公开(公告)号：US11631626B2

公开(公告)日：2023-04-18

申请号：US17206108

申请日：2021-03-18

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Po-Hsiang Wang ,  Chi-Chun Po

IPC: H01L23/06 ,  H01L23/367 ,  H01L23/31 ,  H01L23/373 ,  H01L23/00 ,  H01L25/065

Abstract: A package structure includes a first circuit board, a second circuit board, at least one electronic component, at least one conductive lead, and a molding compound. The first circuit board includes a first circuit layer and a second circuit layer. The second circuit board includes a third circuit layer and a fourth circuit layer. The electronic component is disposed between the first circuit board and the second circuit board. The conductive lead contacts at least one of the second circuit layer and the third circuit layer. The conductive lead has a vertical height, and the vertical height is greater than a vertical distance between the second circuit layer and the third circuit layer. The molding compound covers the first circuit board, the second circuit board, the electronic component, and the conductive lead. The molding compound exposes the first circuit layer and the fourth circuit layer, and the conductive lead extends outside the molding compound.

公开(公告)号：US20210014963A1

公开(公告)日：2021-01-14

申请号：US16533808

申请日：2019-08-07

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Chi-Chun Po ,  Po-Hsiang Wang

IPC: H05K1/02 ,  H05K1/05 ,  H05K7/20

Abstract: A circuit board structure includes a carrier and a patterned circuit layer. The patterned circuit layer is disposed on the carrier, and the patterned circuit layer has at least one fluid channel therein. The fluid channel has a heat absorption section and a heat dissipation section relative to the heat absorption section. A heat source is electrically connected to the patterned circuit layer, and the heat absorption section is adjacent to the heat source. The heat generated by the heat source is transferred from the patterned circuit layer to the heat absorption section of the fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation.

公开(公告)号：US11641720B2

公开(公告)日：2023-05-02

申请号：US17224078

申请日：2021-04-06

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei Wang ,  Shao-Chien Lee ,  Ra-Min Tain ,  Chi-Chun Po ,  Po-Hsiang Wang ,  Pei-Chang Huang ,  Chin-Min Hu

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/34

Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.

公开(公告)号：US11337303B2

公开(公告)日：2022-05-17

申请号：US16533808

申请日：2019-08-07

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Chi-Chun Po ,  Po-Hsiang Wang

IPC: H05K1/02 ,  H05K7/20 ,  H05K1/05

Abstract: A circuit board structure includes a carrier and a patterned circuit layer. The patterned circuit layer is disposed on the carrier, and the patterned circuit layer has at least one fluid channel therein. The fluid channel has a heat absorption section and a heat dissipation section relative to the heat absorption section. A heat source is electrically connected to the patterned circuit layer, and the heat absorption section is adjacent to the heat source. The heat generated by the heat source is transferred from the patterned circuit layer to the heat absorption section of the fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation.

公开(公告)号：US20200329565A1

公开(公告)日：2020-10-15

申请号：US16739133

申请日：2020-01-10

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Pei-Chang Huang ,  Chi-Chun Po ,  Chun-Lin Liao ,  Po-Hsiang Wang ,  Hsuan-Wei Chen

IPC: H05K3/10

Abstract: A package carrier includes a plurality of first circuit patterns, a plurality of second circuit patterns and an insulating material layer. The second circuit patterns are disposed between any two the first circuit patterns and are directly connected to the first circuit patterns. In a cross-sectional view, a first thickness of each of the first circuit patterns is greater than a second thickness of each of the second circuit patterns. A first surface of each of the first circuit patterns is aligned with a second surface of each of the second circuit patterns. The insulating material layer at least contacts the first circuit patterns.

公开(公告)号：US20220108934A1

公开(公告)日：2022-04-07

申请号：US17206108

申请日：2021-03-18

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Po-Hsiang Wang ,  Chi-Chun Po

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/373 ,  H01L23/00 ,  H01L25/065

Abstract: A package structure includes a first circuit board, a second circuit board, at least one electronic component, at least one conductive lead, and a molding compound. The first circuit board includes a first circuit layer and a second circuit layer. The second circuit board includes a third circuit layer and a fourth circuit layer. The electronic component is disposed between the first circuit board and the second circuit board. The conductive lead contacts at least one of the second circuit layer and the third circuit layer. The conductive lead has a vertical height, and the vertical height is greater than a vertical distance between the second circuit layer and the third circuit layer. The molding compound covers the first circuit board, the second circuit board, the electronic component, and the conductive lead. The molding compound exposes the first circuit layer and the fourth circuit layer, and the conductive lead extends outside the molding compound.

公开(公告)号：US20220095464A1

公开(公告)日：2022-03-24

申请号：US17224078

申请日：2021-04-06

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei Wang ,  Shao-Chien Lee ,  Ra-Min Tain ,  Chi-Chun Po ,  Po-Hsiang Wang ,  Pei-Chang Huang ,  Chin-Min Hu

IPC: H05K3/46 ,  H05K3/34 ,  H05K1/02

Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.