The application relates to a flexible device manufacturing method comprising the following steps: 1, preparing a first electrode layer on a base plate, and setting a channel in the first electrode layer; 2, preparing a first electrostriction material film on the first electrode layer, wherein the first electrostriction material film extends and is connected with the base plate through the channel; 3, forming a second electrode layer on the top surface of the first electrostriction material film; 4, forming a flexible substrate on the top surface of the second electrode layer, and forming a function device on the flexible substrate; 5, applying a first voltage between the first and second electrode layers, wherein the first voltage is bigger than the first electrostriction material film phase transition threshold-voltage, so the first electrostriction material film connected with the base plate can be deformed so as to at least partially disconnect from the base plate; 6, peeling off the first electrode layer and the first electrostriction material film from the base plate. The method is simple and feasible, can realize large area flexible substrate peeling, and can improve the flexible device making yield rate.