The invention provides a manufacturing method and manufacturing apparatus of a finger identification chip package structure. The manufacturing method of the finger identification chip package structure includes: providing a circuit carrier plate having a plurality of chip arrangement regions; arranging fingerprint identification chips in all the chip arrangement regions; electrically connecting the fingerprint identification chips to the circuit carrier plate; arranging a spacing member above the fingerprint identification chips, and allowing a plurality of spacing portions of the spacing member to press against fingerprint identification surfaces of the fingerprint identification chips; forming package colloid between the spacing member and the circuit carrier plate, allowing the package colloid to locally cover each fingerprint identification chip, and locally exposing each fingerprint identification surfaces; removing the spacing member; and cutting the package colloid and the circuit carrier plate along any two adjacent chip arrangement regions so as to acquire a plurality of fingerprint identification package structures. The manufacturing method and manufacturing apparatus of the finger identification chip package structure can improve the production yield.