The invention discloses a photonasty resin composition, relating to the negative type photonasty resin composition. The photonasty comprises a first resin of the repeated unit which is expressed by a certain structure, a binder polymer of the second resin (A), a polymer compound (B), a Polyfunctional thiol compound with more than three functions (C), a photopolymerization initiator (D) and a solution (E). The first resin is mixed with the second resin according to a weight ratio of 50:50-90:10, so that the pattern having an excellent reaction and durance is formed under the low temperature curing condition.