公开(公告)号：US10856421B2

公开(公告)日：2020-12-01

申请号：US16679337

申请日：2019-11-11

Applicant: Unimicron Technology Corp.

Inventor： Ching-Hao Huang ,  Ho-Shing Lee ,  Yu-Cheng Lin

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/24 ,  H05K3/06 ,  H05K3/28 ,  H05K1/11

Abstract: A circuit board is disposed on a substrate and includes a dielectric layer and a circuit layer. The dielectric layer is disposed on the substrate. The circuit layer is embedded in the dielectric layer and has plural traces. Each of the traces has a first top surface and a first bottom surface which are opposite to each other, and the first bottom surface faces toward the substrate. The first top surface is exposed from the dielectric layer, and an area of a vertical projection of the first top surface on the substrate is smaller than an area of a vertical projection of the first bottom surface on the substrate.

公开(公告)号：US20180098435A1

公开(公告)日：2018-04-05

申请号：US15820397

申请日：2017-11-21

Applicant: Unimicron Technology Corp.

Inventor： Cheng-Chieh Chiu ,  Chia-Chan Chang ,  Chun-Yi Kuo ,  Yu-Cheng Lin

IPC: H05K3/06 ,  H05K3/46 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K3/061 ,  H05K1/113 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4647 ,  H05K3/4682 ,  H05K2201/096 ,  H05K2203/0502

Abstract: A circuit board element includes a glass substrate, a first dielectric layer, and a first patterned metal layer. The glass substrate has an edge. The first dielectric layer is disposed on the glass substrate and has a central region and an edge region. The edge region is in contact with the edge of the glass substrate, and the thickness of the central region is greater than the thickness of the edge region. The first patterned metal layer is disposed on the glass substrate and in the central region of the first dielectric layer.

公开(公告)号：US10667406B2

公开(公告)日：2020-05-26

申请号：US16132462

申请日：2018-09-16

Applicant: Unimicron Technology Corp.

Inventor： Cheng-Chieh Chiu ,  Chia-Chan Chang ,  Chun-Yi Kuo ,  Yu-Cheng Lin

IPC: H05K1/11 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

Abstract: A circuit board element includes a glass substrate, a first dielectric layer, and a first patterned metal layer. The glass substrate has an edge. The first dielectric layer is disposed on the glass substrate and has a central region and an edge region. The edge region is in contact with the edge of the glass substrate, and the thickness of the central region is greater than the thickness of the edge region. The first patterned metal layer is disposed on the glass substrate and in the central region of the first dielectric layer.

公开(公告)号：US10512165B2

公开(公告)日：2019-12-17

申请号：US15468102

申请日：2017-03-23

Applicant: Unimicron Technology Corp.

Inventor： Ching-Hao Huang ,  Ho-Shing Lee ,  Yu-Cheng Lin

IPC: H05K3/00 ,  H05K3/06 ,  H05K3/28

Abstract: A circuit board is disposed on a substrate and includes a dielectric layer and a circuit layer. The dielectric layer is disposed on the substrate. The circuit layer is embedded in the dielectric layer and has plural traces. Each of the traces has a first top surface and a first bottom surface which are opposite to each other, and the first bottom surface faces toward the substrate. The first top surface is exposed from the dielectric layer, and an area of a vertical projection of the first top surface on the substrate is smaller than an area of a vertical projection of the first bottom surface on the substrate.