公开(公告)号：US08256111B2

公开(公告)日：2012-09-04

申请号：US12645303

申请日：2009-12-22

Applicant: Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

Inventor： Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

IPC: H05K3/02 ,  H05K3/10

CPC classification number: H01L23/50 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0224 ,  H05K1/0253 ,  H05K2201/09281 ,  H05K2201/09681 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A method for laying out a circuit board includes following steps. A substrate board is formed with a plurality of board sides. A ground plane, including a plurality of tiles, is provided. Each ground trace tile is defined by a plurality of ground traces. A signal plane on the substrate board has a plurality of signal traces that comprise of a plurality of straight line segments. Any one ground trace of each tile is arranged at an angle other than zero degrees relative to one determined board side. The straight line segments is applied to be mapped on the ground plane crossing one ground trace of one tile within an angle range determined by the ground traces of the tile and an adjacent diagonal line of the tile. The one ground trace and the straight line segments are applied at an angle movable in a range from 22.5° to 32.5°.

Abstract translation: 布线电路板的方法包括以下步骤。 衬底板形成有多个板侧。 提供包括多个瓦片的接地平面。 每个接地迹线瓦片由多个接地迹线限定。 衬底板上的信号平面具有包括多个直线段的多个信号迹线。 每个瓦片的任何一个接地迹线相对于一个确定的电路板侧以非零度的角度布置。 直线段被施加以映射在跨越由瓦片的接地轨迹和瓦片的相邻对角线确定的角度范围内的一个瓦片的一个接地轨迹的接地平面上。 一个接地迹线和直线段以可在22.5°至32.5°的范围内的角度施加。

公开(公告)号：US07973244B2

公开(公告)日：2011-07-05

申请号：US11765453

申请日：2007-06-20

Applicant: Yu-Hsu Lin ,  Chan-Fei Tai ,  Jeng-Da Wu ,  Chih-Hang Chao

Inventor： Yu-Hsu Lin ,  Chan-Fei Tai ,  Jeng-Da Wu ,  Chih-Hang Chao

IPC: H05K1/03

CPC classification number: H05K1/0248 ,  H05K1/025 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/09227 ,  H05K2201/09281

Abstract: A printed circuit board includes a base formed from a plurality of woven fibers, and signal traces laid on the base. Each of the signal traces includes at least a straight line segment. The signal traces are laid on the base in such a manner that the line segments of the signal traces mapped on the base cross the fibers at angles not equal to zero degrees.

Abstract translation: 印刷电路板包括由多根编织纤维形成的底座和放置在基座上的信号迹线。 每个信号迹线至少包括直线段。 信号迹线以这样的方式铺设在基座上，使得映射在基座上的信号迹线的线段以不等于零度的角度跨越光纤。

公开(公告)号：US07447039B2

公开(公告)日：2008-11-04

申请号：US11309887

申请日：2006-10-17

Applicant: Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

Inventor： Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

IPC: H05K1/00

CPC classification number: H05K1/181 ,  H05K1/0203 ,  H05K2201/09418 ,  H05K2201/10522 ,  H05K2201/10598 ,  H05K2201/10734 ,  Y02P70/611

Abstract: A motherboard includes a circuit board, a first chip and a second chip disposed on the circuit board. Four securing holes are defined in the circuit board around the first chip, for mounting a heat dissipating module on the first chip. Two of the securing holes determine a first line, and the other two securing holes determine a second line parallel to the first line. A center of the second chip is located along a centerline between the first and second lines. Should the circuit board suffer from an impact, damage to the chips may be effectively minimized or prevented.

