公开(公告)号：US20210171197A1

公开(公告)日：2021-06-10

申请号：US17113324

申请日：2020-12-07

Applicant: ZIPLINE INTERNATIONAL INC.

Inventor： Ethan C. Anderson

IPC: B64C39/02 ,  H05K1/02 ,  H05K1/14 ,  H01R12/52

Abstract: A circuit board assembly for association with an aircraft includes a circuit board and an electromagnetic interference component connected to the circuit board. The circuit board assembly may further include an enclosure having an electromagnetic signal permissive layer and an electromagnetic signal blocking layer. The electromagnetic signal permissive layer may include a housing that define a volume. The housing may enclose the electromagnetic interference component on the circuit board. The electromagnetic signal blocking layer defines a conductive barrier about the electromagnetic interference component.

公开(公告)号：US20240336360A1

公开(公告)日：2024-10-10

申请号：US18628323

申请日：2024-04-05

Applicant: Zipline International, Inc.

Inventor： Ethan C. Anderson ,  Lauren E. Lacey ,  Wilmer A. Baron

IPC: B64D1/12

CPC classification number: B64D1/12

Abstract: Containers and parachutes for payloads to be delivered via an aerial delivery system are disclosed. In one example, a system for aerial delivery of a payload includes a parachute having a canopy, a plurality of legs extending from the canopy, one or more attachment features arranged on an end of the legs. The system also includes a payload container with a plurality of anchors and where the plurality of anchors are integral with the payload container and receive the one or more attachment features.

公开(公告)号：US12024283B2

公开(公告)日：2024-07-02

申请号：US17113324

申请日：2020-12-07

Applicant: ZIPLINE INTERNATIONAL INC.

Inventor： Ethan C. Anderson

IPC: B64C39/00 ,  B64C39/02 ,  H05K9/00

CPC classification number: B64C39/024 ,  H05K9/0007 ,  H05K9/0015 ,  H05K9/0037

Abstract: A circuit board assembly for association with an aircraft includes a circuit board and an electromagnetic interference component connected to the circuit board. The circuit board assembly may further include an enclosure having an electromagnetic signal permissive layer and an electromagnetic signal blocking layer. The electromagnetic signal permissive layer may include a housing that define a volume. The housing may enclose the electromagnetic interference component on the circuit board. The electromagnetic signal blocking layer defines a conductive barrier about the electromagnetic interference component.