公开(公告)号：US20250132195A1

公开(公告)日：2025-04-24

申请号：US18695337

申请日：2022-09-26

Applicant: Lam Research Corporation

Inventor： Stephen M. SIRARD ,  Gregory BLACHUT ,  Diane HYMES

IPC: H01L21/768 ,  B05D1/00 ,  H01L21/67

Abstract: Methods of bracing high aspect ratio (HAR) structures include coating the HAR structures with stimulus responsive polymers (SRP) films followed by baking the SRP films at a temperature above the glass transition temperature (Tg) of the SRP film and below the degradation temperature of the SRP. In some embodiments, the SRP film includes a plasticizer.

公开(公告)号：US12269981B2

公开(公告)日：2025-04-08

申请号：US17750046

申请日：2022-05-20

Applicant: Yetkin Yildirim

Inventor： Yetkin Yildirim

IPC: C09K17/44 ,  B05D1/00 ,  E02D19/16 ,  H02S20/10 ,  H02S40/22

Abstract: A method of soil treatment that allows for the creation of or installation of a highly reflective surface for use in conjunction with bifacial solar panels to more efficiently generate clean energy.

公开(公告)号：US20250083109A1

公开(公告)日：2025-03-13

申请号：US18614093

申请日：2024-03-22

Applicant: YALE UNIVERSITY

Inventor： Chinedum Osuji ,  Xunda Feng

IPC: B01D67/00 ,  B01D61/02 ,  B01D69/02 ,  B01D69/12 ,  B01D71/40 ,  B01D71/70 ,  B05D1/00 ,  B05D3/00 ,  B05D3/04 ,  B05D3/06 ,  B32B17/10 ,  B32B27/08 ,  B32B27/28

Abstract: The present invention relates to the development and fabrication of thin-film polymer composite materials containing vertically aligned nanopores. The present invention provides methods of aligning nanopores in a polymeric film. The present invention also provides composite materials and methods of fabricating composite materials containing vertically aligned nanopores.

公开(公告)号：US12220678B2

公开(公告)日：2025-02-11

申请号：US17073111

申请日：2020-10-16

Applicant: Applied Materials, Inc

Inventor： Govindraj Desai ,  Sekar Krishnasamy ,  Sumedh Acharya ,  Dakshalkumar Patel ,  Jonathan Frankel ,  Quoc Truong ,  Mario Cambron ,  Ravindra Patil

IPC: C23C16/44 ,  B01J8/00 ,  B01J19/00 ,  B05C19/00 ,  B05C19/02 ,  B05D1/00

Abstract: A reactor for coating particles includes a stationary vacuum chamber to hold a bed of particles to be coated, a chemical delivery system, and a paddle assembly. The paddle assembly includes a rotatable drive shaft and a first plurality of paddles and a second plurality of paddles that extend radially from the drive shaft. The spacing, cross-sections, and oblique angles of the paddles are such that orbiting of the paddles causes the first plurality of paddles and the second plurality of paddles to displace substantially equal volumes in opposite directions in the lower portion of the stationary vacuum chamber.

公开(公告)号：US20250033082A1

公开(公告)日：2025-01-30

申请号：US18704436

申请日：2022-10-24

Applicant: Adama Makhteshim Ltd.

Inventor： Ivan Gorlovetsky ,  Alexey Utsis ,  Micha Mosco

IPC: B05D1/00

Abstract: The present invention provides a method of preventing leakage of an aromatic compound from an article containing a formulation comprising the aromatic compound and a polar liquid, wherein the method comprises plasma-coating the article.

公开(公告)号：US12205820B2

公开(公告)日：2025-01-21

申请号：US17808741

申请日：2022-06-24

Applicant: ASM IP HOLDING B.V.

Inventor： Eva E. Tois ,  Hidemi Suemori ,  Viljami J. Pore ,  Suvi P. Haukka ,  Varun Sharma

IPC: H01L21/285 ,  B05D1/00 ,  C23C16/02 ,  C23C16/04 ,  C23C16/455 ,  C23C16/56 ,  H01L21/02 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/768

Abstract: Processes are provided herein for deposition of organic films. Organic films can be deposited, including selective deposition on one surface of a substrate relative to a second surface of the substrate. For example, polymer films may be selectively deposited on a first metallic surface relative to a second dielectric surface. Selectivity, as measured by relative thicknesses on the different layers, of above about 50% or even about 90% is achieved. The selectively deposited organic film may be subjected to an etch process to render the process completely selective. Processes are also provided for particular organic film materials, independent of selectivity.