Abstract translation: 主板包括电路板，第一芯片和设置在电路板上的第二芯片。 在第一芯片周围的电路板中定义了四个固定孔，用于将散热模块安装在第一芯片上。 两个固定孔确定第一条线，另外两个固定孔确定与第一条线平行的第二条线。 第二芯片的中心位于第一和第二线之间的中心线处。 如果电路板受到冲击，可以有效地最小化或防止对芯片的损坏。

公开(公告)号：US20080089031A1

公开(公告)日：2008-04-17

申请号：US11309883

申请日：2006-10-17

Applicant: Jeng-Da Wu ,  Chih-Hang Chao ,  Yu-Hsu Lin

Inventor： Jeng-Da Wu ,  Chih-Hang Chao ,  Yu-Hsu Lin

IPC: H05K7/20

CPC classification number: H01L23/4093 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A heat sink assembly includes a printed circuit board, a chip mounted on a top surface of the board, and a heat sink attached onto the chip of the board. The heat sink includes a base, a plurality of fins extending up from the base, and a plurality of legs extending down from the base. The legs of the heat sink contact the top surface of the board to support the heat sink.

Abstract translation: 散热器组件包括印刷电路板，安装在板的顶表面上的芯片和附接到板的芯片上的散热器。 散热器包括基座，从基座向上延伸的多个翅片以及从基座向下延伸的多个腿部。 散热片的腿部接触板的顶面以支撑散热片。

公开(公告)号：US06257904B1

公开(公告)日：2001-07-10

申请号：US09525991

申请日：2000-03-15

Applicant: Yu-Hsu Lin

Inventor： Yu-Hsu Lin

IPC: H05K100

CPC classification number: H05K1/141 ,  H01R12/52 ,  H05K3/3436 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/0949 ,  H05K2201/10325 ,  H05K2201/10734

Abstract: A connector assembly (10) includes a housing (12) defining a plurality of passageways (14) to receive a corresponding number of contacts (16) therein. Each contact (16) includes a pin type contact leg section (18) extending out of the undersurface (20) of the housing (12) with a substantial distance. An interposer plate (22) which is of the same or similar property as the PC board (100) on which the connector assembly (10) is mounted, is disposed on the undersurface (20) of the housing (12). A plurality of through holes (24) are provided within the interposer plate (22) in alignment with the corresponding passageways (14) so that the distal end portion (19) of the leg section (18) of each contact (16) can extend into and through the corresponding hole (24). A solder ball (26) is attachably implanted to the undersurface (28) of the interposer plate (22) beside each hole (24), and a trace (30) is provided between each solder ball (26) and the corresponding hole (24) for electrical interconnection therebetween.

Abstract translation: 连接器组件（10）包括限定多个通道（14）的壳体（12），以在其中接收相应数量的触点（16）。 每个触点（16）包括一个以类似距离延伸出壳体（12）的下表面（20）的销式接触腿部分（18）。 与安装有连接器组件（10）的PC板（100）具有相同或相似性质的插入板（22）设置在壳体（12）的下表面（20）上。 多个通孔（24）设置在内插板（22）内，与对应的通道（14）对准，使得每个触点（16）的腿部（18）的远端部分（19）能够延伸 穿过相应的孔（24）。 在每个孔（24）旁边，将焊球（26）可附接地注入到插入板（22）的下表面（28）上，并且在每个焊球（26）和相应的孔（24）之间提供迹线 ）之间进行电气互连。

公开(公告)号：US6155845A

公开(公告)日：2000-12-05

申请号：US222239

申请日：1998-12-28

Applicant: Yu-Hsu Lin ,  Ming-Lun Szu

Inventor： Yu-Hsu Lin ,  Ming-Lun Szu

IPC: H01R4/02 ,  H01R12/57 ,  H05K3/34 ,  H05K7/10 ,  H01R12/00

CPC classification number: H01R12/57 ,  H01R4/028 ,  H05K3/3436 ,  H05K7/1061 ,  H05K2201/10189 ,  H05K2203/041 ,  H05K3/3426 ,  Y02P70/613

Abstract: An electrical contact for use with a BGA socket comprises an engaging section and a connecting section attached thereto. The connecting section comprises a circular solder plate attached directly below an elongate body of the engaging section thereby providing the contact with increased durability. The engaging section is inserted into the corresponding passageway of the housing from a bottom surface thereof whereby the circular solder plate effectively covers an opening of the passageway. Flux is applied to the solder plates of the contacts by means of a screening process and the contacts will not deform under pressure of a squeegee. A solder ball is attached to the solder plate and positioning mechanism ensures that the solder ball adheres to a central portion thereof.

