公开(公告)号：US20250088192A1

公开(公告)日：2025-03-13

申请号：US18825626

申请日：2024-09-05

Applicant: Northeastern University

Inventor： Aatmesh Shrivastava

IPC: H03L1/02 ,  G05F3/30 ,  H03M1/46

Abstract: Methods, systems, and computer products are presented herein for determining temperature using ultra-low power temperature sensing systems. An ultra-low power (ULP) temperature sensing system comprises a proportional to absolute temperature (PTAT) current source, a switched-capacitor converter electrically coupled to the PTAT current source, and a ULP analog-to-digital converter (ADC) electrically coupled to the PTAT current source and the switched-capacitor converter. The PTAT current source is configured to generate a PTAT current that varies with an operating temperature. The switched-capacitor converter is configured to generate an analog voltage signal based on the PTAT current. The ULP ADC is configured to output a digital voltage value corresponding to the analog voltage signal.

公开(公告)号：US20250007520A1

公开(公告)日：2025-01-02

申请号：US18884990

申请日：2024-09-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kihoon KANG ,  Hyungpil KUM ,  Donghwan SEO ,  Hyeonchang SON ,  Sejeong OH ,  Jinbae LEE ,  Kyeongmun JO

IPC: H03L1/02

Abstract: Provided in an embodiment of the present disclosure are a method and an apparatus for maintaining communication performance of an electronic device in correspondence with the internal temperature of the electronic device. The electronic device according to an embodiment of the present disclosure can comprise: a communication circuit; an oscillator set to generate a clock related to the communication circuit; a plurality of electronic components arranged in the vicinity of the oscillator; a plurality of temperature sensing devices each corresponding to each of the plurality of electronic components; and a processor. According to one embodiment, the processor can operate to: collect, from the plurality of temperature sensing devices, temperature data related to the plurality of electronic components; predict a temperature change related to the plurality of electronic components on the basis of the collected temperature data; determine, on the basis of the predicted temperature change, a reference electronic component to be referred to in the oscillator clock generation; and control the oscillator clock generation on the basis of temperature data on the determined reference electronic component.

公开(公告)号：US20240313792A1

公开(公告)日：2024-09-19

申请号：US18185325

申请日：2023-03-16

Applicant: QUALCOMM Incorporated

Inventor： Masoud MOSLEHI BAJESTAN ,  Arpit GUPTA ,  Wu-Hsin CHEN ,  Vinod PANIKKATH

IPC: H03L7/099 ,  H03L1/02 ,  H03L7/087

CPC classification number: H03L7/0992 ,  H03L1/021 ,  H03L7/087

Abstract: In certain aspects, a system includes a voltage-controlled oscillator (VCO), a phase detector configured to receive a reference signal, a frequency divider coupled between an output of the VCO and the phase detector, a phase-to-current circuit coupled to an output of the phase detector, and a temperature circuit configured to output a temperature-dependent voltage. The system also includes a switching circuit configured to selectively couple the phase-to-current circuit to an input of the VCO and configured to selectively couple the temperature circuit to the input of the VCO.

公开(公告)号：US12094553B2

公开(公告)日：2024-09-17

申请号：US17556363

申请日：2021-12-20

Applicant: Rambus Inc.

Inventor： Yohan U. Frans ,  Wayne F. Ellis ,  Akash Bansal

IPC: G11C7/22 ,  G01R23/02 ,  G06F13/16 ,  G11C8/18 ,  G11C29/02 ,  G11C29/50 ,  H03L1/02 ,  G01R23/15 ,  G01R35/00 ,  G06F1/08 ,  G06F1/12 ,  G06F11/16 ,  G11C7/04

CPC classification number: G11C29/50012 ,  G01R23/02 ,  G06F13/1689 ,  G11C7/22 ,  G11C7/222 ,  G11C7/225 ,  G11C8/18 ,  G11C29/023 ,  G11C29/028 ,  H03L1/02 ,  G01R23/15 ,  G01R35/005 ,  G06F1/08 ,  G06F1/12 ,  G06F11/1604 ,  G11C7/04 ,  G11C2207/2254

Abstract: The disclosed embodiments relate to components of a memory system that support timing-drift calibration. In specific embodiments, this memory system contains a memory device (or multiple devices) which includes a clock distribution circuit and an oscillator circuit which can generate a frequency, wherein a change in the frequency is indicative of a timing drift of the clock distribution circuit. The memory device also includes a measurement circuit which is configured to measure the frequency of the oscillator circuit.

公开(公告)号：US12088253B2

公开(公告)日：2024-09-10

申请号：US18181094

申请日：2023-03-09

Applicant: SEIKO EPSON CORPORATION

Inventor： Koichi Mizugaki

IPC: H03B5/32 ,  H03B1/02 ,  H03B5/04 ,  H03L1/02 ,  H03L1/04 ,  H05K1/11 ,  H05K1/18 ,  H10N30/88

CPC classification number: H03B5/32 ,  H03B1/02 ,  H03B5/04 ,  H03L1/028 ,  H03L1/04 ,  H05K1/111 ,  H05K1/181 ,  H10N30/88 ,  H05K2201/10083

Abstract: A circuit board includes: a semiconductor substrate including a first surface and a second surface located at an opposite side from the first surface; a circuit provided at a first surface side; a first external electrode provided at a second surface side; a heater provided at the second surface side; and a plurality of through electrodes penetrating the first surface and the second surface and electrically coupling the circuit and the first external electrode or the heater. The heater and the first external electrode do not overlap each other in a plan view.

