-
公开(公告)号：US12074583B2
公开(公告)日：2024-08-27
申请号：US17317408
申请日：2021-05-11
Applicant: X Display Company Technology Limited
Inventor： Matthew Alexander Meitl , Christopher Andrew Bower , Salvatore Bonafede , Carl Ray Prevatte, Jr. , Ronald S. Cok , Brook Raymond
CPC classification number: H03H9/0509 , B41F16/00 , H03H3/02 , H03H9/105
Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.
-
公开(公告)号：US20240105698A1
公开(公告)日：2024-03-28
申请号：US18532431
申请日：2023-12-07
Applicant: X Display Company Technology Limited
Inventor： Christopher Andrew Bower , Matthew Alexander Meitl , Ronald S. Cok , Salvatore Bonafede , Brook Raymond , Andrew Tyler Pearson , Erik Paul Vick
CPC classification number: H01L25/167 , H01L23/481 , H01L25/50 , H01L27/15 , H01L33/54
Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.
-
公开(公告)号：US20220232707A1
公开(公告)日：2022-07-21
申请号：US17705763
申请日：2022-03-28
Applicant: X Display Company Technology Limited
Abstract: An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.
-
公开(公告)号：US20220085235A1
公开(公告)日：2022-03-17
申请号：US17531567
申请日：2021-11-19
Applicant: X Display Company Technology Limited
Inventor： Brook Raymond , Christopher Andrew Bower , Matthew Meitl , Ronald S. Cok
Abstract: A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.
-
公开(公告)号：US11101417B2
公开(公告)日：2021-08-24
申请号：US16532591
申请日：2019-08-06
Applicant: X Display Company Technology Limited
Inventor： Christopher Andrew Bower , Matthew Alexander Meitl , Ronald S. Cok , Salvatore Bonafede , Brook Raymond , Andrew Tyler Pearson
IPC: H01L33/62 , H01L23/48 , H01L23/498 , H01L23/52
Abstract: A printed structure includes a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate, a component disposed on the surface, and two or more electrically conductive connection posts. Each of the connection posts extends from a common side of the component. Each of the connection posts is in electrical and physical contact with one of the contact pads. The component is tilted with respect to the surface of the destination substrate. Each of the connection posts has a flat distal surface.
-
Patent Agency Ranking
公开(公告)号：US20200335381A1
公开(公告)日：2020-10-22
申请号：US16921556
申请日：2020-07-06
Applicant: X Display Company Technology Limited
Inventor： Christopher Andrew Bower , Matthew Meitl , Salvatore Bonafede , Brook Raymond , Carl Ray Prevatte, JR.
IPC: H01L21/683 , B41F16/00 , H01L21/67 , H01L33/00
Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.
-
公开(公告)号：US11705439B2
公开(公告)日：2023-07-18
申请号：US17157886
申请日：2021-01-25
Applicant: X Display Company Technology Limited
Inventor： Matthew Alexander Meitl , Christopher Andrew Bower , Ronald S. Cok , Brook Raymond
IPC: H01L29/20 , H01L33/00 , H01L25/075 , H01L25/16 , H01L33/62
CPC classification number: H01L25/0753 , H01L25/167 , H01L33/62 , H01L2933/0066
Abstract: A multi-color LED display comprises pixels, each comprising a first sub-pixel, a second sub-pixel, and a third sub-pixel. The first sub-pixel comprises a first light-emitting diode (LED) that emits a first color of light, the second sub-pixel comprises second LEDs that emit a second color of light different from the first color of light, and the third sub-pixel comprises third LEDs that emit a third color of light different from the first color of light and different from the second color of light. The second LEDs are electrically connected in parallel and the third LEDs are electrically connected in series.
-
公开(公告)号：US20230091571A1
公开(公告)日：2023-03-23
申请号：US17986767
申请日：2022-11-14
Applicant: X Display Company Technology Limited
Abstract: An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.
-
公开(公告)号：US20210043618A1
公开(公告)日：2021-02-11
申请号：US17030347
申请日：2020-09-23
Applicant: X Display Company Technology Limited
Inventor： Christopher Andrew Bower , Matthew Alexander Meitl , Ronald S. Cok , Salvatore Bonafede , Brook Raymond , Andrew Tyler Pearson , Erik Paul Vick
Abstract: An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.
-
公开(公告)号：US11600744B2
公开(公告)日：2023-03-07
申请号：US17531567
申请日：2021-11-19
Applicant: X Display Company Technology Limited
Inventor： Brook Raymond , Christopher Andrew Bower , Matthew Meitl , Ronald S. Cok
Abstract: A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.
-
-
-
-
-
-
-
-
-
Search Results
38
records
(took 0.021 seconds)
