公开(公告)号：US09433108B2

公开(公告)日：2016-08-30

申请号：US14097597

申请日：2013-12-05

Applicant: Unimicron Technology Corporation

Inventor： Yung-Ching Lin ,  Chih-Kuie Yang ,  Ta-Han Lin

IPC: H05K3/46 ,  H05K1/18

CPC classification number: H05K3/4647 ,  H05K1/185 ,  H05K2201/0358 ,  H05K2203/1189 ,  Y10T29/49155

Abstract: A method for fabricating a circuit board structure having at least an embedded electronic element is disclosed, which includes the steps of: providing a substrate and embedding at least an electronic element in the substrate with an active surface and a plurality of electrode pads of the electronic element exposed from a surface of the substrate; forming a plurality of conductive bumps on the electrode pads of the electronic element; and covering the surface of the substrate and the active surface of the electronic element with a dielectric layer and a metal layer stacked on the dielectric layer, wherein the conductive bumps penetrate the dielectric layer so as to be in contact with the metal layer, thereby simplifying the fabrication process, reducing the fabrication cost and saving the fabrication time.

Abstract translation: 公开了一种用于制造具有至少嵌入式电子元件的电路板结构的方法，其包括以下步骤：提供基板并且将基板中的至少一个电子元件嵌入到所述基板中，所述基板具有活性表面和所述电子元件的多个电极焊盘 元件从所述基板的表面露出; 在所述电子元件的电极焊盘上形成多个导电凸块; 并且用电介质层和层叠在电介质层上的金属层覆盖基板的表面和电子元件的有源面，其中，导体凸块穿透电介质层以与金属层接触，从而简化 制造工艺，降低制造成本，节省制造时间。

公开(公告)号：US20140201992A1

公开(公告)日：2014-07-24

申请号：US14097597

申请日：2013-12-05

Applicant: UNIMICRON TECHNOLOGY CORPORATION

Inventor： Yung-Ching Lin ,  Chih-Kuie Yang ,  Ta-Han Lin

IPC: H05K3/40

CPC classification number: H05K3/4647 ,  H05K1/185 ,  H05K2201/0358 ,  H05K2203/1189 ,  Y10T29/49155

Abstract: A method for fabricating a circuit board structure having at least an embedded electronic element is disclosed, which includes the steps of: providing a substrate and embedding at least an electronic element in the substrate with an active surface and a plurality of electrode pads of the electronic element exposed from a surface of the substrate; forming a plurality of conductive bumps on the electrode pads of the electronic element; and covering the surface of the substrate and the active surface of the electronic element with a dielectric layer and a metal layer stacked on the dielectric layer, wherein the conductive bumps penetrate the dielectric layer so as to be in contact with the metal layer, thereby simplifying the fabrication process, reducing the fabrication cost and saving the fabrication time.

Abstract translation: 公开了一种用于制造具有至少嵌入式电子元件的电路板结构的方法，其包括以下步骤：提供基板并且将基板中的至少一个电子元件嵌入到所述基板中，所述基板具有活性表面和所述电子元件的多个电极焊盘 元件从所述基板的表面露出; 在所述电子元件的电极焊盘上形成多个导电凸块; 并且用电介质层和层叠在电介质层上的金属层覆盖基板的表面和电子元件的有源面，其中，导体凸块穿透电介质层以与金属层接触，从而简化 制造工艺，降低制造成本，节省制造时间。