公开(公告)号：US10667406B2

公开(公告)日：2020-05-26

申请号：US16132462

申请日：2018-09-16

Applicant: Unimicron Technology Corp.

Inventor： Cheng-Chieh Chiu ,  Chia-Chan Chang ,  Chun-Yi Kuo ,  Yu-Cheng Lin

IPC: H05K1/11 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

Abstract: A circuit board element includes a glass substrate, a first dielectric layer, and a first patterned metal layer. The glass substrate has an edge. The first dielectric layer is disposed on the glass substrate and has a central region and an edge region. The edge region is in contact with the edge of the glass substrate, and the thickness of the central region is greater than the thickness of the edge region. The first patterned metal layer is disposed on the glass substrate and in the central region of the first dielectric layer.

公开(公告)号：US20180098435A1

公开(公告)日：2018-04-05

申请号：US15820397

申请日：2017-11-21

Applicant: Unimicron Technology Corp.

Inventor： Cheng-Chieh Chiu ,  Chia-Chan Chang ,  Chun-Yi Kuo ,  Yu-Cheng Lin

IPC: H05K3/06 ,  H05K3/46 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K3/061 ,  H05K1/113 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4647 ,  H05K3/4682 ,  H05K2201/096 ,  H05K2203/0502

Abstract: A circuit board element includes a glass substrate, a first dielectric layer, and a first patterned metal layer. The glass substrate has an edge. The first dielectric layer is disposed on the glass substrate and has a central region and an edge region. The edge region is in contact with the edge of the glass substrate, and the thickness of the central region is greater than the thickness of the edge region. The first patterned metal layer is disposed on the glass substrate and in the central region of the first dielectric layer.