公开(公告)号：US20250136822A1

公开(公告)日：2025-05-01

申请号：US18954113

申请日：2024-11-20

Applicant: SWIMC LLC

Inventor： Richard D. JOSLIN ,  Charles I. SKILLMAN ,  Joseph DESOUSA

IPC: C09D5/03 ,  B05D1/00 ,  B05D1/12 ,  B05D1/38 ,  B05D3/02 ,  B05D3/06 ,  B65D23/08 ,  C09D123/00 ,  C09D133/04 ,  C09D167/00 ,  C09D171/00

Abstract: Powder coating compositions, particularly metal packaging powder coating compositions, coated metal substrates, and methods; wherein the powder coating compositions include powder polymer particles comprising a polymer having a number average molecular weight of at least 2000 Daltons, wherein the powder polymer particles have a particle size distribution having a D50 of less than 25 microns; and, in certain embodiments, one or more charge control agents in contact with the powder polymer particles.

公开(公告)号：US20250135492A1

公开(公告)日：2025-05-01

申请号：US19006914

申请日：2024-12-31

Applicant: TOPPAN HOLDINGS INC.

Inventor： Eishi AOKI

IPC: B05D5/02 ,  B05D3/06 ,  B05D7/00 ,  B05D7/04

Abstract: A decorative sheet includes a primary film layer, a transparent ridged layer, and a surface protective layer laminated in this order, wherein asperities having ridge parts protruding in a ridged shape are formed on the transparent ridged layer, and the relationship between a film thickness TA of the surface protective layer on a raised portion of the transparent ridged layer and a film thickness TB of the surface protective layer on a recessed portion of the transparent ridged layer satisfies 0.1≤TA/TB≤2.0.

公开(公告)号：US12259007B2

公开(公告)日：2025-03-25

申请号：US17681620

申请日：2022-02-25

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hirotomo Tamiya

IPC: F16C33/12 ,  B05D1/02 ,  B05D3/06 ,  B32B15/04 ,  B32B15/08 ,  C22C23/00 ,  C22C23/02 ,  C22C23/04 ,  C22C24/00 ,  C22C28/00 ,  C23C26/00 ,  C25D7/10 ,  C25D9/12 ,  C25D11/30

Abstract: An alloy member includes a substrate formed of an alloy containing Mg and Li, a first layer which is disposed on the substrate and contains an inorganic fluoride, and a second layer which is disposed on the first layer and includes a cured product of a resin, the substrate, the first layer, and the second layer being stacked together, in which a surface of the first layer on the side opposite the substrate has an irregular structure.

公开(公告)号：US12246551B2

公开(公告)日：2025-03-11

申请号：US17773901

申请日：2020-12-11

Applicant: AKZENTA PANEELE + PROFILE GMBH

Inventor： Hans-Jürgen Hannig

IPC: B41M7/00 ,  B05D3/06 ,  B05D5/12 ,  B41M5/00

Abstract: The present disclosure proposes a process for producing a structured antiwear film, comprising the process steps of: a. providing a base antiwear film, b. applying a formable outer paint layer to at least part of the area of the base antiwear film, c. at least partially structuring the outer paint layer by means of a digital printing process to create a structuring of the outer paint layer, and d. curing the outer paint layer such that the outer paint layer is first partly cured, wherein UV radiation with a wavelength in a range from ≥150 nm to ≤250 nm is used for the partial curing, and wherein the outer paint layer is then cured to completion, and wherein e. the outer paint layer, before being supplied to the printing unit for partially structuring the outer paint layer and/or during the printing operation for partially structuring the outer paint layer in the printing unit, is treated with means for changing the electrostatic charge of the outer layer, in that the outer layer is electrostatically discharged.

公开(公告)号：US20250065364A1

公开(公告)日：2025-02-27

申请号：US18811855

申请日：2024-08-22

Applicant: Hymmen GmbH Maschinen- und Anlagenbau

Inventor： René PANKOKE

IPC: B05C21/00 ,  B05C9/12 ,  B05C9/14 ,  B05D3/02 ,  B05D3/06 ,  B05D3/12

Abstract: A method of manufacturing at least one workpiece having a structured layer on a support member (1) is disclosed. The method comprises the following steps: step (S10): Providing the support member (1) having a liquid and curable layer (2) on a support member surface (7); step (S12): applying a masking agent (3) onto the layer (2) such that the masking agent (3) has a first layer thickness at a first location (4) on the layer (2) and that the masking agent (3) has a second layer thickness at a second location (5) on the layer (2), wherein the first layer thickness is greater than the second layer thickness; step (S14): curing the layer (2), wherein material of the layer (2) at the first location (4) below the masking agent (3) applied at the first location does not cure or cures less than material of the layer (2) at the second location (5) below the masking agent (3) applied at the second location; and step (S16): Removing uncured material of the layer (2) so that the cured material of the layer (2) forms the structured layer having a height profile on the support member (1). Furthermore, a device for carrying out the method is disclosed.