Abstract translation: 与BGA插座一起使用的电触点包括接合部分和连接到其上的连接部分。 连接部分包括直接连接在接合部分的细长主体下面的圆形焊接板，从而为接触提供更高的耐久性。 接合部从其底面插入到壳体的相应通道中，由此圆形焊盘有效地覆盖通道的开口。 通过筛选过程将焊剂施加到触点的焊盘上，并且触点在刮板的压力下不会变形。 焊锡球附着在焊盘上，并且定位机构确保焊球粘附到其中心部分。

公开(公告)号：US06099326A

公开(公告)日：2000-08-08

申请号：US154667

申请日：1998-09-18

Applicant: Yu-Hsu Lin

Inventor： Yu-Hsu Lin

IPC: H01R43/02 ,  H05K3/34 ,  H05K7/10 ,  H01R12/00

CPC classification number: H05K7/1069 ,  H01R12/57 ,  H01R43/0256 ,  H05K3/3426 ,  Y02P70/613

Abstract: A matrix type connector (10) vertically defines a plurality of passageways (14) therethrough for receiving a plurality of contacts (16) therein. Each contact (16) includes a base (18) with retention means (20) formed thereon for retaining the contact (16) in the corresponding passageway (14). A contact section (28) extends upward from the base for engagement with a corresponding pin of a CPU. A tail section (30) extends downward from the base (18). An upper portion of the tail section (30) is twisted whereby the remaining portion thereof is positioned at a angle with regard to the base (18), a crook (38) is formed on a middle portion thereof, and a bowl-shaped solder section (40) is formed on a bottom portion thereof. Thus, the connector (10) can be fastened to the mother board (100) on which it is seated by means of a combination of the bowl-shaped solder section (40) and the corresponding solder paste (102) of the mother board (100).

Abstract translation: 矩阵型连接器（10）垂直地限定穿过其中的多个通道（14），用于在其中容纳多个触点（16）。 每个触点（16）包括一个基部（18），其具有形成在其上的保持装置（20），用于将触点（16）保持在相应的通道（14）中。 接触部分（28）从基座向上延伸以与CPU的相应引脚接合。 尾部（30）从基部（18）向下延伸。 尾部（30）的上部被扭转，其余部分相对于基部（18）定位成一定角度，在其中间部分形成有弯曲（38），并且形成碗形焊料 部分（40）形成在其底部。 因此，连接器（10）可以通过碗状焊料部分（40）和母板的对应焊膏（102）的组合紧固到其所在的母板（100） 100）。

公开(公告)号：US5820392A

公开(公告)日：1998-10-13

申请号：US764046

申请日：1996-12-12

Applicant: Yu-Hsu Lin ,  Robert G. McHugh ,  Hsiang-Ping Chen

Inventor： Yu-Hsu Lin ,  Robert G. McHugh ,  Hsiang-Ping Chen

IPC: H01R12/50 ,  H01R12/72 ,  H01R13/652

CPC classification number: H01R12/721 ,  H01R23/688

Abstract: A card edge connector (10) includes an insulative housing (12) defining a card receiving central slot (14) for receiving a card (200) therein. Two rows of passageways (16) are respectively positioned by two sides of the central slot (14) for receiving a plurality of signal contacts (18) therein, respectively. A corresponding number of grounding contacts (20) are positioned in the same passageways (16) with the signal contacts (18), respectively, in a one-by-one relationship with the signal contact (18) wherein each grounding contact (20) is disposed in a lower and inner position in the corresponding passageway (16) in comparison with the signal contact (18) which shares the same passageway (16). A shorting bar or block (36) is inserted into the cavity (34) from the bottom and a series of grounding pins (42) are side by side arranged along the block (36) longitudinally whereby each grounding pin (42) has two opposite arms (46) for respective engagement with the corresponding pair of grounding contacts (20) positioned in the pair of passageways (16) in the same transverse plane and by two sides of the central slot (14). Each grounding pin (42) further includes a lead (48) extending downward toward the PC board (100) on which the connector (10) is mounted wherein the lead (48) is generally in the mid-position between two tails of the corresponding two signal contacts (18) sharing the same pair of opposite passageways (16) with such pair of grounding contacts (20).

