公开(公告)号：US20210225815A1

公开(公告)日：2021-07-22

申请号：US17203314

申请日：2021-03-16

Applicant: X Display Company Technology Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L25/075 ,  G09G3/32 ,  H01L33/38 ,  H01L23/482 ,  H01L23/538 ,  H05B45/50 ,  G02F1/167 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  G02B26/04 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  G09G3/22 ,  H01L27/15 ,  F21V9/08 ,  H01L33/58

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US20230146788A1

公开(公告)日：2023-05-11

申请号：US17984748

申请日：2022-11-10

Applicant: X Display Company Technology Limited

Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

IPC: H01L23/00 ,  H05K3/34 ,  H05K1/11

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H05K3/3436 ,  H01L24/08 ,  H05K1/112 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/1357 ,  H01L2224/1418 ,  H01L2224/17107 ,  H01L2224/1144 ,  H05K3/305

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

公开(公告)号：US11552034B2

公开(公告)日：2023-01-10

申请号：US16702398

申请日：2019-12-03

Applicant: X Display Company Technology Limited

Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

IPC: H01L23/00 ,  H05K3/34 ,  H05K1/11 ,  H05K3/30

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

公开(公告)号：US20200243467A1

公开(公告)日：2020-07-30

申请号：US16778964

申请日：2020-01-31

Applicant: X Display Company Technology Limited

Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

IPC: H01L23/00 ,  H05K1/11 ,  H05K3/34 ,  H05K3/30

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

公开(公告)号：US20240170430A1

公开(公告)日：2024-05-23

申请号：US18515364

申请日：2023-11-21

Applicant: X Display Company Technology Limited

Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

IPC: H01L23/00 ,  H01L21/48 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01L24/11 ,  H01L24/08 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H05K1/112 ,  H05K3/3436 ,  H01L21/4803 ,  H01L21/4846 ,  H01L2224/1144 ,  H01L2224/11466 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/1357 ,  H01L2224/1403 ,  H01L2224/1412 ,  H01L2224/1418 ,  H01L2224/16227 ,  H01L2224/1624 ,  H01L2224/17107 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1304 ,  H05K3/305 ,  H05K2201/09409 ,  H05K2201/09472 ,  H05K2201/0979 ,  H05K2201/10143

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

公开(公告)号：US20240153927A1

公开(公告)日：2024-05-09

申请号：US18507597

申请日：2023-11-13

Applicant: X Display Company Technology Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L25/075 ,  F21V9/08 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  H01L23/482 ,  H01L23/538 ,  H01L25/16 ,  H01L27/15 ,  H01L33/36 ,  H01L33/38 ,  H01L33/48 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00

CPC classification number: H01L25/0753 ,  F21V9/08 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/167 ,  H01L27/156 ,  H01L33/36 ,  H01L33/38 ,  H01L33/385 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  F21Y2105/10 ,  G09G2300/0452 ,  G09G2300/0842

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US11495560B2

公开(公告)日：2022-11-08

申请号：US16778964

申请日：2020-01-31

Applicant: X Display Company Technology Limited

Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

IPC: H01L23/00 ,  H05K3/34 ,  H05K1/11 ,  H05K3/30

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

公开(公告)号：US11990438B2

公开(公告)日：2024-05-21

申请号：US17984748

申请日：2022-11-10

Applicant: X Display Company Technology Limited

Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

IPC: H01L23/00 ,  H01L21/48 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01L24/11 ,  H01L24/08 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H05K1/112 ,  H05K3/3436 ,  H01L21/4803 ,  H01L21/4846 ,  H01L2224/1144 ,  H01L2224/11466 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/1357 ,  H01L2224/1403 ,  H01L2224/1412 ,  H01L2224/1418 ,  H01L2224/16227 ,  H01L2224/1624 ,  H01L2224/17107 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1304 ,  H05K3/305 ,  H05K2201/09409 ,  H05K2201/09472 ,  H05K2201/0979 ,  H05K2201/10143 ,  H01L2924/12041 ,  H01L2924/00012 ,  H01L2924/12044 ,  H01L2924/00012 ,  H01L2924/12043 ,  H01L2924/00012 ,  H01L2924/1304 ,  H01L2924/00012

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

公开(公告)号：US11854788B2

公开(公告)日：2023-12-26

申请号：US17203314

申请日：2021-03-16

Applicant: X Display Company Technology Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L25/075 ,  G09G3/32 ,  H01L33/38 ,  H01L23/482 ,  H01L23/538 ,  G02F1/167 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  G02B26/04 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  G09G3/22 ,  H01L27/15 ,  F21V9/08 ,  H01L33/58 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y113/13 ,  H01L33/20 ,  H01L33/40

CPC classification number: H01L25/0753 ,  F21V9/08 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/167 ,  H01L27/156 ,  H01L33/36 ,  H01L33/38 ,  H01L33/385 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  G09G2300/0452 ,  G09G2300/0842 ,  G09G2310/0264 ,  H01L33/20 ,  H01L33/405 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05K2201/0329 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US20210384290A1

公开(公告)日：2021-12-09

申请号：US17405323

申请日：2021-08-18

Applicant: X Display Company Technology Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  Carl Prevatte ,  Ronald S. Cok

IPC: H01L27/32 ,  H01L27/15 ,  H01L27/146 ,  H01L25/075

Abstract: A single metal layer device, such as a display or sensor, comprises a substrate and a patterned metal layer. The patterned metal layer forms a two-dimensional array of spatially separated column line segments that each extend only partially across the display substrate in a column direction and forms a one-dimensional array of row lines extending across the display substrate in a row direction different from the column direction. The row lines and column line segments are electrically separate in the patterned metal layer. Spatially separated electrical jumpers are disposed on the display substrate and electrically connect pairs of column line segments adjacent in the column direction. Each electrical jumper has an independent jumper substrate independent of and separate from the display substrate. In certain embodiments, spatially separated light-emitting pixel circuits are disposed on a display substrate and are electrically connected to at least one row line and one column line.