Layout pattern for 8T-SRAM and the manufacturing method thereof
    3.
    发明授权
    Layout pattern for 8T-SRAM and the manufacturing method thereof 有权
    8T-SRAM的布局图及其制造方法

    公开(公告)号:US09401366B1

    公开(公告)日:2016-07-26

    申请号:US14792636

    申请日:2015-07-07

    Abstract: The present invention provides a layout pattern of an 8-transistor static random access memory (8T-SRAM), at least including a first diffusion region, a second diffusion region and a third diffusion region disposed on a substrate, a critical dimension region being disposed between the first diffusion region and the third diffusion region. The critical dimension region directly contacts the first diffusion region and the third diffusion region, a first extra diffusion region, a second extra diffusion region and a third extra diffusion region disposed surrounding and directly contacting the first diffusion region, the second diffusion region and the third diffusion region respectively. The first, the second and the third extra diffusion region are not disposed within the critical dimension region.

    Abstract translation: 本发明提供了至少包括第一扩散区域,第二扩散区域和设置在衬底上的第三扩散区域的8-晶体管静态随机存取存储器(8T-SRAM)的布局图案,设置临界尺寸区域 在第一扩散区域和第三扩散区域之间。 临界尺寸区域直接接触第一扩散区域和第三扩散区域,第一额外扩散区域,第二额外扩散区域和设置在第一扩散区域,第二扩散区域和第三扩散区域周围并直接接触的第三额外扩散区域 扩散区。 第一,第二和第三附加扩散区域不设置在临界尺寸区域内。

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