公开(公告)号：US11063010B2

公开(公告)日：2021-07-13

申请号：US16264684

申请日：2019-02-01

Applicant: Winbond Electronics Corp.

Inventor： Yen-Jui Chu ,  Jin-Neng Wu ,  Hsin-Hung Chou ,  Chun-Hung Lin

IPC: H01L23/00

Abstract: Provided is a redistribution layer (RDL) structure including a substrate, a pad, a dielectric layer, a self-aligned structure, a conductive layer, and a conductive connector. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The self-aligned structure is disposed on the dielectric layer. The conductive layer extends from the pad to conformally cover a surface of the self-aligned structure. The conductive connector is disposed on the self-aligned structure. A method of manufacturing the RDL structure is also provided.

公开(公告)号：US20180234779A1

公开(公告)日：2018-08-16

申请号：US15821857

申请日：2017-11-24

Applicant: Winbond Electronics Corp.

Inventor： Ming-Hung Hsieh ,  Yu-Hsuan Ho ,  Ming-Chih Tsai ,  Yen-Jui Chu

IPC: H04R25/00 ,  B33Y80/00

CPC classification number: H04R25/606 ,  B33Y80/00 ,  H04R25/65 ,  H04R25/658 ,  H04R2225/77 ,  H04R2460/13

Abstract: A bone-conduction hearing aid device is provided. The bone-conduction hearing aid device is suitable for being attached to a body surface and includes a substrate, an input transducer, an amplifier, and a bone-conduction speaker. The substrate is composed of a plurality of stacking layers stacked on top of one another. A material of the substrate includes cellulose nanofiber. The substrate is formed by 3D printing technique so that a contact surface of the substrate is tightly attached with the body surface. The input transducer is disposed on the substrate and configured to receive a sound signal and convert the sound signal into an electric signal. The amplifier is disposed on the substrate and coupled to the input transducer to amplify the electric signal into an amplified electric signal. The bone-conduction speaker is disposed on the substrate and coupled to the amplifier to convert the amplified electric signal into a vibration signal.

公开(公告)号：US20180209927A1

公开(公告)日：2018-07-26

申请号：US15867724

申请日：2018-01-11

Applicant: Winbond Electronics Corp.

Inventor： Ming-Chih Tsai ,  Yu-Hsuan Ho ,  Yen-Jui Chu ,  Ming-Hung Hsieh

IPC: G01N27/12

CPC classification number: G01N27/128 ,  B41J2/04 ,  G01N27/127

Abstract: A reduction-oxidation sensor device and a manufacturing method thereof are provided. The reduction-oxidation sensor device includes a first electrode, at least one sensing structure and a second electrode. The first electrode is located on a substrate. The at least one sensing structure is located on the first electrode and the substrate. The at least one sensing structure includes a metal nanowire layer and a metal oxide layer. The metal nanowire layer is disposed on the first electrode and the substrate. The metal nanowire layer is wrapped by the metal oxide layer. The second electrode is located on the at least one sensing structure.

公开(公告)号：US12119261B2

公开(公告)日：2024-10-15

申请号：US17712461

申请日：2022-04-04

Applicant: Winbond Electronics Corp.

Inventor： Chun-Hung Lin ,  Kao-Tsair Tsai ,  Chung-Hsien Liu ,  Tz-Hau Guo ,  Yen-Jui Chu

IPC: H01L21/768 ,  H01L21/8234

CPC classification number: H01L21/76897 ,  H01L21/76816 ,  H01L21/76834 ,  H01L21/823475

Abstract: A manufacturing method for a semiconductor structure is provided. First active areas, a second active area, and a third active area are formed. A first dielectric layer is formed on the active areas. A patterned region that includes a cavity region and a dielectric region is formed in the first dielectric layer, and the cavity region surrounds the dielectric region. A filling layer is formed in the cavity region. Multiple first contact holes and at least one second contact hole that penetrate the first dielectric layer are formed. Each first contact hole exposes a portion of the corresponding first active area, and the second contact hole replaces the dielectric region and exposes a portion of the second active area. Metal layers are filled in to the first contact holes and the second contact hole.

公开(公告)号：US20200251435A1

公开(公告)日：2020-08-06

申请号：US16264696

申请日：2019-02-01

Applicant: Winbond Electronics Corp.

Inventor： Jin-Neng Wu ,  Yen-Jui Chu

IPC: H01L23/00

Abstract: Provided is a circuit structure including a substrate, a pad, a dielectric layer, a conductive layer, an adhesion layer, and a conductive bump. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The conductive layer contacts the pad and extends from the pad to cover a top surface of the dielectric layer. The adhesion layer is disposed between the dielectric layer and the conductive layer. The conductive bump extends in an upward manner from a top surface of the conductive layer. The conductive bump and the conductive layer are integrally formed. A method of manufacturing the circuit structure is also provided.

