An electrically conductive paste composition comprises an electrically conductive powder, a solvent and an organic binder comprising one or more monohydric phenol adduct compound selected from the group consisting of: (a) a monohydric phenol adduct of an unsaturated fatty acid, its metal salt or an unsaturated fatty acid ester, (b) a saturated or unsaturated fatty acid ester of said phenol adduct (a), (c) a sulfonation product of said phenol adduct (a) and (d) an amination product of said phenol adduct. It is applied to a resin article to provide an electric circuit having an improved adhesion.