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公开(公告)号：US10952325B2
公开(公告)日：2021-03-16
申请号：US16451031
申请日：2019-06-25
Applicant: Unimicron Technology Corp.
Inventor： Ching-Ho Hsieh , Ming-Hsing Wu , Shang-Wei Chen
Abstract: A printed circuit board (PCB) stack structure and method of forming the same are provided. The printed circuit board stack structure includes a first PCB, a second PCB and a connector. The first PCB includes a first pad. The second PCB includes a second pad. The connector has an annular structure, located between the first PCB and the second PCB and electrically connecting the first PCB to the second PCB. The connector includes a substrate, a first conductive elastic piece and a second conductive elastic piece. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic piece is located on the first surface and in electrical contact with the first pad. The second conductive elastic piece is located on the second surface and in electrical contact with the second pad.
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公开(公告)号：US20200329562A1
公开(公告)日：2020-10-15
申请号：US16451031
申请日：2019-06-25
Applicant: Unimicron Technology Corp.
Inventor： Ching-Ho Hsieh , Ming-Hsing Wu , Shang-Wei Chen
Abstract: A printed circuit board (PCB) stack structure and method of forming the same are provided. The printed circuit board stack structure includes a first PCB, a second PCB and a connector. The first PCB includes a first pad. The second PCB includes a second pad. The connector has an annular structure, located between the first PCB and the second PCB and electrically connecting the first PCB to the second PCB. The connector includes a substrate, a first conductive elastic piece and a second conductive elastic piece. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic piece is located on the first surface and in electrical contact with the first pad. The second conductive elastic piece is located on the second surface and in electrical contact with the second pad.
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公开(公告)号：US09420690B2
公开(公告)日：2016-08-16
申请号：US14720979
申请日：2015-05-26
Applicant: Unimicron Technology Corp.
Inventor： Chih-Peng Fan , Ching-Ho Hsieh , Chung-Chi Huang
CPC classification number: H05K1/115 , H05K1/0298 , H05K1/113 , H05K3/007 , H05K3/0097 , H05K3/06 , H05K3/28 , H05K3/4007 , H05K3/4092 , H05K2201/09572 , H05K2203/041 , H05K2203/1536
Abstract: The instant disclosure relates to a connector including a wiring layer, a dielectric layer, a conductive structure, a first protective layer and at least one cantilever structure. The dielectric layer is disposed on the wiring layer, wherein the dielectric layer has at least one via hole to partially expose the wiring layer. The conductive structure is disposed on the inner wall of the at least one via hole of the dielectric layer and electrically connected to the wiring layer. The first protective layer is disposed on the dielectric layer. The cantilever structure is disposed between the first protective layer and the dielectric layer, wherein the at least one cantilever structure is electrically connected to the wiring layer via the conductive structure.
Abstract translation: 本公开涉及包括布线层，电介质层，导电结构，第一保护层和至少一个悬臂结构的连接器。 电介质层设置在布线层上，其中介电层具有至少一个通孔以部分地暴露布线层。 导电结构设置在电介质层的至少一个通孔的内壁上并电连接到布线层。 第一保护层设置在电介质层上。 所述悬臂结构设置在所述第一保护层和所述电介质层之间，其中所述至少一个悬臂结构经由所述导电结构电连接到所述布线层。
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公开(公告)号：US12184005B2
公开(公告)日：2024-12-31
申请号：US17661282
申请日：2022-04-28
Applicant: Unimicron Technology Corp.
Inventor： Ching-Ho Hsieh , Ming-Hsing Wu , Keui-Sheng Wu
Abstract: A connector includes a substrate, a coverlay and a spring contact. The substrate has a first surface, a second surface opposite to the first surface and a conductive through hole extending between the first and second surfaces. The coverlay is disposed on the first surface and includes a first opening. The spring contact includes an anchor member, a rising member and a pin. The anchor member is disposed between the substrate and the coverlay. The rising member extends from the anchor member and through the first opening in a direction away from the substrate. A first portion of the rising member is in the first opening, and a second portion of the rising member is out of the first opening. The pin extends from the anchor member to an inside of the conductive through hole, and is electrically connected to the conductive through hole.
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公开(公告)号：US11600936B2
公开(公告)日：2023-03-07
申请号：US17322906
申请日：2021-05-18
Applicant: Unimicron Technology Corp.
