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Invention Publication
CN105679728A 半导体装置 有权

半导体装置
Abstract:
本发明涉及半导体装置，提高半导体装置的放热特性。例如，半导体装置(PKG1)具有与搭载了成为热源的半导体芯片(CHP1)的芯片搭载部(TAB1)的第2部分(P2)连接的引线(LD1A(P2))以及与搭载了成为热源的半导体芯片(CHP1)的芯片搭载部(TAB1)的第3部分(P3)连接的引线(LD1A(P3))。并且，引线(LD1A(P2))与引线(LD1A(P3))分别具有从密封体(MR)突出的突出部分。由此，能够提高半导体装置(PKG1)的放热特性。
Abstract(English):

The invention relates to a semiconductor. A heat dissipation characteristic of the semiconductor device is enhanced. For example, a semiconductor device (PKG1) has a lead (LDIA (P2)) connected to a second portion (P2) of a chip mounting part (TAB1) on which a semiconductor chip (CHP1) to be a heat source is mounted and a lead (LDIA (P3)) connected to a third portion (P3) of the chip mounting part (TAB1) on which the semiconductor chip (CHP1) to be the heat source is mounted. Further, each of the leads (LDIA (P2,P3)) has a protruding portion protruding from a sealing member (MR). In this manner, it is possible to enhance a heat dissipation characteristic of the semiconductor device (PKG1).

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