公开(公告)号：US20160014907A1

公开(公告)日：2016-01-14

申请号：US14719329

申请日：2015-05-22

Applicant: Wistron NeWeb Corp.

Inventor： Tzu-Wen Chuang ,  Babak Radi ,  Shih-Hong Chen ,  Chun-Lin Chen

IPC: H05K3/18 ,  H05K1/02 ,  H05K3/46 ,  H05K1/09

CPC classification number: C25D5/34 ,  C23C18/1603 ,  C23C18/1605 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  C23C18/48 ,  C23C22/02 ,  H05K3/384 ,  H05K3/387 ,  H05K3/389

Abstract: A manufacturing method of a substrate structure including the following steps is provided. A chemical surface treatment is performed on a metal base such that a passivation layer is formed on a surface of the metal base. The metal base is assembled to a substrate. A metal pattern is formed on the substrate, wherein the metal pattern is separated from the metal base. A substrate structure and a metal component are also provided.

Abstract translation: 提供了包括以下步骤的基板结构的制造方法。 在金属基体上进行化学表面处理，使得在金属基材的表面上形成钝化层。 将金属基底组装到基底上。 在基板上形成金属图案，其中金属图案与金属基体分离。 还提供了基板结构和金属部件。

公开(公告)号：US09657404B2

公开(公告)日：2017-05-23

申请号：US14316809

申请日：2014-06-27

Applicant: Wistron NeWeb Corp.

Inventor： Babak Radi ,  Shih-Hong Chen ,  Yu-Fu Kuo ,  Tzu-Wen Chuang

IPC: H05K3/10 ,  C25D5/02 ,  C25D5/56 ,  H05K3/24

CPC classification number: C25D5/02 ,  C25D5/56 ,  H05K3/105 ,  H05K3/24 ,  H05K2201/0257 ,  H05K2203/107

Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form a conductive pattern on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the conductive pattern is remained on the surface of the polymer substrate. Then, the conductive pattern on the polymer substrate is subjected to an electroplating process to form the metallic pattern over the conductive pattern on the polymer substrate.

公开(公告)号：US20160073508A1

公开(公告)日：2016-03-10

申请号：US14819432

申请日：2015-08-06

Applicant: Wistron NeWeb Corp.

Inventor： Tzu-Wen Chuang ,  Babak Radi ,  Shih-Hong Chen ,  Jing-Wen Chen

IPC: H05K3/18 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K3/184 ,  H05K3/0032 ,  H05K2201/0257 ,  H05K2203/0716 ,  H05K2203/072 ,  H05K2203/107

Abstract: A method for forming a metal pattern on a substrate having at least one metal component is provided. By performing the surface passivation treatment on the at least metal component, the surface of the at least metal component becomes an anti-plating surface via an anti-plating coating. Hence, the metal pattern can be selectively formed in the following electroless plating processes.

Abstract translation: 提供了在具有至少一种金属成分的基板上形成金属图案的方法。 通过对至少金属成分进行表面钝化处理，至少金属成分的表面经由防镀层成为防镀面。 因此，金属图案可以在以下的无电解电镀工艺中选择性地形成。

公开(公告)号：US20150366072A1

公开(公告)日：2015-12-17

申请号：US14304982

申请日：2014-06-16

Applicant: Wistron NeWeb Corp.

Inventor： Babak Radi ,  Yu-Fu Kuo

IPC: H05K3/10 ,  H05K3/00

CPC classification number: H05K3/185 ,  H04M1/0277 ,  H05K1/0215 ,  H05K1/023 ,  H05K1/0284 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/0346 ,  H05K1/165 ,  H05K3/0014 ,  H05K3/105 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/083 ,  H05K2201/09118 ,  H05K2201/10098 ,  Y10T29/49156

Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form active seed residues on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the active seed residues are remained on the surface of the polymer substrate. Then, the active seed residues on the polymer substrate are subjected to an electroless plating process to form the metallic pattern over the active seed residues on the polymer substrate.

Abstract translation: 提供了一种在聚合物基板上形成金属图案的方法。 在聚合物基材表面上形成混合层。 混合物层包括活性载体介质和分散在活性载体介质中的纳米颗粒。 执行激光处理以处理混合物层的一部分以在聚合物基材的表面上形成活性种子残留物。 进行清洁处理以除去混合物层的未处理部分以暴露聚合物基材的表面，同时活性种子残留物保留在聚合物基材的表面上。 然后，对聚合物基底上的活性种子残留物进行化学镀处理，以在聚合物基底上的活性种子残基上形成金属图案。

公开(公告)号：US10383254B2

公开(公告)日：2019-08-13

申请号：US15855545

申请日：2017-12-27

Applicant: Wistron NeWeb Corp.

Inventor： Hung-Ming Chang ,  Yi-Yun Chang ,  Shih-Hong Chen ,  Babak Radi ,  Sheng-Hung Tsai

IPC: F28D7/00 ,  H05K7/20 ,  G06F1/20 ,  H01L23/367 ,  H01L23/373

Abstract: An electronic device is provided. The electronic device includes a heat source, a heat-conductive member and a heat-dissipating sheet. The heat-conductive member includes a recess, wherein the recess is thermally connected to the heat source. The heat-dissipating sheet is attached to the heat-conductive member, wherein the heat-dissipating sheet covers the recess.

