公开(公告)号：US20230163062A1

公开(公告)日：2023-05-25

申请号：US18156484

申请日：2023-01-19

Applicant: WOLFSPEED, INC.

Inventor： Zach Cole ,  Steven Ericksen

IPC: H01L23/498 ,  H05K1/18 ,  H01L25/07 ,  H05K1/14

CPC classification number: H01L23/49838 ,  H05K1/181 ,  H01L25/072 ,  H05K1/147 ,  H05K2201/042 ,  H05K1/142 ,  H05K2201/10166 ,  H05K2201/10151

Abstract: A power module includes at least one electrically conductive power substrate; and a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate. The power module further includes at least one elevated signal element electrically connected to the plurality of power devices and/or at least one elevated power plane electrically connected to the at least one electrically conductive power substrate and electrically connected to the plurality of power devices.

公开(公告)号：US12087680B2

公开(公告)日：2024-09-10

申请号：US18156484

申请日：2023-01-19

Applicant: WOLFSPEED, INC.

Inventor： Zach Cole ,  Steven Ericksen

IPC: H05K5/00 ,  H01L23/498 ,  H01L25/07 ,  H05K1/14 ,  H05K1/18

CPC classification number: H01L23/49838 ,  H01L25/072 ,  H05K1/147 ,  H05K1/181 ,  H05K1/142 ,  H05K2201/042 ,  H05K2201/10151 ,  H05K2201/10166

Abstract: A power module includes at least one electrically conductive power substrate; and a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate. The power module further includes at least one elevated signal element electrically connected to the plurality of power devices and/or at least one elevated power plane electrically connected to the at least one electrically conductive power substrate and electrically connected to the plurality of power devices.