公开(公告)号：US20220022311A1

公开(公告)日：2022-01-20

申请号：US17009720

申请日：2020-09-01

Applicant: Unimicron Technology Corp.

Inventor： Yu-Shen Chen

IPC: H05K1/02 ,  H01L23/498 ,  H01L23/367 ,  H01L21/48

Abstract: An embedded component structure includes a circuit board, a chip, and a heat dissipation element. The chip is embedded in the circuit board. The heat dissipation element surrounds the chip. The chip, the circuit board, and the heat dissipation element are electrically connected. The heat dissipation element includes a first part, a second part, and a third part located between the first part and the second part. The first part is in direct contact with a side wall of the chip. The second part is a ground terminal. A method for manufacturing an embedded component structure is also provided.

公开(公告)号：US20230058180A1

公开(公告)日：2023-02-23

申请号：US17505686

申请日：2021-10-20

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Yu-Shen Chen ,  Chung-Yu Lan

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/32 ,  H05K3/02 ,  H05K3/42

Abstract: A substrate is manufactured by drilling a chip containing groove in a composite inner layer circuit structure, having a component connecting end of a circuit layer protruding from a mounting side wall in the chip containing groove, mounting a chip component in the chip containing groove, and connecting the surface bonding pad to the component connecting end. The chip component in the present invention penetrates at least two circuit layers, and the surface bonding pad is bonded to the component connecting end of the circuit layer directly, reducing the occupied area of the chip component in each one of the circuit layers, and increasing the area for circuit disposing and the possible amount of chip components that may be mounted in the substrate.

公开(公告)号：US11470715B2

公开(公告)日：2022-10-11

申请号：US17009720

申请日：2020-09-01

Applicant: Unimicron Technology Corp.

Inventor： Yu-Shen Chen

IPC: H01L23/498 ,  H05K1/02 ,  H01L21/48 ,  H01L23/367

Abstract: An embedded component structure includes a circuit board, a chip, and a heat dissipation element. The chip is embedded in the circuit board. The heat dissipation element surrounds the chip. The chip, the circuit board, and the heat dissipation element are electrically connected. The heat dissipation element includes a first part, a second part, and a third part located between the first part and the second part. The first part is in direct contact with a side wall of the chip. The second part is a ground terminal. A method for manufacturing an embedded component structure is also provided.

公开(公告)号：US11670520B2

公开(公告)日：2023-06-06

申请号：US17523093

申请日：2021-11-10

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Jia Shiang Chen ,  Chung-Yu Lan ,  Yu-Shen Chen

IPC: H01L21/00 ,  H01L21/48 ,  H01L23/538 ,  H01L23/498 ,  H05K1/18 ,  H01L25/065

CPC classification number: H01L21/486 ,  H01L23/49805 ,  H01L23/5384 ,  H01L25/0657 ,  H05K1/182 ,  H05K1/186 ,  H01L2225/06517 ,  H01L2225/06572

Abstract: A packaging method includes steps of: forming first and second wiring layers electrically connected to each other on two opposite surfaces of a substrate; then configuring mother substrate interconnecting bumps on the first wiring layer and along perimeter of a daughter substrate unit, and then cutting along the perimeter of the daughter substrate unit to expose lateral faces of the mother substrate interconnecting bumps and configuring solder materials thereon; then configuring first and second chips on the first and the second wiring layers to form electrical interconnection between the two chips. A package structure enables interconnecting two chips through one single daughter substrate unit with its wiring layers directly connecting with lateral face contacts of the mother carrier substrate through the mother substrate interconnecting bumps. Hence, area of the daughter substrate unit is reduced; lengths of the interconnection paths are shortened, and qualities of communication and space utilization are enhanced.

公开(公告)号：US20220408547A1

公开(公告)日：2022-12-22

申请号：US17896053

申请日：2022-08-25

Applicant: Unimicron Technology Corp.

Inventor： Yu-Shen Chen

IPC: H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H01L23/367

Abstract: A method for manufacturing an embedded component structure includes providing a circuit board having a through hole and a heat dissipation layer; disposing a chip in the through hole; forming a dielectric layer on a first surface and a second surface of the circuit board to seal the chip and cover a lower surface of the heat dissipation layer; removing a first part of the dielectric layer to form a first opening from which a upper surface of the heat dissipation layer is exposed and a second opening from which the lower surface of the heat dissipation layer is exposed; and forming a thermal conductive material layer in the first and the second opening to form a heat dissipation element surrounding the chip. The upper surface of the heat dissipation layer is exposed from the through hole. The chip, the circuit board, and the heat dissipation element are electrically connected.

公开(公告)号：US11523505B2

公开(公告)日：2022-12-06

申请号：US17406115

申请日：2021-08-19

Applicant: Unimicron Technology Corp.

Inventor： Yu-Shen Chen ,  I-Ta Tsai ,  Chien-Chih Chen

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.

公开(公告)号：US20220022317A1

公开(公告)日：2022-01-20

申请号：US17406115

申请日：2021-08-19

Applicant: Unimicron Technology Corp.

Inventor： Yu-Shen Chen ,  I-Ta Tsai ,  Chien-Chih Chen

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/40 ,  H05K1/18

Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.

公开(公告)号：US11792939B2

公开(公告)日：2023-10-17

申请号：US17505686

申请日：2021-10-20

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Yu-Shen Chen ,  Chung-Yu Lan

IPC: H05K1/02 ,  H05K3/02 ,  H01L23/13 ,  H01L23/485 ,  H05K1/18 ,  H05K3/32 ,  H05K3/42 ,  H05K3/00

CPC classification number: H05K1/186 ,  H05K1/0218 ,  H05K3/02 ,  H05K3/328 ,  H05K3/421 ,  H05K3/0047 ,  H05K2201/0723 ,  H05K2201/10454 ,  H05K2201/10636 ,  H05K2203/0285 ,  H05K2203/0292 ,  H05K2203/0723

Abstract: A substrate is manufactured by drilling a chip containing groove in a composite inner layer circuit structure, having a component connecting end of a circuit layer protruding from a mounting side wall in the chip containing groove, mounting a chip component in the chip containing groove, and connecting the surface bonding pad to the component connecting end. The chip component in the present invention penetrates at least two circuit layers, and the surface bonding pad is bonded to the component connecting end of the circuit layer directly, reducing the occupied area of the chip component in each one of the circuit layers, and increasing the area for circuit disposing and the possible amount of chip components that may be mounted in the substrate.

公开(公告)号：US11134567B1

公开(公告)日：2021-09-28

申请号：US17009790

申请日：2020-09-02

Applicant: Unimicron Technology Corp.

Inventor： Yu-Shen Chen ,  I-Ta Tsai ,  Chien-Chih Chen

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/46 ,  H05K1/18

Abstract: An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.