公开(公告)号：US12202007B2

公开(公告)日：2025-01-21

申请号：US16942738

申请日：2020-07-29

Applicant: UNITED PROTECTIVE TECHNOLOGIES, LLC

Inventor： Peter Craig Venema ,  Brent William Barbee ,  Michael Raymond Greenwald

IPC: G02B1/118 ,  B05D1/00 ,  B05D3/14 ,  C03C11/00 ,  C03C17/30 ,  C09D4/00 ,  C23C14/10 ,  C23C14/58 ,  G02B1/18

Abstract: Provided herein is a film and methods of producing the same. The film includes a substrate and a layer adjacent to the substrate, wherein a surface of the layer comprises spaced apart protrusions. The methods include providing a substrate, depositing a layer on at least a portion of the substrate, decomposing the layer to form at least a first phase of material and a second phase of material, and removing at least a portion of the second phase from the decomposed layer to form a structured layer.

公开(公告)号：US20240421280A1

公开(公告)日：2024-12-19

申请号：US18819928

申请日：2024-08-29

Applicant: CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED

Inventor： Yongli ZHANG ,  Zhihua WEN ,  Keqiang LI

IPC: H01M4/04 ,  B05C19/00 ,  B05D1/00

Abstract: A coating device for applying a coating to a member to be coated includes: a roller assembly including a first spool and second spool that are spaced apart, wherein the first spool is configured to release the member to be coated that is to be coated, and the second spool is configured to roll up the member to be coated after being coated with a coating; a coating assembly including an electrostatic roller set and an electrostatic rod, wherein the electrostatic roller set is at least partially rotatable and is configured to electrostatically adsorb the powder, the electrostatic rod is configured to provide electrostatic adsorption force to the powder on the electrostatic roller set; a composite assembly provided at downstream position of the coating assembly, and configured to connect the powder laid on the member to be coated with the member to be coated.

公开(公告)号：US12170199B2

公开(公告)日：2024-12-17

申请号：US18362136

申请日：2023-07-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Je-Ming Kuo ,  Yen-Chun Huang ,  Chih-Tang Peng ,  Tien-I Bao

IPC: H01L21/02 ,  B05D3/06 ,  B05D7/00 ,  H01L21/311 ,  H01L21/762 ,  H01L21/8234 ,  H01L29/06 ,  B05D1/00 ,  B05D1/38 ,  G03F7/16 ,  H01L21/768

Abstract: The present disclosure is generally related to semiconductor devices, and more particularly to a dielectric material formed in semiconductor devices. The present disclosure provides methods for forming a dielectric material layer by a cyclic spin-on coating process. In an embodiment, a method of forming a dielectric material on a substrate includes spin-coating a first portion of a dielectric material on a substrate, curing the first portion of the dielectric material on the substrate, spin-coating a second portion of the dielectric material on the substrate, and thermal annealing the dielectric material to form an annealed dielectric material on the substrate.

公开(公告)号：US12157142B2

公开(公告)日：2024-12-03

申请号：US17754993

申请日：2020-10-16

Applicant: THE UNIVERSITY OF HONG KONG

Inventor： Chik Ho Choy ,  Jinwook Kim

IPC: B05D1/38 ,  B05D1/00 ,  B05D1/02 ,  B05D1/28 ,  B82Y30/00 ,  B82Y40/00

Abstract: A metallic nanowire:conductive polymer composite is fabricated. A metallic nanowire layer is formed by a process that leaves an organic ligand residue on the metallic nanowire layer. A conductive polymer film is formed on a supporting substrate. The metallic nanowire layer is integrated with the conductive polymer film to form a metallic nanowire:conductive polymer composite. The metallic nanowire:conductive polymer composite is wet by a reaction solution including a source of metal ions, at least one acid, and a solvent for a period of time sufficient to remove the organic ligand residues from the metallic nanowire layer and sufficient to grow metal nanoparticles from the source of metal ions to create metal interconnections at junctions where the two or more nanowires in the metallic nanowire layer touch each other. Following growth of the nanoparticles, the nanowire:conductive polymer composite is removed from the reaction solution and dried.