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    TRANSFER-PRINTED MICRO-OPTICAL COMPONENTS
    1.
    发明公开
    TRANSFER-PRINTED MICRO-OPTICAL COMPONENTS 审中-公开

    公开(公告)号：US20240118489A1

    公开(公告)日：2024-04-11

    申请号：US18062844

    申请日：2022-12-07

    Applicant: X-Celeprint Limited ,  SUSS MicroOptics SA

    Inventor： Ronald S. Cok ,  Wilfried Noell ,  David Gomez ,  Ruggero Loi

    IPC: G02B6/12 ,  G02B6/138

    CPC classification number: G02B6/12004 ,  G02B6/138 ,  G02B2006/12085 ,  G02B2006/12173 ,  G02B2006/12176

    Abstract: An exemplary micro-optical component includes a micro-substrate and a micro-optical element disposed on the micro-substrate. The micro-optical element is structured to modify or process light. At least a portion of a component tether is physically attached to the micro-substrate or physically attached to the micro-optical element. The micro-optical component has a thickness less than 250 μm. Light can be processed by reflection, refraction, diffraction, frequency changes, polarization changes, color-temperature or frequency distribution changes, or phase changes. The micro-optical component can be disposed on a system substrate to form a micro-optical system. The system substrate can include a cavity and the micro-optical element can be disposed at least partially in the cavity. Micro-optical components can be passive optical micro-devices. A light-active element can be disposed on the micro-substrate to receive light from or emit light to the micro-optical element.

    Printable inorganic semiconductor structures
    3.
    发明授权
    Printable inorganic semiconductor structures 有权

    公开(公告)号：US10522710B2

    公开(公告)日：2019-12-31

    申请号：US16502387

    申请日：2019-07-03

    Applicant: X-Celeprint Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Carl Prevatte ,  Salvatore Bonafede

    IPC: H01L31/0256 ,  H01L33/00 ,  H01L33/32 ,  H01L33/62 ,  H01L33/44 ,  H01L33/36 ,  H01L33/38 ,  H01L29/78 ,  H01L33/26 ,  H01L33/40 ,  H01L21/683 ,  H01L33/20

    Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

    Printable inorganic semiconductor structures
    4.
    发明授权
    Printable inorganic semiconductor structures 有权

    公开(公告)号：US10109764B2

    公开(公告)日：2018-10-23

    申请号：US15705785

    申请日：2017-09-15

    Applicant: X-Celeprint Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Carl Prevatte ,  Salvatore Bonafede

    IPC: H01L33/00 ,  H01L21/00 ,  H01L21/30 ,  H01L21/46 ,  H01L21/683 ,  H01L33/44 ,  H01L33/36 ,  H01L33/62

    Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

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