Inventor： Tzyy-Jang Tseng , Pei-Wei Wang , Ching-Ho Hsieh , Shao-Chien Lee , Kuo-Wei Li
Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.
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Patent Agency Ranking
公开(公告)号：US11477886B2
公开(公告)日：2022-10-18
申请号：US17367419
申请日：2021-07-05
Applicant: Unimicron Technology Corp.
Inventor： Yunn-Tzu Yu , Ching-Ho Hsieh , Wang-Hsiang Tsai
Abstract: A circuit board structure includes a body, multiple first pads, a conductive assembly, multiple first engaging components, and multiple second engaging components. The body includes a first portion and a second portion integrally formed. A first surface of the first portion directly contacts a second surface of the second portion. A first region of the first surface protrudes from the second portion, and a second region of the second surface protrudes from the first portion. The first pads and the first engaging components are disposed on the first portion of the body and located in the first region of the first surface. The conductive assembly and the second engaging components are disposed on the second portion of the body and located in the second region of the second portion. The first pads are located between the first engaging components, and the conductive assembly is located between the second engaging components.
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公开(公告)号：USD969745S1
公开(公告)日：2022-11-15
申请号：US29696004
申请日：2019-06-25
Applicant: Unimicron Technology Corp.
Designer： Ching-Ho Hsieh , Ming-Hsing Wu , Shang-Wei Chen , Kuei-Sheng Wu
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公开(公告)号：US20140335705A1
公开(公告)日：2014-11-13
申请号：US13934238
申请日：2013-07-03
Applicant: Unimicron Technology Corp.
Inventor： Chih-Peng Fan , Yin-Hwa Cheng , Ching-Ho Hsieh , Ling-Kai Su , Yung-Hao Hsueh
IPC: H01R12/55
CPC classification number: H01R12/718 , H01L2924/15311 , H01L2924/15313 , H01R13/2442 , H05K3/326 , H05K3/4092 , H05K2201/0367 , H05K2201/0397 , H05K2201/09036 , H05K2201/10265 , H05K2201/10719
Abstract: An electrical connector includes a base an elastic terminal and an elastic terminal. The base has a recess. The elastic terminal is connected to the base and extends to the recess. When the contact moves towards the recess, the contact is capable of pushing the contact protrusion to bend towards the bottom of the recess. In addition, the electrical connector may further include a contact protrusion connected to the elastic terminal. When the contact moves towards the recess, the contact is capable of pushing the contact protrusion to make the elastic terminal bend towards the bottom portion of the recess.
Abstract translation: 电连接器包括基座，弹性端子和弹性端子。 底座有一个凹槽。 弹性端子连接到基座并延伸到凹部。 当接触件朝向凹部移动时，触头能够推动接触突起朝向凹部的底部弯曲。 此外，电连接器还可以包括连接到弹性端子的接触突起。 当接触件朝向凹部移动时，触头能够推动接触突起，以使弹性端子朝向凹部的底部弯曲。
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公开(公告)号：US20220232702A1
公开(公告)日：2022-07-21
申请号：US17367419
申请日：2021-07-05
Applicant: Unimicron Technology Corp.
Inventor： Yunn-Tzu Yu , Ching-Ho Hsieh , Wang-Hsiang Tsai
Abstract: A circuit board structure includes a body, multiple first pads, a conductive assembly, multiple first engaging components, and multiple second engaging components. The body includes a first portion and a second portion integrally formed. A first surface of the first portion directly contacts a second surface of the second portion. A first region of the first surface protrudes from the second portion, and a second region of the second surface protrudes from the first portion. The first pads and the first engaging components are disposed on the first portion of the body and located in the first region of the first surface. The conductive assembly and the second engaging components are disposed on the second portion of the body and located in the second region of the second portion. The first pads are located between the first engaging components, and the conductive assembly is located between the second engaging components.
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公开(公告)号：US11114782B2
公开(公告)日：2021-09-07
申请号：US16540038
申请日：2019-08-13
Applicant: Unimicron Technology Corp.
Inventor： Tzyy-Jang Tseng , Pei-Wei Wang , Ching-Ho Hsieh , Shao-Chien Lee , Kuo-Wei Li
Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.
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