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    Ovenized MEMS
    1.
    发明申请
    Ovenized MEMS 有权

    公开(公告)号：US20250007455A1

    公开(公告)日：2025-01-02

    申请号：US18412695

    申请日：2024-01-15

    Applicant: SiTime Corporation

    Inventor： Carl Arft ,  Aaron Partridge ,  Markus Lutz ,  Charles I. Grosjean

    IPC: H03B5/04 ,  B81B3/00 ,  B81B7/00 ,  H01L23/00 ,  H01L23/31 ,  H01L23/34 ,  H03B5/30 ,  H03H9/08 ,  H03L1/04

    Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate-in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

    Crystal oscillator and oscillating device
    4.
    发明授权
    Crystal oscillator and oscillating device 有权

    公开(公告)号：US11949378B2

    公开(公告)日：2024-04-02

    申请号：US17897223

    申请日：2022-08-29

    Applicant: TXC Corporation

    Inventor： Erh-Shuo Hsu ,  Wan-Lin Hsieh

    IPC: H03L1/04 ,  H03B5/30 ,  H03B5/32 ,  H03L1/02

    CPC classification number: H03B5/30 ,  H03L1/028 ,  H03L1/04

    Abstract: A crystal oscillator and an oscillating device are provided. The crystal oscillator includes a resonator, a low-thermal conductivity glue, an integrated circuit chip, and a heating element. In the resonator, a crystal blank is hermetically encapsulated. The low-thermal conductivity glue wraps the resonator to suppress temperature variation in the resonator. The integrated circuit chip is disposed below the resonator, and the heating element is configured to supply heat to the resonator.

    Oscillator
    6.
    发明授权
    Oscillator 有权

    公开(公告)号：US11522496B2

    公开(公告)日：2022-12-06

    申请号：US17387172

    申请日：2021-07-28

    Applicant: SEIKO EPSON CORPORATION

    Inventor： Norihito Matsukawa ,  Manabu Kondo

    IPC: H03B5/32 ,  H03B5/04 ,  H03L1/04 ,  H01L41/053 ,  H03L1/02

    Abstract: An oscillator includes: an outer package; an inner package accommodated in the outer package and fixed to the outer package via a heat insulating member; a vibration element accommodated in the inner package; a temperature sensor; a first circuit element accommodated in the inner package and including an oscillation circuit configured to oscillate the vibration element and generate a temperature-compensated oscillation signal based on the temperature sensor; and a second circuit element fixed to the outer package and including a frequency control circuit configured to control a frequency of the oscillation signal.

    Integrated circuit device, resonator device, electronic device, and vehicle
    7.
    发明授权
    Integrated circuit device, resonator device, electronic device, and vehicle 有权

    公开(公告)号：US11005478B2

    公开(公告)日：2021-05-11

    申请号：US16257350

    申请日：2019-01-25

    Applicant: Seiko Epson Corporation

    Inventor： Hideo Haneda ,  Yasuhiro Sudo

    IPC: H03L1/04 ,  H03L1/02 ,  H03B5/32 ,  G06N3/04 ,  G06N3/08 ,  H03B5/04 ,  H03H7/00 ,  H03M1/12

    Abstract: An integrated circuit device includes first and second temperature sensors, an A/D conversion circuit that performs A/D conversion on first and second temperature detection voltages from the first and second temperature sensors and outputs first and second temperature detection data, a connection terminal that is electrically connected to a temperature detection target device of the first and second temperature sensors, and a digital signal processing circuit that performs digital calculation based on the first and second temperature detection data and performs a temperature compensation process of correcting temperature characteristics of the temperature detection target device.

    VIBRATION DEVICE, ELECTRONIC APPARATUS, AND VEHICLE
    8.
    发明申请
    VIBRATION DEVICE, ELECTRONIC APPARATUS, AND VEHICLE 有权

    公开(公告)号：US20210067093A1

    公开(公告)日：2021-03-04

    申请号：US17003091

    申请日：2020-08-26

    Applicant: SEIKO EPSON CORPORATION

    Inventor： Yusuke Matsuzawa

    IPC: H03B5/04 ,  H03B5/32 ,  H03L1/02 ,  H03L1/04

    Abstract: A vibration device includes: a first substrate including a first surface and a second surface located at an opposite side of the first surface, and a first integrated circuit disposed on at least one of the first surface and the second surface; a second substrate including a third surface bonded to the second surface, a fourth surface located at an opposite side of the third surface, a recess that opens to the third surface, and a second integrated circuit disposed on the fourth surface; and a vibration element accommodated in a space defined by an opening of the recess being closed by the first substrate.

    Resonators and devices with pixel based electrodes operating across a gap
    9.
    发明授权
    Resonators and devices with pixel based electrodes operating across a gap 有权

    公开(公告)号：US10931284B2

    公开(公告)日：2021-02-23

    申请号：US16405257

    申请日：2019-05-07

    Applicant: FOX ENTERPRISES, INC.

    Inventor： James Bryan Northcutt ,  Eugene S. Trefethen

    IPC: H03B5/34 ,  H03L1/02 ,  H01L41/047 ,  H03H9/19 ,  H03L1/04

    Abstract: A family of resonators and other devices which employ virtual electrodes using pixel based projection across a gap onto a material. In many embodiments, the pixels are projected onto a piezoelectric material, such as quartz crystal, by an integrated circuit die placed opposite a face of the crystal. The die projects individual pixels of electromagnetic energy onto the crystal, which vibrates and produces its own electromagnetic energy which is received by the pixels. Pixel projection onto other materials, including non-resonant materials, is also disclosed. The pixel based projected electrodes may be used in combination with, or in lieu of, conventional metal electrodes. Individual pixels may be turned on and off, and gain- and phase-controlled, in order to achieve specific desired resonator response characteristics. Many types of devices using pixel based electrode projection are disclosed—including resonators having one or more electrodes, oscillators, filters, delay lines, antennas and others.

    Oven controlled crystal oscillator
    10.
    发明授权
    Oven controlled crystal oscillator 有权

    公开(公告)号：US10855289B2

    公开(公告)日：2020-12-01

    申请号：US16676785

    申请日：2019-11-07

    Applicant: TXC CORPORATION

    Inventor： Wan-Lin Hsieh ,  Erh-Shuo Hsu ,  Shao-Po Sun ,  Sheng-Hsiang Kao ,  Yu-Shun Yen

    IPC: H03L1/02 ,  H03L1/04 ,  G01K13/00 ,  H01L23/34 ,  H05K1/18 ,  H05K1/02 ,  H05K1/03

    Abstract: An oven controlled crystal oscillator consisting includes a substrate, which includes a substrate, at least one base, a crystal blank, a first cover lid, an IC chip, a heat-insulating adhesive, a heater, and a second cover lid. The top of the base is provided with a cavity, and the top of the base is connected to the substrate through conductive wires without using solder. The crystal blank is mounted in the cavity. The first cover lid seals the cavity. The IC chip is mounted on the bottom of the base. The base is mounted on the substrate through the IC chip and the heat-insulating adhesive, and the IC chip is mounted to the bottom of the base. Alternatively, the IC chip and the base are horizontally arranged. The second cover lid is mounted on the top of the substrate.

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