SUBSTRATE PROCESSING METHOD
    4.
    发明申请

    公开(公告)号:US20250010330A1

    公开(公告)日:2025-01-09

    申请号:US18711588

    申请日:2022-11-04

    Abstract: In this substrate processing method, a water-repellent treatment is performed on a upper surface of a substrate so as to change the contact angle of pure water with respect to a flat surface to 90° or greater, and then a hydrophobic liquid is supplied to the upper surface of the substrate, thereby replacing a water repellent agent-containing liquid on the upper surface of the substrate with the hydrophobic liquid. After the hydrophobic liquid replacement step, a hydrophilic liquid is supplied to the upper surface of the substrate, thereby replacing the hydrophobic liquid on the upper surface of the substrate with the hydrophilic liquid. After the hydrophilic liquid replacement step, the hydrophilic liquid on the upper surface of the substrate is caused to flow and is removed from the upper surface of the substrate, and the upper surface of the substrate is thereby dried.

    Planarization method and photocurable composition

    公开(公告)号:US12179231B2

    公开(公告)日:2024-12-31

    申请号:US18338716

    申请日:2023-06-21

    Abstract: A substrate surface planarization method includes an arranging step of arranging a liquid curable composition onto a substrate surface having unevenness, a waiting step of waiting until the surface of the layer of the liquid curable composition becomes smooth, and a light exposure step of applying light to cure the layer of the liquid curable composition in this order. The arranging step includes a first arranging step of arranging a layer made of a first liquid curable composition (A1) containing at least a polymerizable compound (a1), and a second arranging step of arranging droplets of a second liquid curable composition (A2) containing at least a polymerizable compound (a2) onto the layer made of the first liquid curable composition (A1) by dropping the droplets discretely.

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