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    Electronic device package and manufacturing method thereof
    3.
    发明授权
    Electronic device package and manufacturing method thereof 有权

    公开(公告)号：US10121696B2

    公开(公告)日：2018-11-06

    申请号：US15298251

    申请日：2016-10-20

    Applicant: Winbond Electronics Corp.

    Inventor： Yu-Hsuan Ho

    IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/768 ,  H01L23/498 ,  H01L21/56 ,  H01L23/14 ,  H01L23/15 ,  H01L23/31

    Abstract: An electronic device package and a manufacturing method thereof are provided. The electronic device package includes a flexible substrate, a first wiring structure, a first electronic device and a thermoplastic film having a second wiring structure. The first wiring structure is disposed on the flexible substrate. The first electronic device is disposed on the flexible substrate. The first electronic device and the first wiring structure are separated from each other. The thermoplastic film is welded to the flexible substrate and seals the first electronic device. The second wiring structure electrically connects the first wiring structure to the first electronic device. The electronic device package can be manufactured with a production cost.

    GAS DETECTING DEVICE
    4.
    发明申请
    GAS DETECTING DEVICE 审中-公开

    公开(公告)号：US20180202956A1

    公开(公告)日：2018-07-19

    申请号：US15594669

    申请日：2017-05-15

    Applicant: Winbond Electronics Corp.

    Inventor： Ming-Hung Hsieh ,  Yu-Hsuan Ho ,  Ming-Chih Tsai ,  Yen-Jui Chu

    IPC: G01N27/04 ,  G01N33/00 ,  G08B21/12

    CPC classification number: G08B21/12 ,  G01N27/125 ,  G01N33/0036 ,  G08B21/14

    Abstract: A gas detecting device configured to be attached to a surface includes a substrate, a semiconductor layer, a light-emitting component, a first electrode and a second electrode. The substrate includes a plurality of stacking layers stacked onto one another, and a material of the substrate includes cellulose nanofibrils (CNF). The substrate is formed by 3-D printing, such that a contact surface of the substrate is tightly attached to the surface. The semiconductor layer is formed on the substrate by 3-D printing. The light-emitting component is disposed on the substrate. The first electrode is coupled to the semiconductor layer and the light-emitting component. The second electrode is coupled to the semiconductor layer and a ground electrode. The first electrode and the second electrode are both disposed on the semiconductor layer and maintain a gap therebetween. A resistance of the semiconductor layer is changed according to a concentration of a designated gas.

    PARTICLE SENSING DEVICE AND ELECTRONIC APPARATUS HAVING THE SAME
    6.
    发明申请
    PARTICLE SENSING DEVICE AND ELECTRONIC APPARATUS HAVING THE SAME 审中-公开

    公开(公告)号：US20170292912A1

    公开(公告)日：2017-10-12

    申请号：US15252245

    申请日：2016-08-31

    Applicant: Winbond Electronics Corp.

    Inventor： Yu-Hsuan Ho ,  Yi-Der Wu

    IPC: G01N21/59

    CPC classification number: G01N15/00 ,  G01N15/0211 ,  G01N15/0272 ,  G01N2015/0046 ,  G01N2015/0693

    Abstract: A particle sensing device, which senses a particulate matter by using a light beam from a light source, is provided. The particle sensing device includes a columnar array and a light-sensing element. The columnar array is disposed at a downstream side of a traveling path of the light beam. The columnar array has a plurality of columnar objects. A gap is existed between two adjacent columnar objects. The light-sensing element is disposed opposite to the columnar array and at a downstream side of a traveling path of the light beam. Wherein, the traveling path of the light beam is parallel with a length direction of each columnar object. And, the light beam passes through the gap for arriving at the light-sensing element. The particle sensing device can sense the particulate matter satisfactorily and can be simply integrated into various electronic apparatuses.

    ELECTRONIC DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    ELECTRONIC DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20170236764A1

    公开(公告)日：2017-08-17

    申请号：US15298251

    申请日：2016-10-20

    Applicant: Winbond Electronics Corp.

    Inventor： Yu-Hsuan Ho

    IPC: H01L23/31 ,  H01L21/768 ,  H01L21/56 ,  H01L23/498 ,  H01L23/29

    CPC classification number: H01L21/76838 ,  H01L21/56 ,  H01L23/145 ,  H01L23/15 ,  H01L23/3121 ,  H01L23/49844 ,  H01L23/4985

    Abstract: An electronic device package and a manufacturing method thereof are provided. The electronic device package includes a flexible substrate, a first wiring structure, a first electronic device and a thermoplastic film having a second wiring structure. The first wiring structure is disposed on the flexible substrate. The first electronic device is disposed on the flexible substrate. The first electronic device and the first wiring structure are separated from each other. The thermoplastic film is welded to the flexible substrate and seals the first electronic device. The second wiring structure electrically connects the first wiring structure to the first electronic device. The electronic device package can be manufactured with a production cost.

    Reduction-oxidation sensor device and manufacturing method thereof
    8.
    发明授权
    Reduction-oxidation sensor device and manufacturing method thereof 有权

    公开(公告)号：US10697919B2

    公开(公告)日：2020-06-30

    申请号：US15867724

    申请日：2018-01-11

    Applicant: Winbond Electronics Corp.

    Inventor： Ming-Chih Tsai ,  Yu-Hsuan Ho ,  Yen-Jui Chu ,  Ming-Hung Hsieh

    IPC: G01N27/12 ,  B41J2/04

    Abstract: A reduction-oxidation sensor device and a manufacturing method thereof are provided. The reduction-oxidation sensor device includes a first electrode, at least one sensing structure and a second electrode. The first electrode is located on a substrate. The at least one sensing structure is located on the first electrode and the substrate. The at least one sensing structure includes a metal nanowire layer and a metal oxide layer. The metal nanowire layer is disposed on the first electrode and the substrate. The metal nanowire layer is wrapped by the metal oxide layer. The second electrode is located on the at least one sensing structure.

    Method for manufacturing circuit board
    9.
    发明授权
    Method for manufacturing circuit board 有权

    公开(公告)号：US10314174B2

    公开(公告)日：2019-06-04

    申请号：US15062990

    申请日：2016-03-07

    Applicant: Winbond Electronics Corp.

    Inventor： Yu-Hsuan Ho

    IPC: B05D5/12 ,  H05K3/12

    Abstract: A method for manufacturing a circuit board is provided, including providing a substrate. A first inkjet printing step is performed to apply a plurality of ink droplets to the substrate to form a plurality of microstructures arranged along a first direction. The microstructures therebetween form a plurality of recesses extended along a second direction that is different from the first direction. Also, a second inkjet printing step is performed to apply a plurality of conductive ink droplets to the microstructures, wherein the recesses between the microstructures are filled with the conductive ink droplets.

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