公开(公告)号：US10016843B2

公开(公告)日：2018-07-10

申请号：US15064634

申请日：2016-03-09

Applicant: Ultratech, Inc.

Inventor： Yun Wang

IPC: H01S3/00 ,  H01L21/268 ,  H01L21/324 ,  H01L21/67 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/00 ,  B23K26/073 ,  B23K26/082 ,  B23K26/352 ,  B23K26/066 ,  B23K101/40 ,  B23K103/00

CPC classification number: B23K26/0622 ,  B23K26/0006 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/066 ,  B23K26/0738 ,  B23K26/082 ,  B23K26/352 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/56 ,  H01L21/268 ,  H01L21/324 ,  H01S3/0071 ,  H01S3/0085

Abstract: Systems and methods for reducing pulsed laser beam profile non-uniformities for laser annealing are disclosed. The methods include directing an initial pulsed laser beam along an optical axis, and imparting to each light pulse a time-varying angular deflection relative to the optical axis. This forms a new laser beam wherein each light pulse is smeared out over an amount of spatial deflection δ sufficient to reduce the micro-scale intensity variations in the laser beam. The new laser beam is then used to form the line image, which has better intensity uniformity as compared using the initial laser beam to form the line image.

公开(公告)号：US20130273751A1

公开(公告)日：2013-10-17

申请号：US13913045

申请日：2013-06-07

Applicant: Ultratech, Inc.

Inventor： Yun Wang ,  Shaoyin Chen

IPC: H01L21/263

CPC classification number: H01L21/263 ,  B23K26/0006 ,  B23K26/082 ,  B23K26/0823 ,  B23K26/352 ,  B23K2103/56 ,  C30B1/06 ,  H01L21/02532 ,  H01L21/02675 ,  H01L21/02691

Abstract: Provided are systems and methods for processing the surface of substrates that scan a laser beam at one or more selected orientation angles. The orientation angle or angles may be selected to reduce substrate warpage. When the substrates are semiconductor wafers having microelectronic devices, the orientation angles may be selected to produce controlled strain and to improve electronic performance of the devices.

Abstract translation: 提供了用于处理以一个或多个选定取向角度扫描激光束的基板表面的系统和方法。 可以选择取向角或角度以减少基板翘曲。 当衬底是具有微电子器件的半导体晶片时，可以选择取向角以产生受控应变并改善器件的电子性能。

公开(公告)号：US20160240440A1

公开(公告)日：2016-08-18

申请号：US15141783

申请日：2016-04-28

Applicant: Ultratech, Inc.

Inventor： Arthur W. Zafiropoulo ,  Yun Wang ,  Andrew M. Hawryluk

IPC: H01L21/822 ,  H01L27/06 ,  H01L21/02

CPC classification number: H01L21/8221 ,  H01L21/02532 ,  H01L21/02645 ,  H01L21/02678 ,  H01L27/0688 ,  Y10T29/53174 ,  Y10T117/1024

Abstract: Provided are systems and processes for forming a three-dimensional circuit on a substrate. A radiation source produces a beam that is directed at a substrate having an isolating layer interposed between circuit layers. The circuit layers communicate with each other via a seed region exhibiting a crystalline surface. At least one circuit layer has an initial microstructure that exhibits electronic properties unsuitable for forming circuit features therein. After being controllably heat treated, the initial microstructure of the circuit layer having unsuitable properties is transformed into one that exhibits electronic properties suitable for forming circuit feature therein. Also provided are three-dimensional circuit structures optionally formed by the inventive systems and/or processes.

Abstract translation: 提供了在基板上形成三维电路的系统和工艺。 辐射源产生被引导到衬底上的光束，该衬底具有介于电路层之间的隔离层。 电路层通过呈现结晶表面的种子区域相互连通。 至少一个电路层具有显示不适于在其中形成电路特征的电子性质的初始微结构。 在可控地热处理之后，具有不合适特性的电路层的初始微结构被转化成具有适于形成电路特性的电子特性的微结构。 还提供了可选地由本发明的系统和/或过程形成的三维电路结构。

公开(公告)号：US09401277B2

公开(公告)日：2016-07-26

申请号：US13913045

申请日：2013-06-07

Applicant: Ultratech, Inc.

Inventor： Yun Wang ,  Shaoyin Chen

IPC: B23K26/00 ,  H01L21/263 ,  B23K26/08 ,  C30B1/06 ,  H01L21/02

CPC classification number: H01L21/263 ,  B23K26/0006 ,  B23K26/082 ,  B23K26/0823 ,  B23K26/352 ,  B23K2103/56 ,  C30B1/06 ,  H01L21/02532 ,  H01L21/02675 ,  H01L21/02691

Abstract: Provided are systems and methods for processing the surface of substrates that scan a laser beam at one or more selected orientation angles. The orientation angle or angles may be selected to reduce substrate warpage. When the substrates are semiconductor wafers having microelectronic devices, the orientation angles may be selected to produce controlled strain and to improve electronic performance of the devices.

公开(公告)号：US20160276184A1

公开(公告)日：2016-09-22

申请号：US15064634

申请日：2016-03-09

Applicant: Ultratech, Inc.

Inventor： Yun Wang

IPC: H01L21/67 ,  B23K26/0622 ,  H01S3/00 ,  B23K26/06 ,  H01L21/324 ,  H01L21/268

CPC classification number: B23K26/0622 ,  B23K26/0006 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/066 ,  B23K26/0738 ,  B23K26/082 ,  B23K26/352 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/56 ,  H01L21/268 ,  H01L21/324 ,  H01S3/0071 ,  H01S3/0085

Abstract: Systems and methods for reducing pulsed laser beam profile non-uniformities for laser annealing are disclosed. The methods include directing an initial pulsed laser beam along an optical axis, and imparting to each light pulse a time-varying angular deflection relative to the optical axis. This forms a new laser beam wherein each light pulse is smeared out over an amount of spatial deflection δ sufficient to reduce the micro-scale intensity variations in the laser beam. The new laser beam is then used to form the line image, which has better intensity uniformity as compared using the initial laser beam to form the line image.

Abstract translation: 公开了用于减少用于激光退火的脉冲激光束轮廓非均匀性的系统和方法。 这些方法包括沿着光轴引导初始脉冲激光束，并且赋予每个光脉冲相对于光轴的时变角度偏转。 这形成了一个新的激光束，其中每个光脉冲在足以减少激光束的微尺度强度变化的空间偏差δ的量上被抹去。 然后使用新的激光束形成线图像，与使用初始激光束形成线图像相比，其具有更好的强度均匀性。