公开(公告)号：US12080566B2

公开(公告)日：2024-09-03

申请号：US17640858

申请日：2020-05-25

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Taiki Hinode ,  Takashi Ota ,  Mitsukazu Takahashi ,  Kazuhiro Honsho ,  Yusuke Akizuki

IPC: H01L21/67 ,  B05C5/02 ,  B05C11/08 ,  B05C11/10 ,  H01L21/68

CPC classification number: H01L21/67023 ,  B05C5/02 ,  B05C11/08 ,  B05C11/1039 ,  H01L21/67242 ,  H01L21/68

Abstract: A substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a treating unit and a controller. The treating unit includes a substrate holder, a rotation driving unit, a treatment liquid supplying unit, a liquid collecting unit, and a guard driving unit. The substrate holder holds a substrate in a horizontal posture. The rotation driving unit rotates the substrate holder. The liquid collecting unit includes a first guard, a second guard, and a liquid inlet. The first guard and the second guard are arranged so as to surround the substrate holder laterally. The liquid inlet is defined by the guards. The liquid inlet is open toward the substrate held by the substrate holder. The guard driving unit moves the second guard in a vertical direction. The controller controls the guard driving unit in accordance with the shape of the substrate held by the substrate holder, thereby changing a height position of an upper end of the liquid inlet.

公开(公告)号：US12036573B2

公开(公告)日：2024-07-16

申请号：US17274560

申请日：2019-08-28

Applicant: Tokyo Electron Limited

Inventor： Shougo Inaba

IPC: B05C11/08 ,  B05C11/02 ,  B05D1/00 ,  B05D3/04 ,  H01L21/67

CPC classification number: B05C11/08 ,  B05C11/023 ,  B05D1/002 ,  B05D3/042 ,  H01L21/6715

Abstract: A coating film forming method includes holding a substrate by a substrate holder; forming an air flow on a front surface of the substrate; supplying a coating liquid configured to form a coating film on the front surface; forming, after moving a covering member from a first position to a second position relatively to the substrate, the air flow in a gap formed by the covering member placed at the second position and the front surface of the substrate being rotated at a first rotation number such that a flow velocity of the air flow becomes larger than that of the air flow obtained when the covering member is placed at the first position; and rotating the substrate at a second rotation number higher than the first rotation number to adjust a film thickness distribution of the coating film by scattering the coating liquid from a peripheral portion thereof.

公开(公告)号：US20240066548A1

公开(公告)日：2024-02-29

申请号：US18366068

申请日：2023-08-07

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Shuhei NEMOTO

IPC: B05C11/08 ,  B05C11/10 ,  B05C13/02

CPC classification number: B05C11/08 ,  B05C11/10 ,  B05C13/02

Abstract: In an substrate processing apparatus according to the present invention, a chamber is configured so as to cover an internal space with a bottom wall, side walls extending from the periphery of the bottom wall, and a ceiling wall covering the upper end of the side walls. A plurality of base support members stand vertically upward from the bottom wall, and the base member is supported by upper end portions of these base support members. A so-called raised floor structure is formed. Then, the substrate processing part is installed on the upper surface of the base member. By adopting such a layout using the raised floor structure, even if leakage of the processing liquid occurs and the processing liquid is pooled on the bottom wall of the chamber, it is possible to reliably prevent the processing liquid from coming into contact with the substrate processing part.

