Invention Patent
- Patent Title: EPITAXIAL SILICON LAYER AND METHOD TO DEPOSIT SUCH
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Application No.: CA2040660Application Date: 1991-04-17
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Publication No.: CA2040660CPublication Date: 1996-05-14
- Inventor: MEYERSON BERNARD STEELE
- Applicant: IBM
- Assignee: IBM
- Current Assignee: IBM
- Priority: US53121890 1990-05-31
- Main IPC: H01L21/205
- IPC: H01L21/205 ; H01L21/22 ; H01L21/331 ; H01L29/73 ; H01L29/737 ; H01L21/20 ; H01L21/223
Abstract:
An in-situ doped n-type silicon layer is provided by a low temperature, low pressure chemical vapor deposition process employing a germanium-containing gas in combination with the n-type dopant containing gas to thereby enhance the in-situ incorporation of the n-type dopant into the silicon layer as an electronically active dopant. Also provided are a silicon layer including a P-N junction wherein the layer contains an n-type dopant and germanium, and devices such as transistors incorporating an in-situ n-doped silicon layer.
Public/Granted literature
- CA2040660A1 EPITAXIAL SILICON LAYER AND METHOD TO DEPOSIT SUCH Public/Granted day:1991-12-01
Information query
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