Invention Patent
- Patent Title: POLYIMIDE AND HIGH TEMPERATURE ADHESIVE THEREOF
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Application No.: AU6717387Application Date: 1987-01-06
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Publication No.: AU579272B2Publication Date: 1988-11-17
- Inventor: TAMAI SHOJI , KAWASHIMA SABURO , SONOBE YOSHIHO , OHTA MASAHIRO , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO
- Applicant: MITSUI TOATSU CHEMICALS
- Assignee: MITSUI TOATSU CHEMICALS
- Current Assignee: MITSUI TOATSU CHEMICALS
- Priority: JP19302085 1985-09-03; JP2693686 1986-02-12
- Main IPC: C08G73/00
- IPC: C08G73/00 ; C08G73/10 ; C09J5/06 ; C09J179/08 ; C09J3/16
Abstract:
This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application.The polyimide has recurring units of the formula(where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).The polyimide can be prepared by reacting 2,6-bis(3--amino-phenoxy)pyridine with tetracarboxylic dianhydride in an organic solvent and imidizing resultant polyamic acid.Various tetracarboxylic dianhydrides can be used and particularly preferred are pyromellitic dianhydride and 3,3',4,4'--benzophenonetetracarboxylic dianhydride.
Public/Granted literature
- AU6717387A POLYIMIDE AND HIGH TEMPERATURE ADHESIVE THEREOF Public/Granted day:1988-07-07
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