公开(公告)号：US20110193954A1

公开(公告)日：2011-08-11

申请号：US12701671

申请日：2010-02-08

Applicant: Wojciech Jan Walecki

Inventor： Wojciech Jan Walecki

IPC: H04N7/18

CPC classification number: G01B11/24 ,  G01B11/306

Abstract: The apparatus for measurement of the topography of transparent surfaces is described. This is achieved by the observation and evaluation of patterns produced by optical beam emitted by projector, reflected from the measured surface, and projecting images on the screen. If the measured surface has photoelectric properties, then the same optical beam can be used to modulate the electrical currents and voltages measured in the measured material and produce spatially resolved data characterizing the photo-electric response of the sample.

Abstract translation: 描述了用于测量透明表面的形状的装置。 这是通过观察和评估由投影仪发射的光束产生的图案，从测量的表面反射并在屏幕上投射图像来实现的。 如果测量的表面具有光电特性，则可以使用相同的光束来调制在测量的材料中测量的电流和电压，并产生表征样品的光电响应的空间分辨数据。

公开(公告)号：US20230160687A1

公开(公告)日：2023-05-25

申请号：US17532308

申请日：2021-11-22

Applicant: Wojciech Jan Walecki

Inventor： Wojciech Jan Walecki

IPC: G01B11/06 ,  G01J3/02 ,  G01J3/42

CPC classification number: G01B11/06 ,  G01J3/0218 ,  G01J3/42

Abstract: The invention describes a metrology system allowing for the reduction of the errors caused by vibration of the production floor and allowing for measurements of the thickness of wafers in motion. This is accomplished by performing simultaneous measurements of spectra containing interference signals containing distance information using a plurality of probes positioned on both sides of the measured wafer on the same detector at the same time or by means of plurality of synchronized detectors. System is also able to measure thickness of the individual optically accessible layers present in the sample.

公开(公告)号：US20210310795A1

公开(公告)日：2021-10-07

申请号：US16842743

申请日：2020-04-07

Applicant: Wojciech Jan Walecki

Inventor： Wojciech Jan Walecki

IPC: G01B11/06 ,  G01B9/02

Abstract: We describe apparatus for measurement of thickness and topography of slabs of materials employing probes with filters using polarization maintaining fibers.

公开(公告)号：US11885609B2

公开(公告)日：2024-01-30

申请号：US17532308

申请日：2021-11-22

Applicant: Wojciech Jan Walecki

Inventor： Wojciech Jan Walecki

IPC: G01B11/06 ,  G01J3/42 ,  G01J3/02

CPC classification number: G01B11/06 ,  G01J3/0218 ,  G01J3/42

Abstract: The invention describes a metrology system allowing for the reduction of the errors caused by vibration of the production floor and allowing for measurements of the thickness of wafers in motion. This is accomplished by performing simultaneous measurements of spectra containing interference signals containing distance information using a plurality of probes positioned on both sides of the measured wafer on the same detector at the same time or by means of plurality of synchronized detectors. System is also able to measure thickness of the individual optically accessible layers present in the sample.

公开(公告)号：US11226190B2

公开(公告)日：2022-01-18

申请号：US16842743

申请日：2020-04-07

Applicant: Wojciech Jan Walecki

Inventor： Wojciech Jan Walecki

IPC: G01B9/02 ,  G01B11/06

Abstract: We describe apparatus for measurement of thickness and topography of slabs of materials employing probes with filters using polarization maintaining fibers.