公开(公告)号：US11510012B2

公开(公告)日：2022-11-22

申请号：US17279302

申请日：2019-08-23

Applicant: ams AG

Inventor： Goran Stojanovic ,  Colin Steele ,  Erik Jan Lous ,  Anderson Pires Singulani

IPC: H04R3/00 ,  H04R23/00 ,  G01H9/00

Abstract: An integrated optical transducer for detecting dynamic pressure changes comprises a micro-electro-mechanical system, MEMS, die having a MEMS diaphragm with a first side exposed to the dynamic pressure changes and a second side. The transducer further comprises an application specific integrated circuit, ASIC, die having an evaluation circuit configured to detect a deflection of the MEMS diaphragm, in particular of the second side of the MEMS diaphragm. The MEMS die is arranged with respect to the ASIC die such that a gap with a gap height is formed between the second side of the diaphragm and a first surface of the ASIC die and the MEMS diaphragm, the ASIC die and a suspension structure of the MEMS die delineate a back volume of the integrated optical transducer.

公开(公告)号：US20210392438A1

公开(公告)日：2021-12-16

申请号：US17287455

申请日：2019-10-18

Applicant: ams AG

Inventor： Goran Stojanovic ,  Colin Steele ,  Simon Mueller ,  Thomas Froehlich

IPC: H04R7/14

Abstract: A sensor includes a substrate; and a corrugated diaphragm offset from the substrate. The corrugated diaphragm is configured to deflect responsive to a sound wave impinging on the corrugated diaphragm. A cavity is defined between the corrugated diaphragm and the substrate, the corrugated diaphragm forming a top surface of the cavity and the substrate forming a bottom surface of the cavity. A pressure in the cavity is lower than a pressure outside of the cavity.

公开(公告)号：US10523234B2

公开(公告)日：2019-12-31

申请号：US16083206

申请日：2017-04-05

Applicant: ams AG

Inventor： Thomas Christen ,  Colin Steele ,  Thomas Froehlich

IPC: H03M3/00 ,  H03M1/12 ,  H03M1/68

Abstract: A signal processing arrangement has a signal input for connecting a capacitive sensor. An amplifier circuit is coupled between the signal input and a feedback point. A loop filter is coupled downstream to the feedback point. A quantizer is connected downstream to the loop filter and provides a multi-bit output word. The multi-bit output word consists of one or more higher significance bits and one or more lower significance bits. A first feedback path is coupled between a quantizer and the feedback point for providing a first feedback signal to the feedback point being representative of the one or more lower significance bits. A second feedback path is coupled to the quantizer for providing a second feedback signal to the signal input being representative of the one or more higher significance bits.

公开(公告)号：US11743652B2

公开(公告)日：2023-08-29

申请号：US17287455

申请日：2019-10-18

Applicant: ams AG

Inventor： Goran Stojanovic ,  Colin Steele ,  Simon Mueller ,  Thomas Froehlich

IPC: H04R7/14

CPC classification number: H04R7/14

Abstract: A sensor includes a substrate; and a corrugated diaphragm offset from the substrate. The corrugated diaphragm is configured to deflect responsive to a sound wave impinging on the corrugated diaphragm. A cavity is defined between the corrugated diaphragm and the substrate, the corrugated diaphragm forming a top surface of the cavity and the substrate forming a bottom surface of the cavity. A pressure in the cavity is lower than a pressure outside of the cavity.

公开(公告)号：US11477581B2

公开(公告)日：2022-10-18

申请号：US17279749

申请日：2019-09-17

Applicant: ams AG

Inventor： Goran Stojanovic ,  Colin Steele ,  Simon Mueller ,  Thomas Froehlich ,  Erik Jan Lous ,  Anderson Pires Singulani

IPC: H04R19/04 ,  H04R19/00 ,  H04R31/00

Abstract: A micro-electro-mechanical system, MEMS, microphone assembly comprises an enclosure defining a first cavity, and a MEMS microphone arranged inside the first cavity. The microphone comprises a first die with bonding structures and a MEMS diaphragm, and a second die having an application specific integrated circuit, ASIC. The second die is bonded to the bonding structures such that a gap is formed between a first side of the diaphragm and the second die, with the gap defining a second cavity. The first side of the diaphragm is interfacing with the second cavity and a second side of the diaphragm is interfacing with the environment via an acoustic inlet port of the enclosure. The bonding structures are arranged such that pressure ventilation openings are formed that connect the first cavity and the second cavity.

公开(公告)号：US20220317391A1

公开(公告)日：2022-10-06

申请号：US17640185

申请日：2020-08-25

Applicant: ams AG

Inventor： Jochen Kraft ,  Bernhard Stering ,  Colin Steele ,  Jean Francois Seurin

IPC: G02B6/42

Abstract: A bonded structure comprises a substrate component having a plurality of first pads arranged on or within a surface of the substrate component, and an integrated circuit component having a plurality of second pads arranged on or within a surface of the integrated circuit component. The bonded structure further comprises a plurality of connection elements physically connecting the first pads to the second pads. The surface of the integrated circuit component is tilted obliquely to the surface of the substrate component at a tilt angle that results from nominal variations of surface sizes of the first and second pads.