The invention relates to a laminate body, a composite body and a semiconductor device manufacturing method. The laminated body makes it possible to reduce cracking that would occur at the chip side face during dicing. The laminated body comprises a dicing sheet and a semiconductor backside protective film. The dicing sheet comprises a base layer and an adhesive layer arranged over the base layer. The semiconductor backside protective film is arranged over the adhesive layer. Tensile storage modulus of the semiconductor backside protective film following curing is not less than 1 GPa over the entire range 23 to 80 DEG C.