POLYIMIDE AND HIGH TEMPERATURE ADHESIVE THEREOF
Abstract:
This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application.The polyimide has recurring units of the formula(where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).The polyimide can be prepared by reacting 2,6-bis(3--amino-phenoxy)pyridine with tetracarboxylic dianhydride in an organic solvent and imidizing resultant polyamic acid.Various tetracarboxylic dianhydrides can be used and particularly preferred are pyromellitic dianhydride and 3,3',4,4'--benzophenonetetracarboxylic dianhydride.
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