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    POLYMIDE RESIN COMPOSITION
    3.
    发明专利
    POLYMIDE RESIN COMPOSITION 未知

    公开(公告)号：CA1339823C

    公开(公告)日：1998-04-14

    申请号：CA568192

    申请日：1988-05-31

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OHTA MASAHIRO ,  KAWASHIMA SABURO ,  IIYAMA KATSUAKI ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO

    IPC: C08L79/08 ,  C08L81/04

    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention consist of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high-temperature engineering polymer. The polyimide consists of recurring units of the following formula: (see fig. I) wherein X is direct bond, thio radical, or o- or p-phenylene dicarbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, (see figs. II, III, IV and V) The high-temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: (see fig. I) aromatic polysulfone consisting of recurring units of the formula: (see fig. II) or aromatic polyetherimide consisting of recurring units of the formula: (see fig. III)

    POLYIMID GIESSLING
    4.
    发明专利
    POLYIMID GIESSLING 未知

    公开(公告)号：DE69027595D1

    公开(公告)日：1996-08-01

    申请号：DE69027595

    申请日：1990-12-21

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TAMAI SHOJI ,  OHTA MASAHIRO ,  YAMAGUCHI AKIHIRO - - ,  SARUWATARI MASUMI J-

    IPC: C08G73/10 ,  C08J5/18 ,  C08L79/08 ,  D01F6/74

    Abstract: A polyimide moulding (esp. fibre or film) contains repeating units (I); where Q1 and Q2 are aliphatic, alicyclic or aromatic (monocyclic or fused or unfused polycyclic) groups, Q1 being bivalent and Q2 tetravalent. At least 85% (molar) of (I) are units of formula (II) and 0.5-15% are units of formula (III), (IV) and/or (V). Specifically, R1 is 2-10C alkylene, -B-C6H4-A-, naphthylene, anthracenylene, -C6H4-X1-C6H4-, -C6H4-CMe2-C6H4-O-C6H4-Z1-C6H4-O-C6H4-CMe-C6H4-; A and B are 0-5C alkylene; X1 is a direct bond, CH2, CMe2, -C(CF3)2-, S, O, SO, SO2, CO, -O-C6H4-O-, -O-(p)C6H4-C6H4-(p)C6H4-O- or -O-(p)C6H4-Y1-(p)C6H4-O-; Y1 is a direct bond, CMe2, C(CF3)2, S, O, SO, SO2, CO, -CO-C6H4-CO-, -O-C6H4-O-, -O-C6H4-SO2-C6H4-O-, or -O-C6H4-CO-C6H4-O-; Z1 is a direct bond, CMe2, C(CF3)2, S, O, SO, SO2 or CO. R2 is e.g. (VI), (VII), etc. X2 is a direct bond, O, S, SO, SO2, CH2, CO, CMe2, C(CF3)2, -O-C6H4-O-, -CO-C6H4-CO- or -O-C6H4-Y2-C6H4-O-; Y2 is a direct bond, O, S, SO, SO2, CH2, CO, CMe2 or C(CF3)2.

    5.
    发明专利
    未知

    公开(公告)号：DE3855276D1

    公开(公告)日：1996-06-13

    申请号：DE3855276

    申请日：1988-10-21

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OHTA MASAHIRO ,  TAMAI SHOJI ,  KAWASHIMA SABURO ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO ,  NAKAKURA TOSHIYUKI ,  MASUDA MISAO ,  MARUKO CHIAKI ,  KOBA TOMOHITO ,  SAKAI HIDEO ,  KISHI SATORU

