BOTTOM-UP METHOD FOR FORMING WIRE STRUCTURES UPON A SUBSTRATE

    公开(公告)号:US20190106804A1

    公开(公告)日:2019-04-11

    申请号:US16087462

    申请日:2017-03-21

    Applicant: XTPL S.A.

    Abstract: A method is provided for forming structures upon a substrate. The method comprises: depositing fluid onto a substrate so as to define a wetted region, the fluid containing electrically polahzable nanoparticles; applying an alternating electric field to the fluid on the region, using a first electrode and a second electrode, so that a plurality of the nanoparticles are assembled to form an elongate structure extending from the first electrode towards the second electrode; and removing the fluid such that the elongate structure remains upon the substrate.

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