One aspect of the invention relates to a power semiconductor module which includes a module housing (6) and a circuit carrier (2) having a dielectric insulation carrier (20) and an upper metallization layer (21) applied onto an upper side (20t) of the dielectric insulation carrier (20). A semiconductor component (1) is arranged on the circuit carrier (2). The power semiconductor module (5) also has an electrically conductive terminal block connected firmly and electrically conductively to the circuit carrier (2) and/or to the semiconductor component (1). The terminal block has a screw thread that is accessible from an outer side of the module housing (6).