公开(公告)号：US20240042479A1

公开(公告)日：2024-02-08

申请号：US18484154

申请日：2023-10-10

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Takahiro YAMAGUCHI ,  Jun SAWASHIMA ,  Toru ENDO ,  Rikuta AOKI

IPC: B05C11/08 ,  B05D1/00 ,  B05C11/10

CPC classification number: B05C11/08 ,  B05D1/005 ,  B05C11/1002

Abstract: A substrate processing apparatus includes a rotational holding member that rotates a substrate around a predetermined rotational axis while holding the substrate, a liquid supply member that supplies a liquid to the substrate held by the rotational holding member, and a resin-made tubular guard that surrounds the substrate held by the rotational holding member. The tubular guard has an inner peripheral surface and an uneven portion disposed at the inner peripheral surface. The uneven portion has a plurality of recessed portions and a plurality of protruding portions placed between the recessed portions adjacent to each other. The recessed portion has a width smaller than a diameter of a liquid droplet scattering from the substrate held by the rotational holding member and a depth in which the liquid droplet does not come into contact with a bottom portion of the recessed portion in a state in which the liquid droplet is in contact with the protruding portions. The protruding portion has a width that is smaller than the diameter of the liquid droplet and that is smaller than the width of the recessed portion.

公开(公告)号：US11819872B2

公开(公告)日：2023-11-21

申请号：US17584506

申请日：2022-01-26

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Takahiro Yamaguchi ,  Jun Sawashima ,  Toru Endo ,  Rikuta Aoki

IPC: B05C11/08 ,  B05C11/10 ,  B05D1/00

CPC classification number: B05C11/08 ,  B05C11/1002 ,  B05D1/005

Abstract: A substrate processing apparatus includes a rotational holding member that rotates a substrate around a predetermined rotational axis while holding the substrate, a liquid supply member that supplies a liquid to the substrate held by the rotational holding member, and a resin-made tubular guard that surrounds the substrate held by the rotational holding member. The tubular guard has an inner peripheral surface and an uneven portion disposed at the inner peripheral surface. The uneven portion has a plurality of recessed portions and a plurality of protruding portions placed between the recessed portions adjacent to each other. The recessed portion has a width smaller than a diameter of a liquid droplet scattering from the substrate held by the rotational holding member and a depth in which the liquid droplet does not come into contact with a bottom portion of the recessed portion in a state in which the liquid droplet is in contact with the protruding portions. The protruding portion has a width that is smaller than the diameter of the liquid droplet and that is smaller than the width of the recessed portion.

公开(公告)号：US11806743B2

公开(公告)日：2023-11-07

申请号：US17826561

申请日：2022-05-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ching-Hai Yang ,  Yao-Hwan Kao ,  Shang-Sheng Li ,  Kuo-Pin Chen ,  Hsiang-Kai Tseng ,  Chuan-Wei Chen

IPC: B05D1/00 ,  B05C11/10 ,  B05C11/08 ,  G03F7/16 ,  G03F7/30 ,  H01L21/67 ,  B05B11/10

CPC classification number: B05C11/1039 ,  B05B11/1097 ,  B05C11/08 ,  G03F7/162 ,  G03F7/3021 ,  H01L21/6715 ,  B05D1/005

Abstract: A spin dispenser module and methods for using the same is disclosed. The spin dispenser module includes a cup having a basin with sidewalls and an exhaust, a rotatable platform situated inside the cup adapted for holding and rotating a substrate, a liquid dispenser disposed over the rotatable platform for dispensing a liquid coating material on top of the substrate, one or more ejector inlets disposed over the rotatable platform, the one or more ejectors connected to a negative pressure source, and a motor coupled to the rotatable platform to rate the rotatable platform at different rotational speeds. The one or more ejector inlets may be translatable and/or rotatable with optionally adjustable suction pressure. The ejector inlets operate after a liquid coating material is dispensed to avoid deposition of suspended organic compounds after a coating is formed.

公开(公告)号：US11642691B2

公开(公告)日：2023-05-09

申请号：US17197597

申请日：2021-03-10

Applicant: Nabors Drilling Technologies USA, Inc.

