公开(公告)号：US09790609B2

公开(公告)日：2017-10-17

申请号：US14719329

申请日：2015-05-22

Applicant: Wistron NeWeb Corp.

Inventor： Tzu-Wen Chuang ,  Babak Radi ,  Shih-Hong Chen ,  Chun-Lin Chen

IPC: H05K1/09 ,  C25D5/34 ,  H05K3/38

CPC classification number: C25D5/34 ,  C23C18/1603 ,  C23C18/1605 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  C23C18/48 ,  C23C22/02 ,  H05K3/384 ,  H05K3/387 ,  H05K3/389

Abstract: A manufacturing method of a substrate structure including the following steps is provided. A chemical surface treatment is performed on a metal base such that a passivation layer is formed on a surface of the metal base. The metal base is assembled to a substrate. A metal pattern is formed on the substrate, wherein the metal pattern is separated from the metal base. A substrate structure and a metal component are also provided.

公开(公告)号：US10087527B2

公开(公告)日：2018-10-02

申请号：US14265369

申请日：2014-04-30

Applicant: Wistron NeWeb Corp.

Inventor： Babak Radi ,  Shih-Hong Chen ,  Yu-Fu Kuo ,  Chun-Lin Chen ,  Jing-Wen Chen

IPC: H01L23/528 ,  C23C18/16 ,  C23C18/18 ,  H01L23/532 ,  H01L23/522 ,  H01L23/498 ,  G03F7/20 ,  H01L23/06 ,  B32B15/04 ,  B32B15/08 ,  B32B15/20 ,  B32B3/02 ,  B32B3/30 ,  H05K3/10 ,  H05K3/24 ,  H05K1/09 ,  H05K3/00

Abstract: The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.

公开(公告)号：US20150315708A1

公开(公告)日：2015-11-05

申请号：US14265369

申请日：2014-04-30

Applicant: Wistron NeWeb Corp.

Inventor： Babak Radi ,  Shih-Hong Chen ,  Yu-Fu Kuo ,  Chun-Lin Chen ,  Jing-Wen Chen

IPC: C23C18/16 ,  C23C18/18

CPC classification number: C23C18/1605 ,  B32B3/02 ,  B32B3/30 ,  B32B15/043 ,  B32B15/08 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/24 ,  B32B2457/00 ,  C23C18/182 ,  G03F7/202 ,  H01L23/06 ,  H01L23/49838 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/5228 ,  H01L23/528 ,  H01L23/53204 ,  H01L23/53228 ,  H01L23/53233 ,  H01L23/53242 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K1/09 ,  H05K3/0026 ,  H05K3/107 ,  H05K3/243 ,  H05K2201/0338 ,  H05K2203/072 ,  Y10T428/12361 ,  Y10T428/24331

Abstract: The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.

Abstract translation: 本公开涉及一种制造基板结构的方法和通过相同方法制造的基板结构。 该方法将包括直接在基底上形成第一金属层，在第一金属层上直接形成第一保护层，通过在第一保护层上直接使用包含硫醇基的化合物形成第二保护层， 以形成具有露出第一保护层的开口的图案，以及在第二保护层的开口内形成第二金属层，并且直接在第一保护层上。 衬底结构将包括基底，第一金属层，第一保护层，第二保护层和第二金属层。

公开(公告)号：US20160014907A1

公开(公告)日：2016-01-14

申请号：US14719329

申请日：2015-05-22

Applicant: Wistron NeWeb Corp.

Inventor： Tzu-Wen Chuang ,  Babak Radi ,  Shih-Hong Chen ,  Chun-Lin Chen

IPC: H05K3/18 ,  H05K1/02 ,  H05K3/46 ,  H05K1/09

CPC classification number: C25D5/34 ,  C23C18/1603 ,  C23C18/1605 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  C23C18/48 ,  C23C22/02 ,  H05K3/384 ,  H05K3/387 ,  H05K3/389

Abstract: A manufacturing method of a substrate structure including the following steps is provided. A chemical surface treatment is performed on a metal base such that a passivation layer is formed on a surface of the metal base. The metal base is assembled to a substrate. A metal pattern is formed on the substrate, wherein the metal pattern is separated from the metal base. A substrate structure and a metal component are also provided.

Abstract translation: 提供了包括以下步骤的基板结构的制造方法。 在金属基体上进行化学表面处理，使得在金属基材的表面上形成钝化层。 将金属基底组装到基底上。 在基板上形成金属图案，其中金属图案与金属基体分离。 还提供了基板结构和金属部件。