公开(公告)号：US11523503B2

公开(公告)日：2022-12-06

申请号：US17022128

申请日：2020-09-16

Applicant: Unimicron Technology Corp.

Inventor： Kai-Ming Yang ,  Chen-Hao Lin ,  Bo-Cheng Lin

IPC: H05K1/11 ,  H05K3/40

Abstract: A wiring board includes a photosensitive insulating layer and a first wiring layer. The photosensitive insulating layer has a hole, a first surface and a second surface opposite to each other. The hole has a first end opening formed in the first surface, a second end opening formed in the second surface, an axis, and a sidewall surrounding the axis. Part of the sidewall extends toward the axis to form at least one annular flange. The first wiring layer is disposed on the first surface and includes a first pad, in which the hole exposes the first pad. There is at least one recessed cavity between the annular flange and the first pad. The minimum width of the annular flange is smaller than the maximum width of the recessed cavity.

公开(公告)号：US10863618B2

公开(公告)日：2020-12-08

申请号：US16283670

申请日：2019-02-22

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Pei-Wei Wang ,  Bo-Cheng Lin ,  Chun-Hsien Chien ,  Chien-Chou Chen

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/30 ,  H05K3/46 ,  H01Q3/38 ,  H01Q1/24 ,  H01Q1/38 ,  H05K3/02 ,  H05K3/40 ,  H05K1/18

Abstract: A composite substrate structure includes a circuit substrate, a first anisotropic conductive film, a first glass substrate, a dielectric layer, a patterned circuit layer and a conductive via. The first anisotropic conductive film is disposed on the circuit substrate. The first glass substrate is disposed on the first anisotropic conductive film and has a first surface and a second surface opposite to the first surface. The first glass substrate includes a first circuit layer, a second circuit layer and at least one first conductive via. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The first conductive via penetrates the first glass substrate and is electrically connected to the first circuit layer and the second circuit layer. The first glass substrate and the circuit substrate are respectively located on two opposite sides of the first anisotropic conductive film.