公开(公告)号：US10087527B2

公开(公告)日：2018-10-02

申请号：US14265369

申请日：2014-04-30

Applicant: Wistron NeWeb Corp.

Inventor： Babak Radi ,  Shih-Hong Chen ,  Yu-Fu Kuo ,  Chun-Lin Chen ,  Jing-Wen Chen

IPC: H01L23/528 ,  C23C18/16 ,  C23C18/18 ,  H01L23/532 ,  H01L23/522 ,  H01L23/498 ,  G03F7/20 ,  H01L23/06 ,  B32B15/04 ,  B32B15/08 ,  B32B15/20 ,  B32B3/02 ,  B32B3/30 ,  H05K3/10 ,  H05K3/24 ,  H05K1/09 ,  H05K3/00

Abstract: The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.

公开(公告)号：US20150315708A1

公开(公告)日：2015-11-05

申请号：US14265369

申请日：2014-04-30

Applicant: Wistron NeWeb Corp.

Inventor： Babak Radi ,  Shih-Hong Chen ,  Yu-Fu Kuo ,  Chun-Lin Chen ,  Jing-Wen Chen

IPC: C23C18/16 ,  C23C18/18

CPC classification number: C23C18/1605 ,  B32B3/02 ,  B32B3/30 ,  B32B15/043 ,  B32B15/08 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/24 ,  B32B2457/00 ,  C23C18/182 ,  G03F7/202 ,  H01L23/06 ,  H01L23/49838 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/5228 ,  H01L23/528 ,  H01L23/53204 ,  H01L23/53228 ,  H01L23/53233 ,  H01L23/53242 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K1/09 ,  H05K3/0026 ,  H05K3/107 ,  H05K3/243 ,  H05K2201/0338 ,  H05K2203/072 ,  Y10T428/12361 ,  Y10T428/24331

Abstract: The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.

Abstract translation: 本公开涉及一种制造基板结构的方法和通过相同方法制造的基板结构。 该方法将包括直接在基底上形成第一金属层，在第一金属层上直接形成第一保护层，通过在第一保护层上直接使用包含硫醇基的化合物形成第二保护层， 以形成具有露出第一保护层的开口的图案，以及在第二保护层的开口内形成第二金属层，并且直接在第一保护层上。 衬底结构将包括基底，第一金属层，第一保护层，第二保护层和第二金属层。

公开(公告)号：US20160073508A1

公开(公告)日：2016-03-10

申请号：US14819432

申请日：2015-08-06

Applicant: Wistron NeWeb Corp.

Inventor： Tzu-Wen Chuang ,  Babak Radi ,  Shih-Hong Chen ,  Jing-Wen Chen

IPC: H05K3/18 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K3/184 ,  H05K3/0032 ,  H05K2201/0257 ,  H05K2203/0716 ,  H05K2203/072 ,  H05K2203/107

Abstract: A method for forming a metal pattern on a substrate having at least one metal component is provided. By performing the surface passivation treatment on the at least metal component, the surface of the at least metal component becomes an anti-plating surface via an anti-plating coating. Hence, the metal pattern can be selectively formed in the following electroless plating processes.

Abstract translation: 提供了在具有至少一种金属成分的基板上形成金属图案的方法。 通过对至少金属成分进行表面钝化处理，至少金属成分的表面经由防镀层成为防镀面。 因此，金属图案可以在以下的无电解电镀工艺中选择性地形成。