公开(公告)号：US10773244B2

公开(公告)日：2020-09-15

申请号：US16444707

申请日：2019-06-18

Applicant: University of North Texas

Inventor： Santanu Das ,  Sundeep Mukherjee

IPC: B01J21/02 ,  B01J23/755 ,  B01J23/83 ,  B01J35/00 ,  B01J35/02 ,  B01J35/08 ,  B01J37/00 ,  B01J37/02 ,  B22F1/00 ,  B22F1/02 ,  B22F9/08 ,  C02F1/72 ,  C22C1/00 ,  C22C1/04 ,  C22C45/08 ,  C02F101/30 ,  B01J37/34

Abstract: The present invention provides amorphous bi-functional catalytic aluminum metallic glass particles having an aluminum metallic glass core and 2 or more transition metals disposed on the surface of the aluminum metallic glass core to form amorphous bi-functional aluminum metallic glass particles with catalytic activity.

公开(公告)号：US10822692B2

公开(公告)日：2020-11-03

申请号：US15676189

申请日：2017-08-14

Applicant: University of North Texas

Inventor： Sundeep Mukherjee ,  Santanu Das

IPC: C23C14/34 ,  C23C14/35 ,  C23C14/54 ,  C22C5/08 ,  C23C14/18 ,  C23C14/14 ,  C23C14/08 ,  H01L27/01

Abstract: An interconnect and a method of making an interconnect between one or more features on a substrate comprises: sputtering a noble metal-copper eutectic thin film under controlled power on an oxide grown or deposited on a substrate; and forming an amorphous alloy structure from the noble metal-copper eutectic thin film in the shape of the interconnect and the interconnect comprising no grain or grain boundaries without temperature sensitive resistivity.

公开(公告)号：US20170209853A1

公开(公告)日：2017-07-27

申请号：US15409972

申请日：2017-01-19

Applicant: University of North Texas

Inventor： Santanu Das ,  Sundeep Mukherjee

IPC: B01J23/83 ,  B22F9/08 ,  C22C45/08 ,  B01J37/02 ,  B01J23/755 ,  B01J35/00 ,  B01J35/02 ,  B22F1/00 ,  C22C1/00

CPC classification number: B01J23/83 ,  B01J21/02 ,  B01J23/755 ,  B01J35/0006 ,  B01J35/002 ,  B01J35/0033 ,  B01J35/004 ,  B01J35/008 ,  B01J35/023 ,  B01J35/08 ,  B01J37/0081 ,  B01J37/0221 ,  B01J37/34 ,  B01J2523/00 ,  B22F1/0003 ,  B22F1/025 ,  B22F9/082 ,  B22F2999/00 ,  C02F1/725 ,  C02F2101/308 ,  C22C1/002 ,  C22C1/0416 ,  C22C45/08 ,  B01J2523/31 ,  B01J2523/842 ,  B01J2523/847 ,  B01J2523/36 ,  C22C2200/02

Abstract: The present invention provides amorphous bi-functional catalytic aluminum metallic glass particles having an aluminum metallic glass core and 2 or more transition metals disposed on the surface of the aluminum metallic glass core to form amorphous bi-functional aluminum metallic glass particles with catalytic activity.

公开(公告)号：US11840756B2

公开(公告)日：2023-12-12

申请号：US17066670

申请日：2020-10-09

Applicant: University of North Texas

Inventor： Santanu Das ,  Sundeep Mukherjee

IPC: H01L23/52 ,  C23C14/35 ,  C23C14/54 ,  C22C5/08 ,  C23C14/18 ,  C23C14/14 ,  C23C14/08 ,  H01L27/01

CPC classification number: C23C14/35 ,  C22C5/08 ,  C23C14/087 ,  C23C14/14 ,  C23C14/185 ,  C23C14/542 ,  H01L23/52 ,  H01L27/016

Abstract: An interconnect and a method of making an interconnect between one or more features on a substrate comprises: sputtering a noble metal-copper eutectic thin film under controlled power on an oxide grown or deposited on a substrate; and forming an amorphous alloy structure from the noble metal-copper eutectic thin film in the shape of the interconnect and the interconnect comprising no grain or grain boundaries without temperature sensitive resistivity.