Abstract translation: 卡缘连接器（10）包括限定用于在其中接收卡（200）的卡接收中心槽（14）的绝缘外壳（12）。 两排通道（16）分别由中心狭槽（14）的两侧定位，用于分别在其中容纳多个信号触头（18）。 相应数量的接地触点（20）分别与信号触点（18）以一个一个关系与信号触头（18）定位在相同的通道（16）中，其中每个接地触点（20） 与共享相同通道（16）的信号触头（18）相比，被布置在相应通道（16）的下部和内部位置。 短路杆或块（36）从底部插入空腔（34）中，并且一系列接地销（42）沿着块（36）并排布置，每个接地销（42）具有两个相对的 臂（46）用于分别与位于一对通道（16）中的相应的一对接地触头（20）在同一横向平面和中心狭槽（14）的两侧相配合。 每个接地销（42）还包括一个朝向PC板（100）向下延伸的引线（48），其上安装有连接器（10），其中引线（48）通常处于相应的两个尾部之间的中间位置 两个信号触点（18）与这对接地触点（20）共享同一对相对的通道（16）。

公开(公告)号：US08279600B2

公开(公告)日：2012-10-02

申请号：US12909044

申请日：2010-10-21

Applicant: Yu-Hsu Lin

Inventor： Yu-Hsu Lin

IPC: H05K7/20 ,  H05K9/00

CPC classification number: H05K9/0041 ,  G06F1/20 ,  Y10T29/49117

Abstract: An electronic device enclosure for suppressing Electro-Magnetic Interference (EMI) includes a first plate defined on a first plane, a second plate defined on a second plane and a number of polygonal holes defined in the first plate at an angle of orientation. The second plane is substantially perpendicular to the first plane. The angle of orientation of the number of polygonal holes in the first plate is set according to a number of maximum dimensions in a direction substantially perpendicular to the second plane. The angle of orientation is defined such that there are a minimum number of maximum dimensions.

Abstract translation: 用于抑制电磁干扰（EMI）的电子设备外壳包括限定在第一平面上的第一板，限定在第二平面上的第二板和以取向角限定在第一板中的多个多边形孔。 第二平面基本上垂直于第一平面。 根据与第二平面基本垂直的方向的最大尺寸的数量来设定第一板中的多边形孔的数量的取向角。 定向角度被定义为具有最小数量的最大尺寸。

公开(公告)号：US08154879B2

公开(公告)日：2012-04-10

申请号：US11849306

申请日：2007-09-03

Applicant: Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

Inventor： Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K1/0271 ,  H05K1/0203 ,  H05K2201/09063 ,  H05K2201/10734

Abstract: A motherboard includes a printed circuit board, a first chip and a second chip arranged on the printed circuit board in parallel. A plurality of securing holes are defined in the printed circuit board around the first chip. At least one isolating hole is defined in the printed circuit board between the second chip and a first line determined by two of the securing holes close to the second chip. Should the printed circuit board suffer an impact, damage to the chips may be effectively minimized or prevented.

Abstract translation: 主板包括平行布置在印刷电路板上的印刷电路板，第一芯片和第二芯片。 在第一芯片周围的印刷电路板中限定多个固定孔。 在第二芯片和由靠近第二芯片的两个固定孔确定的第一线之间的印刷电路板中限定至少一个隔离孔。 如果印刷电路板受到冲击，则可以有效地最小化或防止对芯片的损坏。