K1/115 , H05K3/4691 , H05K2201/041
Abstract: A rigid-flex board structure includes a flexible printed circuit (FPC) board, a substrate, a reinforcing layer, a patterned circuit layer and a plurality of conductive vias. The FPC board includes at least one exposing area. The substrate is disposed on the FPC board and includes an opening exposing the exposing area. The reinforcing layer is embedded in the substrate and a rigidity of a material of the reinforcing layer is greater than a rigidity of a material of the substrate. The patterned circuit layer is disposed on the substrate. The conductive vias are configured to electrically connect the patterned circuit layer and the FPC board.
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公开(公告)号：US09844131B2
公开(公告)日：2017-12-12
申请号：US15284510
申请日：2016-10-03
Applicant: UNIFLEX Technology Inc.
Inventor： Yi-Chun Liu , Chiu-Pei Huang , Pei-Hao Hung , Yuan-Chih Lee
CPC classification number: H05K1/0278 , H05K1/115 , H05K3/064 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4652 , H05K3/4664 , H05K3/4691 , H05K2201/0195 , H05K2201/09127 , H05K2201/09509 , H05K2201/09545 , H05K2203/0502
Abstract: A rigid-flex circuit board includes a flexible circuit board, a plurality of patterned photo-imageable substrates and a plurality of patterned circuit layers. The flexible circuit board includes a plurality of exposed regions, a top surface and a bottom surface opposite to the top surface. The exposed regions are respectively located at the top surface and the bottom surface. The patterned photo-imageable substrates are disposed on the top surface and the bottom surface respectively. Each patterned photo-imageable substrate includes an opening exposing the corresponding exposed region. Each patterned photo-imageable substrate includes photo-sensitive material. The patterned circuit layers are disposed on the patterned photo-imageable substrates respectively and expose the exposed regions. A manufacturing method of the rigid-flex circuit board is also provided.
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公开(公告)号：US10104778B2
公开(公告)日：2018-10-16
申请号：US15438634
申请日：2017-02-21
Applicant: UNIFLEX Technology Inc.
Inventor： Yi-Chun Liu , Pei-Hao Hung , Wen-Chien Hsu , Meng-Huan Chia , Min-Ming Tsai , Shan-Yi Tseng , Yuan-Chih Lee
Abstract: A flexible printed circuit board structure includes a spiral flexible printed circuit board and a protection cover capable of providing functions of extensibility and retractility. The spiral flexible printed circuit board includes a flexible substrate curling up spirally, a patterned circuit layer and a plurality of electrical contacts. The patterned circuit layer is disposed on the flexible substrate. The electrical contacts are disposed on an end of the flexible substrate and electrically connected to the patterned circuit layer. The protection cover at least covers a part of the spiral flexible printed circuit board.
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公开(公告)号：US20180146552A1
公开(公告)日：2018-05-24
申请号：US15438634
申请日：2017-02-21
Applicant: UNIFLEX Technology Inc.
Inventor： Yi-Chun Liu , Pei-Hao Hung , Wen-Chien Hsu , Meng-Huan Chia , Min-Ming Tsai , Shan-Yi Tseng , Yuan-Chih Lee
CPC classification number: H05K1/189 , H05K1/028 , H05K2201/10106 , H05K2201/10151
Abstract: A flexible printed circuit board structure includes a spiral flexible printed circuit board and a protection cover capable of providing functions of extensibility and retractility. The spiral flexible printed circuit board includes a flexible substrate curling up spirally, a patterned circuit layer and a plurality of electrical contacts. The patterned circuit layer is disposed on the flexible substrate. The electrical contacts are disposed on an end of the flexible substrate and electrically connected to the patterned circuit layer. The protection cover at least covers a part of the spiral flexible printed circuit board.
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