公开(公告)号：US10070536B2

公开(公告)日：2018-09-04

申请号：US15201622

申请日：2016-07-05

Applicant: Unimicron Technology Corp.

Inventor： Chien-Tsai Li ,  Chien-Te Wu ,  Cheng-Chung Lo

IPC: H01K3/10 ,  H05K3/40 ,  H05K3/46 ,  H05K3/22

Abstract: Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A dicing process is performed, such that at least one slit is formed in the glass film. A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on the glass film. A polymer layer is formed on the first circuit layer. The polymer layer covers surfaces of the first circuit layer and the glass film. A plurality of second conductive vias are formed in the polymer layer. A second circuit layer is formed on the polymer layer, such that a first circuit board structure is formed. A singulation process is performed, such that the first circuit board structure is divided into a plurality of second circuit board structures.

公开(公告)号：US09917046B2

公开(公告)日：2018-03-13

申请号：US15201602

申请日：2016-07-04

Applicant: Unimicron Technology Corp.

Inventor： Chien-Te Wu ,  Chien-Tsai Li ,  Cheng-Chung Lo

IPC: H01K3/10 ,  H01L23/498 ,  H01L21/683 ,  H05K1/03 ,  H05K3/00 ,  H05K1/11 ,  H05K3/12 ,  H05K3/40 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6833 ,  H01L23/49822 ,  H01L23/49827 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/0029 ,  H05K3/1275 ,  H05K3/4007 ,  H05K3/4038 ,  Y10T29/49165

Abstract: Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on an upper surface of the glass film, such that the first circuit layer is electrically connected with the first conductive vias. A first polymer layer is formed on the first circuit layer. The first polymer layer covers a surface of the first circuit layer and the upper surface of the glass film. A plurality of second conductive vias are formed in the first polymer layer. A second circuit layer is formed on the first polymer layer, such that the second circuit layer is electrically connected with the second conductive vias. The E-chuck is removed.

公开(公告)号：US20180005933A1

公开(公告)日：2018-01-04

申请号：US15201602

申请日：2016-07-04

Applicant: Unimicron Technology Corp.

Inventor： Chien-Te Wu ,  Chien-Tsai Li ,  Cheng-Chung Lo

IPC: H01L23/498 ,  H05K3/12 ,  H05K1/11 ,  H01L21/48 ,  H05K1/03 ,  H01L21/683 ,  H05K3/40 ,  H05K3/00

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6833 ,  H01L23/49822 ,  H01L23/49827 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/0029 ,  H05K3/1275 ,  H05K3/4007 ,  H05K3/4038 ,  Y10T29/49165

Abstract: Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on an upper surface of the glass film, such that the first circuit layer is electrically connected with the first conductive vias. A first polymer layer is formed on the first circuit layer. The first polymer layer covers a surface of the first circuit layer and the upper surface of the glass film. A plurality of second conductive vias are formed in the first polymer layer. A second circuit layer is formed on the first polymer layer, such that the second circuit layer is electrically connected with the second conductive vias. The E-chuck is removed.

公开(公告)号：US20180014409A1

公开(公告)日：2018-01-11

申请号：US15201622

申请日：2016-07-05

Applicant: Unimicron Technology Corp.

Inventor： Chien-Tsai Li ,  Chien-Te Wu ,  Cheng-Chung Lo

IPC: H05K3/40 ,  H01L21/683 ,  H05K3/22 ,  H05K3/46

CPC classification number: H05K3/4038 ,  H05K3/22 ,  H05K3/4644

Abstract: Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A dicing process is performed, such that at least one slit is formed in the glass film. A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on the glass film. A polymer layer is formed on the first circuit layer. The polymer layer covers surfaces of the first circuit layer and the glass film. A plurality of second conductive vias are formed in the polymer layer. A second circuit layer is formed on the polymer layer, such that a first circuit board structure is formed. A singulation process is performed, such that the first circuit board structure is divided into a plurality of second circuit board structures.