公开(公告)号：US12233434B2

公开(公告)日：2025-02-25

申请号：US18136106

申请日：2023-04-18

Applicant: UNIVERSITY OF DOHA FOR SCIENCE AND TECHNOLOGY ,  AUCKLAND UNISERVICES LIMITED

Inventor： Jamal Kurdi ,  Mohammed Farid

IPC: B05D3/06 ,  A61K9/50 ,  B01J13/16 ,  B82Y40/00

Abstract: A method of mercury-free photochemical micro-/nano-encapsulation of an active material is a process for obtaining micro-/nano-capsules by means of curing by UV LED radiation at ambient or even cold temperatures. A stirrer photo-reactor made from glass or transparent plastics can be used but mixed flow reactor could be also employed. Appropriate mixing is sufficient to expose all droplets, which contain an active material surrounded by curable-shell materials in the emulsion to the LED radiation. Using the optimum light intensities and reactions' times is critical for encapsulating the active material with a high efficiency and producing a high quality micro-/nano-capsules, Solar monochromator device can also be used as long as it generate the same radiation with a narrow/single wavelengths as the LED device. Light emitted diode (LED) is a mercury-free UV radiation source with a long operating life time and an instant ON-Off. it has a high efficiency, a very low cooling requirements and cost-efficient in photochemical encapsulation. It reduces the time of microencapsulation from 6 hours to a less than 5 minutes. It has a significant decrease in manufacturing cost, waste-water, unconverted monomers, and leftover active phase change material (PCM) compared to other methods. Conversion of more than 90% of monomers can be achieved, and encapsulation efficiency can reach 100% at optimum conditions. This is in addition to the ability of this invented technology for encapsulate volatile and heat sensitive active materials at ambient as well as low temperatures. Normal glass or transparent plastics can be used as a reactor material. Only the matched useful wavelength radiation is emitted by LED without having other wavelengths which might have a bad impact on the encapsulation process.

公开(公告)号：US20250058349A1

公开(公告)日：2025-02-20

申请号：US18802955

申请日：2024-08-13

Applicant: Ushio Denki Kabushiki Kaisha

Inventor： Yutaka OKUMURA ,  Kenji YAMAMORI ,  Ryo KOBAYASHI ,  Masato OZU

IPC: B05D3/06 ,  B05D1/32 ,  B05D5/02 ,  B05D7/14 ,  B08B7/00

Abstract: To provide a light treatment device that solves a problem caused by deflection of a housing. The light treatment device includes: a light source that irradiates a treatment object conveyed along a conveyance path with ultraviolet light; a housing having the light source therein and having an opening through which the treatment object is carried in or out; and a heat deflection reducer that reduces heat deflection of the housing surrounding the opening.

公开(公告)号：US20250041897A1

公开(公告)日：2025-02-06

申请号：US18717952

申请日：2022-12-09

Applicant: SWIMC LLC

Inventor： Jose Sergio AVILA SOTO ,  Brenda Janeth FERNANDEZ DIAZ

IPC: B05D1/28 ,  B05D3/02 ,  B05D3/06 ,  B05D5/06

Abstract: The present disclosure provides processes and systems for generating a coated article having a virtual embossing effect. A process comprises applying a wet layer of a coating composition on a substrate, the composition comprising a curable resin and a plurality of flake-form pigments; forming a pattern of the pigments in the wet layer; and curing the wet layer thereby forming a cured layer, wherein the formed pattern of the pigments is capable of remaining substantially unchanged after curing and results in a virtually embossed effect of the cured layer. A coating system comprises a substrate; a coating composition comprising a curable resin and a plurality of flake-forming pigments; means for applying a wet layer of the composition onto the substrate; means for forming a pattern of the pigments in the wet layer; and means for curing the wet layer to form a substantially cured layer. The cured article derived from the processes and systems preferably may have a substantially even surface.

公开(公告)号：US20250010329A1

公开(公告)日：2025-01-09

申请号：US18674793

申请日：2024-05-24

Applicant: GN Hearing A/S

Inventor： Thorvaldur Oli BODVARSSON ,  Kamila PIOTROWSKA

IPC: B05D1/02 ,  B05D3/06

Abstract: Disclosed is a method of at least partly encapsulating at least one component arranged on a substrate. The method comprises the step of dispensing at least one drop of a polymer on and/or around the component by jetting, using a nozzle, to obtain a dispensed polymer. The method further comprises at least partly curing the dispensed polymer by exposing the dispensed polymer to a light source to obtain a cured polymer. The method further comprises protecting the nozzle while at least partly curing the dispensed polymer, and repeating the steps of dispensing, at least partly curing and protecting, thereby at least partly encapsulating the component.

公开(公告)号：US12168244B2

公开(公告)日：2024-12-17

申请号：US17801481

申请日：2021-02-25

Applicant: Board of Regents, The University of Texas System

Inventor： Sidlgata V. Sreenivasan ,  Parth Pandya ,  David Choi ,  Shrawan Singhal ,  Lawrence Dunn

IPC: B05D3/14 ,  B05D3/06 ,  B29D11/00 ,  B32B37/00 ,  B41J2/01 ,  B82Y35/00 ,  G01B13/22

Abstract: A method and system for nanoscale precision programmable profiling on substrates. Profiling material is dispensed on a substrate or a superstrate. The superstrate is brought in contact with the substrate. The profiling material is then cured after bringing the superstrate in contact with the substrate. The superstrate is separated from the substrate after curing. An optical metrology of points on the substrate corresponding to the final substrate profile is then performed.