    IPC: C08G73/10 ,  C08K7/04 ,  C08L79/08 ,  C08K7/02

    Abstract: This invention relates to a method for preparing polyimide having good heat-stability and excellent flowability in a molten state. The polymide is prepared by reacting aromatic diamines such as 4,4 min -bis(3-aminophenoxy)biphenyl, bis[4-(3-aminophenoxy)phenyl] ketone and bis [4-(3-aminophenoxy)phenyl] sulfone; tetracarboxylic dianhydrides such as pyromellitic dianhydride, 3,3 min ,4,4 min -benzophenonetetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl) ether dianhydride; and dicarboxylic anhydrides such as glutaric anhydride, 1,2-hexanedicarboxylic anhydride, phthalic anhydride and 3,4-benzophenonedicarboxylic anhydride. The molar ratio of aromatic diamine : tetracarboxylic dianhydride : dicarboxylic anhydride is 1:(0.9 to 1.0):(0.001 to 1.0). Another invention relates to polyimide composite materials which are excellent in mechanical strengths and processability. The materials contain the polyimide and fibrous reinforcing materials such as yarn, roving, tow, fabrics, mats and felts of glass fiber, carbon fibers or aromatic polyamide fibers.

    POLYIMIDE RESIN COMPOSITION
    6.
    发明专利
    POLYIMIDE RESIN COMPOSITION 未知

    公开(公告)号：CA1338391C

    公开(公告)日：1996-06-11

    申请号：CA568654

    申请日：1988-06-03

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OHTA MASAHIRO ,  KAWASHIMA SABURO ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO ,  IIYAMA KATSUAKI

    IPC: C08L79/08

    Abstract: Resin composition composed of 99.9 to 50 % by weight of a polyimide having a repeating unit of the formula as defined below and 0.1 to 50 % by weight of an aromatic polyamideimide are improved in heat resistance and mechanical strength and have the inherent properties of polyimide; where X indicates a direct bond or is -S- or , and R is a tetravalent radical selected from the group consisting of aliphatic radicals having at least 2 carbon atoms, cycloaliphatic radicals, monocycloaromatic radicals and condensed polycycloaromatic radicals, and uncondensed polycycloaromatic radicals including aromatic radicals interconnected directly or through a cross-linkage.

    8.
    发明专利
    未知

    公开(公告)号：FI955175A0

    公开(公告)日：1995-10-30

    申请号：FI955175

    申请日：1995-10-30

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YOSHIDA YASUNORI ,  MIYAMOTO MICHIHIKO ,  OBUCHI SHOJI ,  IKEDA KAN ,  OHTA MASAHIRO

    IPC: C08G63/06 ,  C08G63/91 ,  C08G

    Abstract: The invention relates to a process for preparing a polyhydroxycarboxylic acid comprising conducting the dehydration polycondensation of a hydroxycarboxylic acid or an oligomer of the same in a reaction mixture containing said hydroxycarboxylic acid or the oligomer thereof and an organic solvent substantially in the absence of water to produce a polyhydroxycarboxylic acid having a weight average molecular weight of 50,000 or more, successively mixing and reacting the reaction mixture containing said polyhydroxycarboxylic acid with at least one linking reagent selected from the group consisting of (1) polyisocyanate compounds, (2) polybasic acid anhydrides, (3) cyclic imino esters, (4) cyclic imino ethers, (5) aromatic hydroxycarboxylic acids, (6) polyamino compounds, (7) polyhydric alcohols, (8) epoxy compounds, (9) polyfunctional aziridine compounds, (10) lactames, (11) lactones, and (12) diethylene glycol bischloroformates to obtain a polyhydroxycarboxylic acid having a weight average molecular weight of 100,000 or more. The polyhydroxycarboxylic acid obtained by the process of the invention has a weight average molecular weight of 100,000 or more and satisfactory mechanical strength in the form of molded articles and is useful as a degradable polymer for substituting medical materials and general purpose resins.

    9.
    发明专利
    未知

    公开(公告)号：DE69015158T2

    公开(公告)日：1995-08-03

    申请号：DE69015158

    申请日：1990-10-24

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMAYA NORIMASA ,  OHTA MASAHIRO ,  YAMAGUCHI AKIHIRO

    IPC: C08G73/12

    Abstract: Disclosed is a thermosetting resin composition which comprises a specific bismaleimide compound or polymaleimide and a specific aromatic diamine compound. It can be widely used for electrical and electronic parts, various structural parts, sliding parts and the like. The diamine is of formula The maleimide is the bismaleimide or the polymaleimide

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