公开(公告)号：US11997785B2

公开(公告)日：2024-05-28

申请号：US17577359

申请日：2022-01-17

Applicant: Unimicron Technology Corp.

Inventor： Chun-Lin Liao ,  Pei-Chang Huang

IPC: H05K1/00 ,  H05K1/02

CPC classification number: H05K1/0272 ,  H05K2201/0116 ,  H05K2201/10371

Abstract: A circuit board includes an insulation part, a support layer disposed on the insulation part, a metal case disposed in the insulation part, a heat-exchanging fluid distributed within the enclosed space, and a first porous material distributed within the enclosed space. The metal case is thermally coupled to the support layer and includes a first inner surface, a second inner surface opposite to the first inner surface and positioned between the first inner surface and the support layer, a third inner surface connecting the first inner surface and the second inner surface, and an enclosed space surrounded by the first inner surface, the second inner surface and the third inner surface. The first porous material is disposed on the first inner surface.

公开(公告)号：US20200329565A1

公开(公告)日：2020-10-15

申请号：US16739133

申请日：2020-01-10

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Pei-Chang Huang ,  Chi-Chun Po ,  Chun-Lin Liao ,  Po-Hsiang Wang ,  Hsuan-Wei Chen

IPC: H05K3/10

Abstract: A package carrier includes a plurality of first circuit patterns, a plurality of second circuit patterns and an insulating material layer. The second circuit patterns are disposed between any two the first circuit patterns and are directly connected to the first circuit patterns. In a cross-sectional view, a first thickness of each of the first circuit patterns is greater than a second thickness of each of the second circuit patterns. A first surface of each of the first circuit patterns is aligned with a second surface of each of the second circuit patterns. The insulating material layer at least contacts the first circuit patterns.