Inventor： Ronald Schanlaub ,  Keith Hager ,  Chris Magnuson ,  Eric Deutsch

IPC: B05C3/20 ,  E21B19/00 ,  F16N7/00 ,  B05C11/08 ,  B05C9/12 ,  B05C11/06 ,  B05D1/02 ,  B05D1/28 ,  B05D3/00 ,  B05D3/04

CPC classification number: B05C3/20 ,  B05C9/12 ,  B05C11/06 ,  B05C11/08 ,  B05D1/02 ,  B05D1/28 ,  B05D3/002 ,  B05D3/0413 ,  E21B19/00 ,  F16N7/00 ,  Y10S118/11

Abstract: A pipe doping apparatus comprises a bucket assembly including a base and a bucket supported on the base and having an inside volume, a lubricating unit having at least one lubricant applicator inside the bucket; and a source of torque configured to rotate the bucket and/or the lubricating unit relative to a tubular. The apparatus may include a cleaning unit and/or a drying unit and the source of torque may be a fluid jet in either. At least one lubricant applicator may be retractable and may be actuated between a retracted position and an extended position by centripetal force. The apparatus may further include a positioning assembly supporting the base and the rotary bucket assembly and a controller connected to and controlling each of:—the positioning assembly, the cleaning unit, the drying unit, and the lubricating unit.

公开(公告)号：US11511308B2

公开(公告)日：2022-11-29

申请号：US17174115

申请日：2021-02-11

Applicant: Memjet Technology Limited

Inventor： Thomas Roetker ,  Jason Mark Thelander ,  Mark Profaca ,  Payman Hassibi

IPC: B05C5/02 ,  B05C11/02 ,  B05C11/08 ,  B05C11/10 ,  B05C13/02 ,  B05C15/00

Abstract: A method of coating threads using a printhead having rows of nozzles extending along a length of the printhead. The method includes the steps of: feeding the thread along a length of the printhead; and ejecting ink from the rows of nozzles towards the thread. Thread-coating modules and thread-coating systems make use of the method described.

公开(公告)号：US11443964B2

公开(公告)日：2022-09-13

申请号：US15340027

申请日：2016-11-01

Applicant: Tokyo Electron Limited

Inventor： Masatoshi Kaneda ,  Yuzo Ohishi ,  Keisuke Yoshida

IPC: H01L21/67 ,  B05C11/08 ,  B05C11/10 ,  H01L21/311 ,  H01L21/677 ,  H01L21/687 ,  H01L21/02 ,  H01L21/3105

Abstract: A substrate processing apparatus includes a placing table configured to hold a substrate having a processing target film, which is decomposed by irradiating an ultraviolet ray thereto under an oxygen-containing atmosphere; a processing chamber, configured to accommodate therein the substrate placed on the placing table, having therein the oxygen-containing atmosphere; and an ultraviolet ray irradiation device configured to irradiate the ultraviolet ray to the substrate within the processing chamber. Further, the placing table is provided with a surrounding member configured to surround the substrate placed on the placing table and restrict a gas introduction amount from an outside of the substrate toward above the substrate.

公开(公告)号：US20220258198A1

公开(公告)日：2022-08-18

申请号：US17584506

申请日：2022-01-26

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Takahiro YAMAGUCHI ,  Jun SAWASHIMA ,  Toru ENDO ,  Rikuta AOKI

IPC: B05C11/08 ,  B05C11/10 ,  B05D1/00

Abstract: A substrate processing apparatus includes a rotational holding member that rotates a substrate around a predetermined rotational axis while holding the substrate, a liquid supply member that supplies a liquid to the substrate held by the rotational holding member, and a resin-made tubular guard that surrounds the substrate held by the rotational holding member. The tubular guard has an inner peripheral surface and an uneven portion disposed at the inner peripheral surface. The uneven portion has a plurality of recessed portions and a plurality of protruding portions placed between the recessed portions adjacent to each other. The recessed portion has a width smaller than a diameter of a liquid droplet scattering from the substrate held by the rotational holding member and a depth in which the liquid droplet does not come into contact with a bottom portion of the recessed portion in a state in which the liquid droplet is in contact with the protruding portions. The protruding portion has a width that is smaller than the diameter of the liquid droplet and that is smaller than the width of the recessed portion.