公开(公告)号：US10476234B2

公开(公告)日：2019-11-12

申请号：US15562462

申请日：2016-04-08

Applicant: University of Houston System

Inventor： Jae-Hyun Ryou ,  Shahab Shervin ,  Seung Hwan Kim

IPC: H01L29/84 ,  H01S5/32 ,  H01L29/778 ,  H01L29/06 ,  H01L21/8238 ,  H01L29/49 ,  H01L29/78 ,  H01S5/323 ,  H01S5/34 ,  H01L29/10 ,  H01L29/20 ,  H01L29/22 ,  H01L33/02 ,  H01L33/48

Abstract: Externally-strained devices such as LED and FET structures as discussed herein may have strain applied before or during their being coupled to a housing or packaging substrate. The packaging substrate may also be strained prior to receiving the structure. The strain on the devices enables modulation of light intensity, color, and electrical currents in some embodiments, and in alternate embodiments, enables a fixed strain to be induced and maintained in the structures.

公开(公告)号：US20190044307A1

公开(公告)日：2019-02-07

申请号：US16147616

申请日：2018-09-29

Applicant: University of Houston System

Inventor： Jae-Hyun Ryou ,  Shahab Shervin ,  Seung Hwan Kim

IPC: H01S5/32 ,  H01S5/34 ,  H01L21/8238 ,  H01S5/323 ,  H01L29/06 ,  H01L29/49 ,  H01L29/84 ,  H01L29/78 ,  H01L29/778 ,  H01L29/20 ,  H01L29/22 ,  H01L29/10 ,  H01L33/02 ,  H01L33/48

Abstract: Externally-strained devices such as LED and FET structures as discussed herein may have strain applied before or during their being coupled to a housing or packaging substrate. The packaging substrate may also be strained prior to receiving the structure. The strain on the devices enables modulation of light intensity, color, and electrical currents in some embodiments, and in alternate embodiments, enables a fixed strain to be induced and maintained in the structures.

公开(公告)号：US20180090911A1

公开(公告)日：2018-03-29

申请号：US15562462

申请日：2016-04-08

Applicant: University of Houston System

Inventor： Jae-Hyun Ryou ,  Shahab Shervin ,  Seung Hwan Kim

IPC: H01S5/32 ,  H01S5/323 ,  H01S5/34 ,  H01L21/8238 ,  H01L29/49 ,  H01L29/78

CPC classification number: H01S5/3201 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823835 ,  H01L29/0657 ,  H01L29/1054 ,  H01L29/2003 ,  H01L29/22 ,  H01L29/4908 ,  H01L29/7786 ,  H01L29/7845 ,  H01L29/84 ,  H01L33/02 ,  H01L33/486 ,  H01S5/32391 ,  H01S5/3406

Abstract: Externally-strained devices such as LED and FET structures as discussed herein may have strain applied before or during their being coupled to a housing or packaging substrate. The packaging substrate may also be strained prior to receiving the structure. The strain on the devices enables modulation of light intensity, color, and electrical currents in some embodiments, and in alternate embodiments, enables a fixed strain to be induced and maintained in the structures.

公开(公告)号：US10897120B2

公开(公告)日：2021-01-19

申请号：US16147616

申请日：2018-09-29

Applicant: University of Houston System

Inventor： Jae-Hyun Ryou ,  Shahab Shervin ,  Seung Hwan Kim

IPC: H01L33/48 ,  H01S5/32 ,  H01L29/778 ,  H01L29/84 ,  H01L29/06 ,  H01L21/8238 ,  H01L29/49 ,  H01L29/78 ,  H01S5/323 ,  H01S5/34 ,  H01L29/10 ,  H01L29/20 ,  H01L29/22 ,  H01L33/02

Abstract: Externally-strained devices such as LED and FET structures as discussed herein may have strain applied before or during their being coupled to a housing or packaging substrate. The packaging substrate may also be strained prior to receiving the structure. The strain on the devices enables modulation of light intensity, color, and electrical currents in some embodiments, and in alternate embodiments, enables a fixed strain to be induced and maintained in the structures.

公开(公告)号：US20190198313A1

公开(公告)日：2019-06-27

申请号：US16331490

申请日：2017-09-08

Applicant: University of Houston System

Inventor： Jae-Hyun Ryou ,  Shahab Shervin

IPC: H01L21/02 ,  H01L29/20 ,  H01L31/0304 ,  H01L33/32 ,  H01L33/00 ,  H01L31/18 ,  C30B25/18 ,  C30B29/40 ,  C30B29/02 ,  C30B29/68

CPC classification number: H01L21/0262 ,  C30B25/183 ,  C30B29/02 ,  C30B29/403 ,  C30B29/406 ,  C30B29/68 ,  H01L21/02381 ,  H01L21/02425 ,  H01L21/02433 ,  H01L21/02439 ,  H01L21/02444 ,  H01L21/02458 ,  H01L21/02491 ,  H01L21/02505 ,  H01L21/02516 ,  H01L21/0254 ,  H01L29/2003 ,  H01L31/03044 ,  H01L31/1852 ,  H01L31/1856 ,  H01L33/007 ,  H01L33/16 ,  H01L33/32

Abstract: Discussed herein are systems and methods for fabrication of flexible electronic structures via direct growth of two-dimensional materials on metal foil and the direct growth of 2D materials on any substrate including polycrystalline, single crystal, and amorphous substrates, that may employ an adhesion layer of, for example, a Cu or Ni film, formed directly on the substrate prior to formation of subsequent layers.