The invention discloses a flip chip type LED chip. The flip chip type LED chip comprises a substrate, and an anode, an isolation region and a cathode which are sequentially arranged at a front face of the substrate along the horizontal direction, wherein the horizontal direction is parallel with the front face of the substrate, the vertical projection of the isolation region on the front face of the substrate is between vertical projections of the anode and the cathode on the front face of the substrate, and the center line of the isolation region on the horizontal direction and the vertical projection of a diagonal line of the flip chip type LED chip on the front face of the substrate are mutually overlapped. According to the flip chip type LED chip, the distance from the anode to the cathode can be made to be longest, the optimum welding effect can be realized when a traditional LED automatic chip die bonder is utilized for production, and thereby mutual conduction of the anode and the cathode can be avoided during packaging of flip chip LEDs, and the packaging yield rate of the flip chip LEDs is improved.