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Invention Publication
CN105981188A 有机电子器件及其制造方法 有权

  • Patent Title: 有机电子器件及其制造方法
  • Patent Title (English): Organic electronic device and fabrication method therefor
  • Application No.: CN201480073196.5
    Application Date: 2014-06-03
  • Publication No.: CN105981188A
    Publication Date: 2016-09-28
  • Inventor: 车爀镇 , 柳美善
  • Applicant: 胡网加成公司
  • Applicant Address: 韩国忠清南道
  • Assignee: 胡网加成公司
  • Current Assignee: 胡网加成公司
  • Current Assignee Address: 韩国忠清南道
  • Agency: 北京市浩天知识产权代理事务所
  • Agent 刘云贵; 孙丽霞
  • Priority: 10-2014-0005500 2014.01.16 KR
  • International Application: PCT/KR2014/004973 2014.06.03
  • International Announcement: WO2015/108251 KO 2015.07.23
  • Date entered country: 2016-07-14
  • Main IPC: H01L51/00
  • IPC: H01L51/00
有机电子器件及其制造方法
Abstract:
本发明提供一种有机电子器件，包括：被布置有有机光电元件的基片，包裹所述有机光电元件，并含有无机或有机材料的第一层封装膜，包裹所述第一层封装膜，并含有具有烯不饱和键的光固化材料的固化物的第二层封装膜，和包裹所述第二层封装膜，并含有可光固化的旋涂玻璃(SOG)材料的固化物的第三层封装膜。
Abstract(English):

Provided is an organic electronic device comprising: a substrate in which an organic photoelectric device unit is arranged; a first encapsulation film that encloses the organic photoelectric device unit and contains an inorganic or organic material; a second encapsulation film that encloses the first encapsulation film and contains a cured product of a photo-curable material having an ethylenically unsaturated bond; and a third encapsulation film that encloses the second encapsulation film and contains a photo-cured product of a photo-curable spin on glass (SOG) material.

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