公开(公告)号：US10363548B2

公开(公告)日：2019-07-30

申请号：US15409972

申请日：2017-01-19

Applicant: University of North Texas

Inventor： Santanu Das ,  Sundeep Mukherjee

IPC: B01J21/02 ,  B01J23/755 ,  B01J23/83 ,  B01J35/00 ,  B01J35/02 ,  B01J35/08 ,  B01J37/02 ,  B22F9/08 ,  B22F1/00 ,  C22C45/08 ,  C22C1/00 ,  C02F1/72 ,  B22F1/02 ,  B01J37/00 ,  C22C1/04 ,  C02F101/30 ,  B01J37/34

Abstract: The present invention provides amorphous bi-functional catalytic aluminum metallic glass particles having an aluminum metallic glass core and 2 or more transition metals disposed on the surface of the aluminum metallic glass core to form amorphous bi-functional aluminum metallic glass particles with catalytic activity.

公开(公告)号：US20210025051A1

公开(公告)日：2021-01-28

申请号：US17066670

申请日：2020-10-09

Applicant: University of North Texas

Inventor： Santanu Das ,  Sundeep Mukherjee

IPC: C23C14/35 ,  C23C14/54 ,  C22C5/08 ,  C23C14/18 ,  C23C14/14 ,  C23C14/08

Abstract: An interconnect and a method of making an interconnect between one or more features on a substrate comprises: sputtering a noble metal-copper eutectic thin film under controlled power on an oxide grown or deposited on a substrate; and forming an amorphous alloy structure from the noble metal-copper eutectic thin film in the shape of the interconnect and the interconnect comprising no grain or grain boundaries without temperature sensitive resistivity.

公开(公告)号：US20200303748A1

公开(公告)日：2020-09-24

申请号：US16607260

申请日：2018-04-23

Applicant: University of North Texas

Inventor： Vahid Hasannaeimi ,  Sundeep Mukherjee

IPC: H01M4/88 ,  H01M4/90 ,  H01M4/92 ,  C25D21/12 ,  C25D1/00

Abstract: The present application relates to systems and methods for forming catalysts for use in fuel cells, other energy storage/generation devices, and other applications where catalysts may be used. In embodiments, a catalyst comprising one or more metallic glass structures may be formed by disposing a porous mold in a plating bath comprising one or more dissolved metal salts. An electrodeposition process may be initiated by applying current to the plating bath, where the electrodeposition process forms the one or more metallic glass structures within pores of the porous mold. One or more sensors may be used to monitor one or more properties of the electrodeposition process during the application of the current to the plating bath, and the one or more properties of the electrode-position process may be controlled, based on the monitoring of the one or more parameters, to adjust one or more characteristics of the metallic glass structures.

公开(公告)号：US20190299194A1

公开(公告)日：2019-10-03

申请号：US16444707

申请日：2019-06-18

Applicant: University of North Texas

Inventor： Santanu Das ,  Sundeep Mukherjee

IPC: B01J23/83 ,  B01J23/755 ,  B01J35/00 ,  B01J35/02 ,  B01J35/08 ,  B22F1/02 ,  B01J37/00 ,  C22C1/04 ,  B01J21/02 ,  C22C1/00 ,  C22C45/08 ,  B22F9/08 ,  B22F1/00 ,  B01J37/02 ,  C02F1/72

Abstract: The present invention provides amorphous bi-functional catalytic aluminum metallic glass particles having an aluminum metallic glass core and 2 or more transition metals disposed on the surface of the aluminum metallic glass core to form amorphous bi-functional aluminum metallic glass particles with catalytic activity.

公开(公告)号：US20180044782A1

公开(公告)日：2018-02-15

申请号：US15676189

申请日：2017-08-14

Applicant: University of North Texas

Inventor： Sundeep Mukherjee ,  Santanu Das

IPC: C23C14/35 ,  C22C5/08 ,  C23C14/54

CPC classification number: C23C14/35 ,  C22C5/08 ,  C23C14/185 ,  C23C14/542 ,  H01L27/016

Abstract: An interconnect and a method of making an interconnect between one or more features on a substrate comprises: sputtering a noble metal-copper eutectic thin film under controlled power on an oxide grown or deposited on a substrate; and forming an amorphous alloy structure from the noble metal-copper eutectic thin film in the shape of the interconnect and the interconnect comprising no grain or grain boundaries without temperature sensitive resistivity.