公开(公告)号：US11990908B1

公开(公告)日：2024-05-21

申请号：US16807979

申请日：2020-03-03

Applicant: SiTime Corporation

Inventor： Aaron Partridge ,  Samira Zaliasl ,  Meisam Heidarpour Roshan ,  Sassan Tabatabaei

IPC: G01K7/32 ,  H03K3/03 ,  H03L1/02 ,  H03L7/099 ,  H03L7/18 ,  H03L7/197

CPC classification number: H03K3/0315 ,  G01K7/32 ,  H03L1/027 ,  H03L7/0991 ,  H03L7/18 ,  H03L7/1976

Abstract: In a high resolution temperature sensor, first and second MEMS resonators generate respective first and second clock signals and a locked-loop reference clock generator generates a reference clock signal having a frequency that is phase-locked to at least one of the first and second clock signals. A frequency-ratio engine within the MEMS temperature sensor oversamples at least one of the first and second clock signals with the reference clock signal to generate a ratio of the frequencies of the first and second clock signals.

公开(公告)号：US11949378B2

公开(公告)日：2024-04-02

申请号：US17897223

申请日：2022-08-29

Applicant: TXC Corporation

Inventor： Erh-Shuo Hsu ,  Wan-Lin Hsieh

IPC: H03L1/04 ,  H03B5/30 ,  H03B5/32 ,  H03L1/02

CPC classification number: H03B5/30 ,  H03L1/028 ,  H03L1/04

Abstract: A crystal oscillator and an oscillating device are provided. The crystal oscillator includes a resonator, a low-thermal conductivity glue, an integrated circuit chip, and a heating element. In the resonator, a crystal blank is hermetically encapsulated. The low-thermal conductivity glue wraps the resonator to suppress temperature variation in the resonator. The integrated circuit chip is disposed below the resonator, and the heating element is configured to supply heat to the resonator.

公开(公告)号：US11855646B2

公开(公告)日：2023-12-26

申请号：US17875882

申请日：2022-07-28

Applicant: SEIKO EPSON CORPORATION

Inventor： Yuichi Toriumi

IPC: H03L1/02

CPC classification number: H03L1/026 ,  H03L1/028

Abstract: A circuit device includes an oscillation circuit configured to generate an oscillation signal using a resonator, a temperature sensor circuit configured to output temperature detection data, a temperature compensation circuit configured to perform, based on the temperature detection data, temperature compensation on an oscillation frequency of the oscillation signal, a memory configured to store correction data for correcting the temperature detection data to obtain a temperature, and an interface circuit configured to output the temperature detection data and the correction data.

公开(公告)号：US11831314B1

公开(公告)日：2023-11-28

申请号：US17823655

申请日：2022-08-31

Applicant: Apple Inc.

Inventor： Simone del Cesta

IPC: H03L1/02 ,  G05F3/24 ,  H03K3/011 ,  H03K3/023 ,  H03K3/03

CPC classification number: H03K3/011 ,  G05F3/245 ,  H03K3/023 ,  H03K3/0315 ,  H03L1/022

Abstract: A ratiometric current source circuit having a reduced temperature dependence is disclosed. An embodiment of the current source circuit includes a first divider circuit configured to generate a reference voltage using a voltage level of a power supply node and a second divider circuit including a first resistor with a first temperature coefficient and a second resistor with a second temperature coefficient. The first resistor is configured to generate a first current using an input voltage and the voltage level of the power supply node and the second resistor is configured to generate a second current using the input voltage. The embodiment further includes a buffer circuit configured to generate the input voltage using the reference voltage and generate an output current using a difference between the first current and the second current.

公开(公告)号：US11750200B2

公开(公告)日：2023-09-05

申请号：US17624063

申请日：2020-06-19

Applicant: ZTE Corporation

Inventor： Jun Liu ,  Zhaobi Wei ,  Shan Wang ,  Pei Duan ,  Mengbi Lei

IPC: H03L7/081 ,  H03L7/08 ,  H03L7/10 ,  H03L1/02

CPC classification number: H03L7/081 ,  H03L1/02 ,  H03L7/0802 ,  H03L7/10

Abstract: Provided is a phase-locked loop circuit, a method for configuring the same, and a communication device. The phase-locked loop circuit includes a phase-locked loop main circuit and a phase temperature compensation circuit. The phase temperature compensation circuit includes at least one phase delay unit connected to the phase-locked loop main circuit and configured to generate a phase shift as a result of a temperature change for cancelling out a phase shift generated by the phase-locked loop main circuit as a result of a temperature change.