公开(公告)号：US10087527B2

公开(公告)日：2018-10-02

申请号：US14265369

申请日：2014-04-30

Applicant: Wistron NeWeb Corp.

Inventor： Babak Radi ,  Shih-Hong Chen ,  Yu-Fu Kuo ,  Chun-Lin Chen ,  Jing-Wen Chen

IPC: H01L23/528 ,  C23C18/16 ,  C23C18/18 ,  H01L23/532 ,  H01L23/522 ,  H01L23/498 ,  G03F7/20 ,  H01L23/06 ,  B32B15/04 ,  B32B15/08 ,  B32B15/20 ,  B32B3/02 ,  B32B3/30 ,  H05K3/10 ,  H05K3/24 ,  H05K1/09 ,  H05K3/00

Abstract: The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.

公开(公告)号：US09997839B2

公开(公告)日：2018-06-12

申请号：US14816048

申请日：2015-08-02

Applicant: Wistron NeWeb Corp.

Inventor： Babak Radi ,  Yuan-Chin Hsu ,  Yu-Fu Kuo ,  Tzu-Min Wu ,  Tzu-Wen Chuang ,  Shih-Hong Chen

IPC: H01Q17/00

CPC classification number: H01Q17/004

Abstract: A metal pattern formed in the electromagnetic absorber structure is provided. By performing the laser treatment to form the active layer thereon, the metal pattern can be regionally formed on the electromagnetic absorber structure in the following electroless plating processes.

公开(公告)号：US20150315708A1

公开(公告)日：2015-11-05

申请号：US14265369

申请日：2014-04-30

Applicant: Wistron NeWeb Corp.

Inventor： Babak Radi ,  Shih-Hong Chen ,  Yu-Fu Kuo ,  Chun-Lin Chen ,  Jing-Wen Chen

IPC: C23C18/16 ,  C23C18/18

CPC classification number: C23C18/1605 ,  B32B3/02 ,  B32B3/30 ,  B32B15/043 ,  B32B15/08 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/24 ,  B32B2457/00 ,  C23C18/182 ,  G03F7/202 ,  H01L23/06 ,  H01L23/49838 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/5228 ,  H01L23/528 ,  H01L23/53204 ,  H01L23/53228 ,  H01L23/53233 ,  H01L23/53242 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K1/09 ,  H05K3/0026 ,  H05K3/107 ,  H05K3/243 ,  H05K2201/0338 ,  H05K2203/072 ,  Y10T428/12361 ,  Y10T428/24331

Abstract: The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.

Abstract translation: 本公开涉及一种制造基板结构的方法和通过相同方法制造的基板结构。 该方法将包括直接在基底上形成第一金属层，在第一金属层上直接形成第一保护层，通过在第一保护层上直接使用包含硫醇基的化合物形成第二保护层， 以形成具有露出第一保护层的开口的图案，以及在第二保护层的开口内形成第二金属层，并且直接在第一保护层上。 衬底结构将包括基底，第一金属层，第一保护层，第二保护层和第二金属层。

公开(公告)号：US09790609B2

公开(公告)日：2017-10-17

申请号：US14719329

申请日：2015-05-22

Applicant: Wistron NeWeb Corp.

Inventor： Tzu-Wen Chuang ,  Babak Radi ,  Shih-Hong Chen ,  Chun-Lin Chen

IPC: H05K1/09 ,  C25D5/34 ,  H05K3/38

CPC classification number: C25D5/34 ,  C23C18/1603 ,  C23C18/1605 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  C23C18/48 ,  C23C22/02 ,  H05K3/384 ,  H05K3/387 ,  H05K3/389

Abstract: A manufacturing method of a substrate structure including the following steps is provided. A chemical surface treatment is performed on a metal base such that a passivation layer is formed on a surface of the metal base. The metal base is assembled to a substrate. A metal pattern is formed on the substrate, wherein the metal pattern is separated from the metal base. A substrate structure and a metal component are also provided.

公开(公告)号：US09595754B2

公开(公告)日：2017-03-14

申请号：US14583446

申请日：2014-12-26

Applicant: Wistron NeWeb Corp.

Inventor： Babak Radi ,  Yong-Jyun Lu ,  Ming-Chi Chiu ,  Chien-Min Hsu ,  Shih-Hong Chen

IPC: H01Q1/38 ,  H05K3/04 ,  H05K3/14 ,  H05K3/16 ,  H05K1/03 ,  H05K3/38 ,  H01Q1/22

CPC classification number: H01Q1/38 ,  H01Q1/22 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/0353 ,  H05K3/048 ,  H05K3/146 ,  H05K3/16 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K2203/107 ,  H05K2203/1184 ,  H05K2203/308

Abstract: A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided.

Abstract translation: 提供了一种用于形成图案化导电结构的方法。 该方法包括在基底表面上形成可溶层，其中可溶层具有露出表面粗糙部分的开口。 第一导电层形成在可溶层上，其中第一导电层延伸到开口中的粗糙部分上。 可溶层和可溶层上的第一导电层被去除，其中对应于粗糙部分的第一导电层的一部分残留在基底上。 还提供了通过该方法形成的图案化导电结构。