公开(公告)号：US07429788B2

公开(公告)日：2008-09-30

申请号：US11715091

申请日：2007-03-07

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H01L23/02

CPC classification number: H05K1/189 ,  H01L23/473 ,  H01L23/5387 ,  H01L25/50 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0278 ,  H05K1/028 ,  H05K3/0064 ,  H05K2201/0191 ,  H05K2201/056 ,  H05K2201/09118 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/2018 ,  H01L2924/00

Abstract: A thin multichip module comprises: a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit bonded to at least one of the planar members over at least a portion of each of their respective surfaces; and, electrodes on the module configured to be accessible to an external socket after the frame is closed. A method for making a thin multichip module comprises the steps of: a. attaching integrated circuit chips to a flex circuit; b. bonding the flex circuit to a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; and, c. folding the frame approximately 180° about the fold axis.

Abstract translation: 薄多芯片模块包括：可折叠框架，其包括两个刚性的基本平坦的构件，其能够围绕选定的折叠轴线折叠在一起以形成基本封闭的结构; 具有设置在其上的多个集成电路芯片的柔性电路，所述柔性电路在其各自表面的每一个的至少一部分上结合到所述平面构件中的至少一个; 并且模块上的电极被配置为在框架关闭之后可以被外部插座访问。 一种制造薄多芯片模块的方法包括以下步骤：a。 将集成电路芯片附接到柔性电路; b。 将柔性电路接合到可折叠框架，该可折叠框架包括两个刚性的基本平坦的构件，能够围绕选定的折叠轴线折叠在一起以形成基本封闭的结构; 和，c。 将框架围绕折叠轴线折叠约180°。

公开(公告)号：US08834182B2

公开(公告)日：2014-09-16

申请号：US13573967

申请日：2012-10-17

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H01R12/00

CPC classification number: H01R12/77 ,  H01R12/78

Abstract: An electrical interconnect system comprises: a flexible circuit having thereon a plurality of electrical contact pads; a contact strip comprising a plurality of electrical contacts aligned with respective pads on the flexible circuit; a compression member to engage the contacts with the pads; and, pierced areas on said pads to enhance the mechanical engagement between the contacts and the pads.

Abstract translation: 电互连系统包括：柔性电路，其上具有多个电接触焊盘; 接触条，包括与柔性电路上的相应焊盘对准的多个电触头; 压接构件，用于与所述垫接触; 以及在所述垫上的刺穿区域以增强触头和垫之间的机械接合。

公开(公告)号：US08692124B2

公开(公告)日：2014-04-08

申请号：US12927544

申请日：2010-11-17

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H01R12/79 ,  H05K1/117 ,  H05K3/363 ,  H05K3/4691 ,  H05K2201/09181

Abstract: An electrical connector comprises an elongated flexible circuit having rigid strips bonded onto one or both sides and one or more ends thereof. The strips contain metallized castellations that are aligned with respective metal traces on the flex circuit and soldered thereto. The flexible portion, along with the attached rigid board(s) forms a plug assembly that mates with a socket having contact pins that engage with their respective metallized castellations, with the castellations providing a self-aligning function. The invention may be used to form a flex cable with connectors on one or both ends. Alternatively, the elongated flexible circuit may represent an extension of a larger flex circuit substrate that further contains other electronic devices mounted thereon. The socket and contact pins are preferably attachable to a motherboard by soldering or other means.

Abstract translation: 电连接器包括细长的柔性电路，其具有结合到一侧或两侧上的刚性条和其一端或多端。 这些条带包含与柔性电路上的相应金属迹线对准并焊接到其上的金属化蓖麻。 柔性部分以及附接的刚性板形成一个插头组件，该插头组件与具有与它们各自的金属化cast that接合的接触销的插座配合，cast ations提供自对准功能。 本发明可以用于在一端或两端形成具有连接器的柔性电缆。 或者，细长柔性电路可以表示进一步包含安装在其上的其它电子装置的较大柔性电路基板的延伸部。 插座和接触针优选通过焊接或其他方式附接到主板。

公开(公告)号：US07796399B2

公开(公告)日：2010-09-14

申请号：US12317892

申请日：2008-12-30

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/18 ,  H05K7/20 ,  H01R12/24 ,  H01R43/02 ,  H04L12/50 ,  H01L23/34

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.

Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 导电图案包括与衬底的一个边缘相邻的一系列电接触。 衬底被粘合到两个刚性框架上，每个相对表面上一个。 每个衬底在一个边缘上具有一系列在优选通过焊接的衬底上对准并电连接到衬底上的相应接触件的蓖耳。 当模块与低轮廓的针阵列接触时，这些哨座可以用作自对准机构，并且模块可以通过插座中的导轨固定在主板上的位置，该插座与垂直于雉鸡的边缘接合 模块的边缘。 模块还可以设置有保护性散热罩。

公开(公告)号：US07724530B2

公开(公告)日：2010-05-25

申请号：US12317890

申请日：2008-12-30

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00 ,  H05K7/20

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.

Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 基板的一部分是柔性的并且分叉。 两个刚性构件纵向连接，一个位于衬底的两侧，并且分叉的自由端分别围绕这些构件反射并结合到它们上。 电极位于分叉处，使得它们在反射之后将向外和/或向下暴露。 模块还可以设置有保护性散热罩。 电极和刚性构件可以被配置为接合配合插座，或者它们可焊接到印刷电路板。

公开(公告)号：US07520781B2

公开(公告)日：2009-04-21

申请号：US11715206

申请日：2007-03-07

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H01R24/00

CPC classification number: H01R12/721 ,  H01R12/88 ,  H01R43/0256 ,  H01R43/18

Abstract: A socket assembly for multichip in-line modules comprises: at least three parallel in-line sockets, one of which is an edge-card socket adapted to matably engage electrodes on the edge of a printed circuit board, and the others of which are module sockets adapted to accept multichip in-line modules; and, internal connections between respective pins in each of the parallel sockets, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules. Alternatively, a socket assembly for multichip in-line modules comprises: a substantially rigid housing structure; at least two parallel in-line sockets adapted to accept multichip in-line modules; a set of electrodes adapted for soldering to a printed circuit board; and, internal connections between respective pins in each of the parallel sockets and the set of electrodes, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules.

Abstract translation: 用于多芯片在线模块的插座组件包括：至少三个平行的在线插座，其中一个插座适合于与印刷电路板的边缘上的电极适配地接合，并且其中一个是模块 适用于接受多芯片在线模块的插座; 以及在每个并行插座中的相应引脚之间的内部连接，由此来自印刷电路板的信号可以同时传送到多芯片直插模块中的每一个。 或者，用于多芯片在线模块的插座组件包括：基本上刚性的壳体结构; 至少两个平行的在线插座适于接受多芯片在线模块; 一组适用于焊接到印刷电路板的电极; 以及每个并联插座和电极组中的各个引脚之间的内部连接，由此来自印刷电路板的信号可以同时传送到多芯片直列模块中的每一个。

公开(公告)号：US07394149B2

公开(公告)日：2008-07-01

申请号：US11715303

申请日：2007-03-07

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H01L23/02

CPC classification number: H05K1/189 ,  G06F1/183 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/2018

Abstract: A low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins. Alternatively, a low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; a socket configured to matably engage the module; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins.

Abstract translation: 低插入力多芯片在线模块包括：基本刚性的框架; 具有设置在其上的多个集成电路芯片的柔性电路，所述柔性电路具有至少部分地沿着所述框架的一个边缘露出的触点; 以及设置在暴露的柔性电路和刚性框架之间的柔性层，由此柔性层的受控变形增强了触头和对应的外部电引脚之间的电连续性。 或者，低插入力多芯片在线模块包括：基本刚性的框架; 具有设置在其上的多个集成电路芯片的柔性电路，所述柔性电路具有至少部分地沿着所述框架的一个边缘露出的触点; 被配置成与所述模块配合地配合的插座; 以及设置在暴露的柔性电路和刚性框架之间的柔性层，由此柔性层的受控变形增强了触头和对应的外部电引脚之间的电连续性。

公开(公告)号：US08559181B2

公开(公告)日：2013-10-15

申请号：US12930971

申请日：2011-01-21

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.

公开(公告)号：USRE42252E1

公开(公告)日：2011-03-29

申请号：US12804381

申请日：2010-07-20

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00 ,  H05K7/20

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.

Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 基板的一部分是柔性的并且分叉。 两个刚性构件纵向连接，一个位于衬底的两侧，并且分叉的自由端分别围绕这些构件反射并结合到它们上。 电极位于分叉处，使得它们在反射之后将向外和/或向下暴露。 模块还可以设置有保护性散热罩。 电极和刚性构件可以被配置为接合配合插座，或者它们可焊接到印刷电路板。

公开(公告)号：US07393226B2

公开(公告)日：2008-07-01

申请号：US11715141

申请日：2007-03-07

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H01R4/60

CPC classification number: H01L23/473 ,  H01L23/5387 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01R12/7011 ,  H01R12/721 ,  H01R12/79 ,  H01R25/006 ,  H01R27/02 ,  H01R35/00 ,  H01L2924/00

Abstract: A socket for in-line circuit modules comprises: at least one row of electrical pins configured to matably engage corresponding contacts on the in-line module; and, at least two fluid connections configured to matably engage corresponding fluid connections on the in-line module, whereby fluid may be circulated into and out of the module while maintaining electrical continuity between the pins and the contacts. Alternatively, a socket for in-line circuit modules comprises: at least one row of electrical pins configured to matably engage corresponding contacts on the in-line module; and, a fluid connection configured to matably engage a corresponding fluid connection on the in-line module, whereby fluid may be introduced into the module through the socket and vented elsewhere while maintaining electrical continuity between the pins and the contacts.

Abstract translation: 用于在线电路模块的插座包括：至少一排电引脚，其被配置成可嵌入地嵌入在线模块中的相应触点; 以及至少两个流体连接件，其配置成可以嵌合在一起的在线模块中的相应的流体连接，由此流体可以循环进入模块并从模块中流出，同时保持销和触头之间的电连续性。 或者，用于在线电路模块的插座包括：至少一排电引脚，其被配置为与所述在线模块中的相应接触件配合地接合; 以及流体连接，其配置成可以嵌合在一起的在线模块中的对应的流体连接，由此可以通过插座将流体引入到模块中，并在其它位置排放，同时保持销和触头之间的电连续性。