公开(公告)号：US20200161264A1

公开(公告)日：2020-05-21

申请号：US16546293

申请日：2019-08-20

Applicant: Winbond Electronics Corp.

Inventor： Chun-Hung Lin ,  Yen-Jui Chu ,  Kao-Tsair Tsai

IPC: H01L23/00

Abstract: A semiconductor device is provided and includes a first pad and a second pad, a first conductive connector and a second conductive connector, a first conductive structure and a second conductive structure. The first conductive connector and the second conductive connector are disposed over the first pad and the second pad. The first conductive structure is electrically connected to the first pad and the first conductive connector, and includes a first portion, a second portion and a connecting portion connecting the first and second portions. The first portion and the second portion are not overlapped in a vertical direction, and the first portion, the connecting portion and the second portion are integrally formed. The second conductive structure is electrically connected to the second pad and the second conductive connector, wherein a portion of the second conductive structure is overlapped with the first conductive structure therebeneath in the vertical direction.

公开(公告)号：US11658138B2

公开(公告)日：2023-05-23

申请号：US17679122

申请日：2022-02-24

Applicant: Winbond Electronics Corp.

Inventor： Yen-Jui Chu ,  Jin-Neng Wu

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/05017

Abstract: Provided is a semiconductor device including a substrate, a passivation layer, and a connector. The passivation layer is disposed on the substrate. The connector is embedded in the passivation. An interface of the connector in contact with the passivation layer is uneven, thereby improving the structural stability of the connector. A method of manufacturing the semiconductor is also provided.

公开(公告)号：US20200251434A1

公开(公告)日：2020-08-06

申请号：US16264684

申请日：2019-02-01

Applicant: Winbond Electronics Corp.

Inventor： Yen-Jui Chu ,  Jin-Neng Wu ,  Hsin-Hung Chou ,  Chun-Hung Lin

IPC: H01L23/00

Abstract: Provided is a redistribution layer (RDL) structure including a substrate, a pad, a dielectric layer, a self-aligned structure, a conductive layer, and a conductive connector. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The self-aligned structure is disposed on the dielectric layer. The conductive layer extends from the pad to conformally cover a surface of the self-aligned structure. The conductive connector is disposed on the self-aligned structure. A method of manufacturing the RDL structure is also provided.

公开(公告)号：US10282964B2

公开(公告)日：2019-05-07

申请号：US15594669

申请日：2017-05-15

Applicant: Winbond Electronics Corp.

Inventor： Ming-Hung Hsieh ,  Yu-Hsuan Ho ,  Ming-Chih Tsai ,  Yen-Jui Chu

IPC: G01N27/04 ,  G01N33/00 ,  G08B21/12 ,  G01N27/12 ,  G08B21/14

Abstract: A gas detecting device configured to be attached to a surface includes a substrate, a semiconductor layer, a light-emitting component, a first electrode and a second electrode. The substrate includes a plurality of stacking layers stacked onto one another, and a material of the substrate includes cellulose nanofibrils (CNF). The substrate is formed by 3-D printing, such that a contact surface of the substrate is tightly attached to the surface. The semiconductor layer is formed on the substrate by 3-D printing. The light-emitting component is disposed on the substrate. The first electrode is coupled to the semiconductor layer and the light-emitting component. The second electrode is coupled to the semiconductor layer and a ground electrode. The first electrode and the second electrode are both disposed on the semiconductor layer and maintain a gap therebetween. A resistance of the semiconductor layer is changed according to a concentration of a designated gas.

公开(公告)号：US10277995B2

公开(公告)日：2019-04-30

申请号：US15821857

申请日：2017-11-24

Applicant: Winbond Electronics Corp.

Inventor： Ming-Hung Hsieh ,  Yu-Hsuan Ho ,  Ming-Chih Tsai ,  Yen-Jui Chu

IPC: H04R25/00 ,  B33Y80/00

Abstract: A bone-conduction hearing aid device is provided. The bone-conduction hearing aid device is suitable for being attached to a body surface and includes a substrate, an input transducer, an amplifier, and a bone-conduction speaker. The substrate is composed of a plurality of stacking layers stacked on top of one another. A material of the substrate includes cellulose nanofiber. The substrate is formed by 3D printing technique so that a contact surface of the substrate is tightly attached with the body surface. The input transducer is disposed on the substrate and configured to receive a sound signal and convert the sound signal into an electric signal. The amplifier is disposed on the substrate and coupled to the input transducer to amplify the electric signal into an amplified electric signal. The bone-conduction speaker is disposed on the substrate and coupled to the amplifier to convert the amplified electric signal into a vibration signal.