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    Transfer stamps with multiple separate pedestals
    1.
    发明授权
    Transfer stamps with multiple separate pedestals 有权

    公开(公告)号：US11062936B1

    公开(公告)日：2021-07-13

    申请号：US16721897

    申请日：2019-12-19

    Applicant: X Display Company Technology Limited

    Inventor： Tanya Yvette Moore ,  David Gomez

    IPC: H01L21/687 ,  B29C59/02 ,  H01L21/677 ,  H01L21/683

    Abstract: A stamp for micro-transfer printing comprises a rigid support having a support coefficient of thermal expansion (support CTE). Pedestals are disposed on (e.g., directly on and in contact with) the rigid support. Each of the pedestals is spatially separated from any other of the pedestals. The pedestals have a pedestal coefficient of thermal expansion (pedestal CTE) and the pedestal CTE is greater than the support CTE. Posts are disposed on (e.g., directly on and in contact with) each of the pedestals. Each post has a post coefficient of thermal expansion (post CTE) that is greater than the support CTE.

    Multi-layer stamp
    2.
    发明授权
    Multi-layer stamp 有权

    公开(公告)号：US10899067B2

    公开(公告)日：2021-01-26

    申请号：US14975041

    申请日：2015-12-18

    Applicant: X Display Company Technology Limited

    Inventor： Tanya Yvette Moore ,  Ronald S. Cok ,  David Gomez

    IPC: B29C59/02 ,  H01L23/00 ,  H01L21/683 ,  B41F17/00 ,  B29C59/00 ,  B29L31/34 ,  B41F16/00 ,  B29L7/00

    Abstract: A stamp for micro-transfer printing includes a support having a support stiffness and a support coefficient of thermal expansion (CTE). A pedestal layer is formed on the support, the pedestal layer having a pedestal layer stiffness that is less than the support stiffness and a pedestal layer coefficient of thermal expansion (CTE) that is different from the support coefficient of thermal expansion (CTE). A stamp layer is formed on the pedestal layer, the stamp layer having a body and one or more protrusions extending from the body in a direction away from the pedestal layer. The stamp layer has a stamp layer stiffness that is less than the support stiffness and a stamp layer coefficient of thermal expansion that is different from the support coefficient of thermal expansion.

    High-precision printed structures
    7.
    发明授权
    High-precision printed structures 有权

    公开(公告)号：US10714374B1

    公开(公告)日：2020-07-14

    申请号：US16408155

    申请日：2019-05-09

    Applicant: X Display Company Technology Limited

    Inventor： Ronald S. Cok ,  David Gomez ,  Tanya Yvette Moore ,  Matthew Alexander Meitl ,  Christopher Andrew Bower

    IPC: H01L21/683 ,  H01L33/00 ,  H01L31/18 ,  H01L21/52

    Abstract: An example of a printed structure comprises a target substrate and a structure protruding from a surface of the target substrate. A component comprising a component substrate separate and independent from the target substrate is disposed in alignment with the structure on the surface of the target substrate within 1 micron of the structure. An example method of making a printed structure comprises providing the target substrate with the structure protruding from the target substrate, a transfer element, and a component adhered to the transfer element. The component comprises a component substrate separate and independent from the target substrate. The transfer element and adhered component move vertically toward the surface of the target substrate and horizontally towards the structure until the component physically contacts the structure or is adhered to the surface of the target substrate. The transfer element is separated from the component.

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